Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2010
06/10/2010US20100140797 Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
06/10/2010US20100140100 Manufacturing method of printed circuit board
06/10/2010US20100139969 Printed circuit board comprising metal bump and method of manufacturing the same
06/10/2010US20100139967 Wiring board and fabrication method therefor
06/10/2010US20100139965 Embedded circuit substrate and manufacturing method thereof
06/10/2010US20100139962 Wiring board and method of manufacturing the same
06/10/2010US20100139955 Capacitive touch panel having dual resistive layer
06/10/2010US20100139400 Mechanical quantity sensor and method of manufacturing the same
06/10/2010US20100139090 Wiring board and manufacturing method of wiring board
06/10/2010US20100139089 Method and a device for assembling a chip on a substrate by providing a solder-forming mass
06/10/2010US20100139088 Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device
06/10/2010US20100139087 Microwave Device for Rapid Prototyping
06/10/2010US20100139085 Technique for reducing wasted material on a printed circuit board panel
06/10/2010DE112008001439T5 Verfahren zum Beschichten einer Verdrahtungsplatte, sowie Verdrahtungsplatte A method for coating a wiring board and wiring board
06/10/2010DE102008061051A1 Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
06/10/2010DE102008044379A1 Electrical circuit producing method for high-performance application, involves providing wire that extends to separation point provided in separation surface, where electrical contact point in surface is provided at separation point
06/09/2010EP2194766A1 Ceramic multilayer substrate
06/09/2010EP2194765A1 Reflow furnace
06/09/2010EP2194764A1 Method for generation of electrically conducting surface structures, apparatus therefor and use
06/09/2010EP2194575A2 Substrate Dividing Method
06/09/2010EP2194572A1 Electronic component part device
06/09/2010EP2194548A2 Electronic network components and component networks utilizing biocompatible conductive adhesives for direct body fluid exposure
06/09/2010EP2193823A2 Passsive electronic network components designed for direct body fluid exposure
06/09/2010EP2193696A1 High thermal performance packaging for optoelectronics devices
06/09/2010EP2193539A1 Carrier chip with cavity
06/09/2010EP2047715B1 Resistor assembly and method for producing said assembly
06/09/2010EP1731007B1 Multilayer printed circuit board and method for the production thereof
06/09/2010CN201503855U Device for carrying out quantitative automatic glue injection, vacuum exhaust and glue filling on electronic devices
06/09/2010CN201501003U Board cutting device
06/09/2010CN1976561B Process for producing printed board having cable portion
06/09/2010CN1961389B Inductor
06/09/2010CN1953150B Method of making a circuitized substrate having a plurality of solder connection sites thereon
06/09/2010CN1945429B Photosensitive resin composition and photosensitive resin laminate using the same
06/09/2010CN1938923B Surface mounting type vibrating motor and portable communication equipment having the same
06/09/2010CN1925209B Minus magnetism conducting rate material constituted of branch shape structural unit
06/09/2010CN1906982B Molded abrasive brush and methods of manufacture of printed circuit boards
06/09/2010CN1816251B Method of forming periphery of substrate
06/09/2010CN1703327B Method of stripping silver from a printed circuit board
06/09/2010CN1625788B Electrical devices and process for making such devices
06/09/2010CN1602652B Substrate cleaner
06/09/2010CN101730924A Drying apparatus and method for silicon-based electronic circuits
06/09/2010CN101730461A Aligning method used for welding BGA chip
06/09/2010CN101730456A Circuit board of communication product and manufacture method thereof
06/09/2010CN101730398A Printed circuit board and method for producing same
06/09/2010CN101730397A Structure and production method of multilayer stereo circuit
06/09/2010CN101730396A Manufacturing method of layer increasing circuit board for increasing circuit density and layer increasing circuit board structure
06/09/2010CN101730395A Circuit board manufacturing method through coverage
06/09/2010CN101730394A Process method for plug-in mounting connector on circuit board
06/09/2010CN101730393A Fixed structure, light-emitting assembly and display device using the same
