Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2010
08/11/2010CN101803483A Process for producing multilayer printed wiring board
08/11/2010CN101803482A Wiring board and manufacturing method thereof
08/11/2010CN101803481A Wiring board and its manufacturing method
08/11/2010CN101803480A Wiring board and manufacturing method thereof
08/11/2010CN101803479A Method for fabricating electrical bonding pads on a wafer
08/11/2010CN101803478A Illumination device and method for the production thereof
08/11/2010CN101803034A Method for producing a solar cell
08/11/2010CN101802710A Photosensitive resin composition and laminate thereof
08/11/2010CN101802261A Multilayer printed wiring boards with holes requiring copper wrap plate
08/11/2010CN101802118A Adhesive composition and bonded body
08/11/2010CN101801886A Component having a ceramic base the surface of which is metalized
08/11/2010CN101801667A Screen printing apparatus
08/11/2010CN101801589A In-containing lead-free solder for on-vehicle electronic circuit
08/11/2010CN101801588A Lead-free solder for vehicle, and in-vehicle electronic circuit
08/11/2010CN101801158A Plug-in short kettle opening
08/11/2010CN101801157A Single open-type semienclosed spout
08/11/2010CN101801156A Method for manufacturing flexible printed circuit board and structure thereof
08/11/2010CN101801154A Circuit board
08/11/2010CN101798438A Heat curable resin composition, dry film and printed wiring board and method for preparing the same
08/11/2010CN101798432A Curable resin composition and printed circuit board and reflection board using same
08/11/2010CN101483980B Combined surface processing method for firm-flexible combined circuit board
08/11/2010CN101325845B Multilayer printed circuit board and method of fabricating the same
08/11/2010CN101188916B Method for making flexible circuit board with differential break structure
08/10/2010US7773386 Flexible substrate, multilayer flexible substrate
08/10/2010US7772684 Electronic device and production method thereof
08/10/2010US7771779 Heating a substrate coated with a curable polymer and a glass transition suppression modifier to greater than the glass transition temperature but less than the curing temperature; and heat curing the layer to form a substrate with percent planarization at 100 micrometers of greater than fifty percent.
08/10/2010US7771561 Apparatus and method for surface treatment to substrate
08/10/2010US7771559 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
08/10/2010US7771547 Intermetallics homogeneity distributed in solder matix; melting, cooling; high strength joints, aging resistance
08/10/2010US7771210 Connector with wipe
08/10/2010US7771018 Ink ejection nozzle arrangement for an inkjet printer
08/10/2010CA2490794C Bus bar substrate for interior light of vehicle
08/05/2010WO2010088499A2 Crimped solder on a flexible circuit board
08/05/2010WO2010087996A1 Printed circuit assembly
08/05/2010WO2010087455A1 Mesh member for screen printing
08/05/2010WO2010087433A1 Apparatus for inspecting through hole
08/05/2010WO2010087374A1 Jet solder bath
08/05/2010WO2010087343A1 Drive controller, jet solder tank, and automatic soldering device
08/05/2010WO2010087342A1 Automatic soldering device and carrier device
08/05/2010WO2010087341A1 Jet solder bath
08/05/2010WO2010087268A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using same
08/05/2010WO2010087241A1 Lead-free solder alloy, fatigue-resistant soldering materials containing the solder alloy, and joined products using the soldering materials
08/05/2010WO2010086593A1 Reflow soldering in an apparatus comprising an sma actuator arrangement
08/05/2010WO2010086511A1 Method for creating a substrate for printed or coated functionality, substrate, functional device and its use
08/05/2010WO2010086504A1 Structures comprising high aspect ratio molecular structures and methods of fabrication
08/05/2010WO2010085830A1 Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
08/05/2010WO2010051972A3 Diagnostic device with display module and leveraged component connections background
08/05/2010US20100199240 Parallel Electronic Design Automation: Shared Simultaneous Editing
08/05/2010US20100198038 Electrode sheet and process for producing electrode sheet
08/05/2010US20100195363 Multiple layers of memory implemented as different memory technology
08/05/2010US20100195299 Integrated multicomponent device in a semiconducting die
