Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2010
06/23/2010CN101395710B Mounting method, board with electrical component, and electrical apparatus
06/23/2010CN101351088B Inside imbedded type line structure and technique thereof
06/23/2010CN101341808B Method for manufacturing ceramic multilayer substrate
06/23/2010CN101325839B Method for assembling electronic part and locating structure thereof
06/23/2010CN101318399B Screen printing equipment
06/23/2010CN101299908B Method for manufacturing printed circuit board having embedded component
06/23/2010CN101265577B Quick assembling and maintenance type vertically conveyed lamella etching conveyer device
06/23/2010CN101246406B Electronic equipment
06/23/2010CN101218861B Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit
06/23/2010CN101184363B Printed circuit board having embedded resistors and method of manufacturing the same
06/23/2010CN101171895B Printed wiring board
06/23/2010CN101150915B Alloy circuit board and manufacturing method thereof
06/23/2010CN101123846B Blind hole structure of printed circuit board and its manufacturing method
06/23/2010CN101106872B Printed wiring board and method of producing the same
06/23/2010CN101052279B Method of manufacturing terminal set of circuit basic plate
06/22/2010US7742843 Method for the structured application of a laminatable film to a substrate for a semiconductor module
06/22/2010US7741013 photocurable photosensitive layer; image pattern using actinic radiation; adhesion promoter is oxalic acid catalyzed alkyl t-butyl/amyl phenolic resin; recovering thick film from a used sheet
06/22/2010US7740790 Method of making liquid crystal polymer films
06/22/2010US7740713 Flux composition and techniques for use thereof
06/22/2010US7740180 Method for making smart cards capable of operating with and without contact
06/22/2010US7739790 Electron-emitting device manufacturing method, electron source manufacturing method, image-forming apparatus manufacturing method, and information displaying and playing apparatus manufacturing method
06/22/2010US7739789 Method for forming surface graft, conductive film and metal patterns
06/22/2010CA2399027C Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
06/17/2010WO2010068104A1 Method for electric circuit deposition
06/17/2010WO2010067977A2 Method for manufacturing a printed circuit board
06/17/2010WO2010067911A1 Spring manufacturing method and spring with the same
06/17/2010WO2010067731A1 Wiring board and method for manufacturing same
06/17/2010WO2010067508A1 Multilayer substrate and method for manufacturing same
06/17/2010WO2010067502A1 Method for designing electronic system
06/17/2010WO2010067283A1 Textile carrier for electrically addressing an electronic component in an electronic textile
06/17/2010WO2010067273A1 Flexible modular assembly
06/17/2010WO2010067042A1 Method and apparatus for laser machining relatively narrow and relatively wide structures
06/17/2010WO2010066002A1 Method and apparatus for reflow soldering
06/17/2010WO2010027206A3 Jig-integrated metal mask and a production method therefor
06/17/2010WO2009118455A9 Method for manufacturing laminated circuit board
06/17/2010US20100152877 Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
06/17/2010US20100151703 Edge connector and manufacturing method therefor
06/17/2010US20100151120 Method for making conductive wires
06/17/2010US20100149777 Electronic circuit connection structure and its manufacturing method
06/17/2010US20100149775 Tape circuit substrate with reduced size of base film
06/17/2010US20100149768 Electronic component built-in substrate and method of manufacturing the same
06/17/2010US20100149766 System And Method For Assembly Of A Processor And Socket On An Information Handling System Printed Circuit Board
06/17/2010US20100149763 Controller, in particular for motor vehicle transmissions
06/17/2010US20100148654 Substrate, fabrication method thereof and a display using the same
06/17/2010US20100148369 Wire bonding method and semiconductor device
06/17/2010US20100148352 Grid array packages and assemblies including the same
06/17/2010US20100148339 Process for fabricating a semiconductor component support, support and semiconductor device
06/17/2010US20100148334 Intergrated circuit package support system
06/17/2010US20100147958 Method for producing a device comprising a transponder antenna connected to contact pads and device obtained
06/17/2010US20100147576 Laminated wiring board and method for manufacturing the same
