Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2010
07/08/2010US20100170086 Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrate
07/08/2010US20100170085 Method for producing an electronic subassembly
07/08/2010DE102009004130A1 Mehrschichtiges Folienelement The multilayer film element
07/08/2010DE102008063312A1 Vorabgleichbare SMD-Spulen für hohe Ströme Vorabgleichbare SMD coils for high currents
07/07/2010EP2205053A1 Printed circuit card and process for producing such a card
07/07/2010EP2205052A1 Circuit connecting method
07/07/2010EP2204824A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
07/07/2010EP2204080A1 Electrical component mounting assemblies
07/07/2010EP2204079A2 Asymmetric dielectric films
07/07/2010EP1633516B1 Rotary tool holder assembly and method of its production
07/07/2010EP1595138B1 Image recognition apparatus and image recognition method
07/07/2010CN201523513U Adjustment seat
07/07/2010CN201523491U 自动张紧装置 Automatic tensioning device
07/07/2010CN201523490U Automatic expansion device
07/07/2010CN201523489U Wave-soldering welding equipment
07/07/2010CN201523488U One-way heating reflow welding machine
07/07/2010CN201523487U Para-position adjusting and supporting mechanism used in BGA precise vision bonding system
07/07/2010CN201523486U Carrier plate
07/07/2010CN201523485U Leg-twisting device
07/07/2010CN201523484U Reactive ion etching device for removing local paint on printed circuit board
07/07/2010CN201523483U Circuit board printing device
07/07/2010CN201523482U Pressure foot device of substrate forming machine
07/07/2010CN201519826U Cooling device
07/07/2010CN201519822U Temperature control system used for adjusting large temperature difference of reflow welding machine
07/07/2010CN201519819U Double-wave generator driven by single motor
07/07/2010CN201519818U Jet flow plate
07/07/2010CN1947462B Variable watt density layered heater
07/07/2010CN1846994B Printing apparatus
07/07/2010CN101772995A Multilayer wiring element having pin interface
07/07/2010CN101772994A Multilayer ceramic substrate and method for manufacturing the same
07/07/2010CN101772993A Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
07/07/2010CN101772526A Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
07/07/2010CN101772280A Mesh screen plughole process method
07/07/2010CN101772279A Method for manufacturing PCB plate with blind holes
07/07/2010CN101772278A PCB (Printed Circuit Board) screen printing taphole process, screen printing taphole screen plate and manufacture method thereof
07/07/2010CN101772277A Apparatus for and method of coating flux with a movable nozzle
07/07/2010CN101772276A Method for installing press key in printed circuit board
07/07/2010CN101772275A Method for fixing magnetic core in PCB (Printed Circuit Board) taphole
07/07/2010CN101772274A Method for electroplating surface of circuit substrate
07/07/2010CN101772273A Base plate structure and manufacture method thereof
07/07/2010CN101772272A Design technique for internal layer plate edge of multi-layer printing circuit board
07/07/2010CN101772271A Method for single-sided lamination reinforcement of flexible printed circuit board
07/07/2010CN101772270A Preprocessing method for image transfer of flexible PCB (printed circuit board)
07/07/2010CN101772269A PCB (Printed Circuit Board) processing method
07/07/2010CN101772268A Technology for aligning circuit board by PIN nail
07/07/2010CN101772267A Improvement method for wrinkled copper foil in compacting process of high-rise plates
07/07/2010CN101772266A Pin shearing device of flat reed pipe
07/07/2010CN101772265A Novel bonding method of functional module and functional module thereof
07/07/2010CN101772264A Induction type printed circuit board and processing technique thereof
07/07/2010CN101772263A Embedded capacitance printed circuit board and production method thereof
07/07/2010CN101772262A Welding structure of circuit board as well as method and jig thereof
07/07/2010CN101772261A Multilayered printed wiring board
07/07/2010CN101772259A Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
07/07/2010CN101772258A Electronic device and high-frequency circuit board thereof
07/07/2010CN101772255A Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same
07/07/2010CN101770994A Semiconductor package substrate with metal bumps
07/07/2010CN101770959A Rigid-flex module and manufacturing method
07/07/2010CN101768386A Ink and method adopting ink to prepare conductive line
07/07/2010CN101768357A Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product
07/07/2010CN101767239A Solder bath and method of heating solder contained in a solder bath
07/07/2010CN101767079A Plate loading machine, circuit board production system and method for manufacturing base plate
07/07/2010CN101415297B Printed plate component and method of processing the same
07/07/2010CN101167415B Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
07/07/2010CN101107892B Multilayer printed wiring board
07/07/2010CN101084083B Solder precoating method and work for electronic device
07/06/2010US7750765 Compact via transmission line for printed circuit board and design method of the same
07/06/2010US7750475 Smooth surfaces; shrinkage inhibition; alloy containing silver, copper, iron and cobalt
07/06/2010US7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
07/06/2010US7750457 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
07/06/2010US7749813 Circuit board for direct flip chip attachment
07/06/2010US7749684 photocatalysts; colloids; waste treatment
07/06/2010US7749612 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
07/06/2010US7749611 peel strength enhancement coating consists essentially of a metal and metal oxide mixture formed from one or more of: vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, technetium, and rhenium
07/06/2010US7749610 Copper foil and method of manufacturing the same
07/06/2010US7749605 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
07/06/2010US7748114 Method of forming conductive pattern
07/06/2010US7748113 Electronic component mounting method
07/06/2010US7748112 Component mounting apparatus and component mounting method
07/06/2010US7748111 Manufacturing process of a carrier
07/06/2010US7748110 Method for producing connection member
07/06/2010CA2449849C Soldering flux vehicle additive
07/01/2010WO2010075447A1 Chip packages with power management integrated circuits and related techniques
07/01/2010WO2010074736A1 Printed electronic circuit boards and other articles having patterned conductive images
07/01/2010WO2010074121A1 Method for manufacturing printed wiring board
07/01/2010WO2010074085A1 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device
07/01/2010WO2010074072A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
07/01/2010WO2010074061A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
07/01/2010WO2010074054A1 Method for forming electronic circuit
07/01/2010WO2010073981A1 Curable composition
07/01/2010WO2010073903A1 Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material
07/01/2010WO2010073891A1 Acf attachment device and display device manufacturing method
07/01/2010WO2010073882A1 Method for producing multilayer wiring substrate
07/01/2010WO2010073831A1 Multilayer circuit board and method for manufacturing same
07/01/2010WO2010073816A1 Method for producing multilayer wiring substrate
07/01/2010WO2010073800A1 Electronic component and method for manufacturing same
07/01/2010WO2010073780A1 Flex-rigid wiring board and method for manufacturing same
07/01/2010WO2010073739A1 Point flow soldering apparatus
07/01/2010WO2010073639A1 Flexible substrate and electronic device
07/01/2010WO2010036433A3 A wireless telemetry electronic circuit board for high temperature environments
07/01/2010US20100167600 Electrocoated contacts compatible with surface mount technology