08/05/2010US20100195291 Electronic circuit module and method of manufacturing the same
08/05/2010US20100194645 Tear-proof circuit
08/05/2010US20100194498 Multilayer electronic component and multilayer electronic component manufacturing method
08/05/2010US20100193970 Micro pin grid array with pin motion isolation
08/05/2010US20100193912 Methods and apparatus for the manufacture of microstructures
08/05/2010US20100193573 Method of Improving the Solderability of a Printed Circuit Board
08/05/2010US20100193467 Method for the treatment and reuse of a stripper solution
08/05/2010US20100193366 Method For Electrochemical Fabrication
08/05/2010US20100193233 Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, and air-conditioner
08/05/2010US20100193232 Printed circuit board and method of manufacturing the same
08/05/2010US20100193229 Barrier layer to prevent conductive anodic filaments
08/05/2010US20100192372 Method of disposing electronic device on electrode formed on substrate to connect electrically the electronic device and the electrode
08/05/2010US20100192371 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
08/05/2010US20100192361 Low cost electrical terminals manufactured from conductive loaded resin-based materials
08/05/2010DE102008048239B4 Verfahren zum Prüfen eines Lötergebnisses Method for testing a soldering result
08/05/2010DE102005032804B4 Mehrschichtstruktur zum Aufnehmen einer elektronischen Schaltung Multi-layer structure for picking up an electronic circuit
08/04/2010EP2214461A1 Substrate with semiconductor element mounted thereon
08/04/2010EP2214460A1 Wiring board receiving plate, and device and method for connection of wiring board using same
08/04/2010EP2214202A2 Metal-ceramic circuit board
08/04/2010EP2214201A1 Process for producing substrate for power module, substrate for power module, and power module
08/04/2010EP2214178A1 Process for producing transparent electroconductive member
08/04/2010EP2213454A2 Substrate supporting device and screen printer
08/04/2010EP2213148A2 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
08/04/2010EP1933588B1 Sound transmitting membrane, electronic part with sound transmitting membrane, and process for producing circuit board having the electronic part mounted thereon
08/04/2010EP1832147B1 Wiring method and device
08/04/2010CN201541396U Welding device for fixing LED height
08/04/2010CN201541395U Through-hole component assembly improving OSP printed circuit board wave-soldering
08/04/2010CN201541394U PCB plate positioning exposure apparatus
08/04/2010CN201541393U Adjustable hot-pressing vehicle
08/04/2010CN201537674U Terminal positioning and riveting device of printed board for military bus coupler
08/04/2010CN1989503B Method for optimizing high frequency performance of via structures
08/04/2010CN1988761B Binding method for lifting soft-solid synthetic printed circuit board via hole trust degree
08/04/2010CN1975948B Sheet capacitor
08/04/2010CN1972559B Hybrid multilayered circuit board and its manufacturing method
08/04/2010CN1660598B Ink jet printable thick film ink compositions and processes
08/04/2010CN101796896A Device and method for mounting an electronic component
08/04/2010CN101796895A Method for the hot embossing of at least one conductor track onto a substrate and substrate comprising at least one conductor track
08/04/2010CN101796217A Process for producing metal film, primer composition, metal film and use of the metal film
08/04/2010CN101796147A Ink composition
08/04/2010CN101795543A Method for manufacturing gold finger
08/04/2010CN101795542A Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, and air-conditioner
08/04/2010CN101795541A Pressing device
08/04/2010CN101795540A Universal carrier for surface-mounting equipment
08/04/2010CN101795539A Method for processing inductor-embedded circuit board
08/04/2010CN101795538A Method and device for automatically aligning and cutting pins of electronic element
08/04/2010CN101795537A Solder mask printing technology of microwave high-frequency circuit board
08/04/2010CN101795536A Method and device for processing PCB ( Printed Circuit Board) made of PTFE ( Polytetrafluoroethylene) material
08/04/2010CN101795535A Plughole machine for optional ink plughole and easy grinding
08/04/2010CN101795534A Drilling liner plate of circuit board
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