06/17/2010US20100147573 Circuit substrate, circuit module and method for manufacturing the circuit substrate
06/17/2010US20100147570 Circuit substrate and circuit substrate manufacturing method
06/17/2010US20100147559 Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
06/17/2010US20100147558 Anchor pin lead frame
06/17/2010US20100146782 Miniature circuitry and inductive components and methods for manufacturing same
06/17/2010US20100146781 Method in manufacturing of circuit boards
06/17/2010US20100146780 Method for packaging circuits and packaged circuits
06/17/2010US20100146779 Method of manufacturing component-embedded printed wiring board
06/17/2010US20100146778 Production method for electronic chip component
06/17/2010US20100146777 Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby
06/17/2010DE112008002148T5 Vorrichtung zum dreidimensionalen Messen und Leiterplatinen-Untersuchungsvorrichtung Apparatus for measuring three-dimensional and printed circuit boards inspection apparatus
06/17/2010DE112008001956T5 Mehrschichtkeramiksubstrat und Verfahren zum Herstellen desselben Of the same multi-layer ceramic substrate and method for producing
06/17/2010DE112004002603B4 Verfahren und Vorrichtung zum Löten von Bauteilen auf Leiterplatten mittels Lotformteilen Method and apparatus for soldering components onto printed circuit boards by means of solder preforms
06/17/2010DE10228373B4 Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte A method for making an electrical connection between components of a smart card
06/17/2010DE102008062575A1 Multilayer printed circuit board for use in e.g. rotor of linear electric motor, has intermediate storages arranged between top layer and bottom layer, and sensor directly soldered on one of intermediate storages
06/17/2010DE102008048239A1 Verifying soldering results, comprises placing a contact element on a surface of a carrier, melting a soldering material, and characterizing the soldering result under the formation of quality results after completing the soldering process
06/16/2010EP2197253A1 Method for electric circuit deposition
06/16/2010EP2197252A2 Scalable camera contact block, method for producing the camera contact block and method for installing, in particular a SMD camera in the housing of a mobile telephone
06/16/2010EP2196514A1 Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
06/16/2010EP1941789B1 Flexible printed circuit and method for manufacturing the same
06/16/2010EP1714320B1 Conductive material compositions, apparatus, systems, and methods
06/16/2010EP1644953B1 Filling vias with thick film paste using contact printing
06/16/2010CN201509385U Heat radiator with automatic extension contraposition
06/16/2010CN201509373U Reflux brazier circuit board guiding device
06/16/2010CN201509372U Magnetic carrying tool
06/16/2010CN201509371U Oven for printed circuit board
06/16/2010CN201509370U Connecting assembly with plug-in unit
06/16/2010CN201509368U Internal layer circuit conducting structure of circuit board
06/16/2010CN201505783U Reflux brazier air outlet board
06/16/2010CN201505782U Soldering jetting device
06/16/2010CN201505781U Reflux brazier heating device
06/16/2010CN201505779U Welding device for crest welder
06/16/2010CN201505778U Soldering tin hot air leveling device
06/16/2010CN201505777U Heat transmission device
06/16/2010CN1972566B Flow tray, solder flow device and soldering method
06/16/2010CN1961259B Fabrication and use of superlattice
06/16/2010CN1958844B Method for etching non-conductive substrate surfaces
06/16/2010CN1957322B Interchangeable graphics card for a computing device
06/16/2010CN1942058B Method for inspecting hand inserted component
06/16/2010CN1899750B Solder metal, soldering flux and solder paste
06/16/2010CN1897788B Reinforced film for flexible printing circuit board
06/16/2010CN1890144B Railway beacon and related production method
06/16/2010CN1886034B Printed circuit board using convex point and manufacturing method thereof
06/16/2010CN1860258B Method of preparing printed or daubed image and printed or daubed image element by it
06/16/2010CN1853451B Method for manufacturing an electronic module
06/16/2010CN1849180B Deposition and patterning process
06/16/2010CN1836472B Printed wiring board and method of producing the same
06/16/2010CN1820889B Layered structure of lead free solder composition
06/16/2010CN1814357B Method and device for board processing
06/16/2010CN1744797B Circuit wiring forming method
1 ... 245 246 247 248 249 250 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 ... 1185