06/09/2010CN101730392A Manufacture method of a flexible circuit base-plate and a flexible circuit base-plate
06/09/2010CN101730391A Microetching method of circuit board for preventing galvanic corrosion effect
06/09/2010CN101730390A Manufacturing method of metal plating
06/09/2010CN101730389A Method for manufacturing single-side hollow out flexible circuit board
06/09/2010CN101730388A Circuit board and manufacturing method thereof
06/09/2010CN101730387A PCB jointed board clamp
06/09/2010CN101730386A Manufacturing method of circuit board fine line
06/09/2010CN101730385A Circuit board structure
06/09/2010CN101730382A Connecting structure for circuit board and electronic component
06/09/2010CN101730380A Circuit board structure
06/09/2010CN101730378A Component built-in circuit substrate and method of producing the same
06/09/2010CN101730377A Coupling layer and printed circuit board with same
06/09/2010CN101728692A Connector protective cover and circuit board module thereof
06/09/2010CN101728672A Circuit board module and connecting interface thereof
06/09/2010CN101728638A Ceramic antenna for notebook computer and method for producing same
06/09/2010CN101728355A Guide hole structure of multilayer substrate and manufacturing method thereof
06/09/2010CN101728354A Electronic device and manufacturing method for electronic device
06/09/2010CN101724875A Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
06/09/2010CN101722427A Tool positioning device
06/09/2010CN101426345B Circuit board manufacturing method and construction thereof
06/09/2010CN101355855B Method for directly silk-printing and shaping embedding resistance on a printed circuit board using stainless steel net
06/09/2010CN101340775B Flexible circuit board and manufacturing method thereof
06/09/2010CN101299905B Circuit board and manufacturing method thereof
06/09/2010CN101288349B Process for producing multilayer wiring board
06/09/2010CN101283631B Method for manufacturing printed wiring board
06/09/2010CN101263752B Method for manufacturing component incorporating module and component incorporating module
06/09/2010CN101252815B Solder tray local tin plating method on circuit board
06/09/2010CN101232777B Printed circuit board
06/09/2010CN101232775B Printed circuit board and method for producing the printed circuit board
06/09/2010CN101228000B Water-soluble preflux and use thereof
06/09/2010CN101197361B Power module and method of manufacturing the same
06/09/2010CN101194547B Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
06/09/2010CN101170897B No empty hole installation method for installing electronic components
06/09/2010CN101166399B Circuit board cleaner
06/09/2010CN101160022B Filling coated material for lamination of flexible circuit board and laminating technique of flexible circuit board
06/09/2010CN101122569B Method of setting reference data for inspection of solder fillets and substrate outer appearance inspection device
06/09/2010CN101080137B Multilayer printed circuit board and liquid crystal display unit
06/09/2010CN101018447B Circuit base board, its encapsulation structure, and making method of the encapsulation structure
06/09/2010CN101009973B Resin composite copper foil, printed wiring board, and production process thereof
06/08/2010US7733456 Liquid crystal display device having contact structure and method of fabricating the same
06/08/2010US7732732 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
06/08/2010US7732260 Semiconductor device power interconnect striping
06/08/2010US7732003 Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
06/08/2010US7732002 transferring tape composition, containing metal precursor, from carrier of glass or polymeric substrate in a pattern of features; and heating transferred tape composition to a temperature of not greater than about 200 degrees C. to convert tape composition to a conductive feature; low-temperature
06/08/2010US7731831 Method for manufacturing a composite material including copper foil and support layer
06/08/2010US7731688 Warming apparatus with heater produced by PCB
06/08/2010US7731336 Inkjet nozzle arrangement
06/08/2010US7731334 Inkjet nozzle utilizing electrostatic attraction between parallel plates
06/08/2010US7731166 Universal insert support for holding and positioning parts of complex shapes
06/08/2010US7730612 Method of manufacturing component-embedded printed circuit board
06/08/2010US7730611 High capacity pick and place process
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