Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2010
07/15/2010US20100177491 Orientation-tolerant land pattern and method of manufacturing the same
07/15/2010US20100176836 Wafer Level Burn-In and Electrical Test System and Method
07/15/2010US20100176083 Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate
07/15/2010US20100176082 Compositions and methods for the selective removal of silicon nitride
07/15/2010US20100175917 Wiring board and method of manufacturing the same
07/15/2010US20100175915 Printed circuit board and method of manufacturing the same
07/15/2010US20100175911 High-Speed Two-Layer and Multilayer Circuit Boards
07/15/2010US20100175252 Automated Twist Pin Assembling Machine and Method for Interconnecting Stacked Circuit Boards in a Module
07/15/2010US20100175251 Flexible printed circuit board
07/15/2010US20100175250 Multilayer substrate and method of manufacturing the same
07/15/2010US20100175249 Method for Fabricating Thin Touch Sensor Panels
07/15/2010US20100175248 System and method of using a compliant lead interposer
07/15/2010US20100175247 Functional element-mounted module and a method for producing the same
07/15/2010US20100175246 Component mounting system and component mounting method
07/14/2010EP2207407A1 Method for generation of electrically conducting surface structures, device and use
07/14/2010EP2207244A2 Connector and multilayer circuit board
07/14/2010EP2206756A1 Circuit connecting material, connection structure and method for producing the same
07/14/2010EP2206419A1 Product packaging
07/14/2010EP2205391A1 Method for operation of a wave soldering system which uses perfluoric polyether for reaction with impurities containing lead
07/14/2010EP2205316A1 Filtered feedthrough assemblies for implantable devices and methods of manufacture
07/14/2010EP1711915B1 Method and device for continuously producing electronic film components, and an electronic film component
07/14/2010EP1639871B1 Method for manufacturing an electrically conductive pattern
07/14/2010CN201528504U BGA precise visual bonding system
07/14/2010CN201528472U Rigid-flexible circuit board with bent area protected by copper foil
07/14/2010CN201528471U Film clip for printed circuit board
07/14/2010CN201528470U General jig for blocking hole
07/14/2010CN201528469U Printed circuit board metal formwork structure
07/14/2010CN201528468U Printed circuit board
07/14/2010CN201528467U Circuit board
07/14/2010CN201527539U Exposure film for resistance welding pattern
07/14/2010CN201525899U Clamping plate tool for electroplating a circuit board
07/14/2010CN201524857U thermocompression bonder
07/14/2010CN1894444B Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
07/14/2010CN1805653B Printed circuit board and manufacturing method thereof
07/14/2010CN101779530A Component mounting device and method
07/14/2010CN101779529A Electric circuit configuration and method for producing an electric circuit configuration
07/14/2010CN101779528A Circuit module, and electronic device using the module
07/14/2010CN101779527A Split wave compensation for open stubs
07/14/2010CN101779526A Wiring board and liquid crystal display device
07/14/2010CN101779525A Wiring board and liquid crystal display device
07/14/2010CN101779165A Photosensitive resin composition and laminate thereof
07/14/2010CN101778887A Mold release film
07/14/2010CN101778543A Multi-layer printed circuit board machining process
07/14/2010CN101778542A Manufacturing method of PCB plate with copper pillar
07/14/2010CN101778541A Method for preventing corrugation of copper foil during stitching of high-layer circuit board
07/14/2010CN101778540A Method for treating surfaces of plates
07/14/2010CN101778539A Processing art method of PCB
07/14/2010CN101778538A Device system for producing nano spraying circuit boards
07/14/2010CN101778537A Gum dipping process of glass cloth in production of copper-clad plate
07/14/2010CN101778536A Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board
07/14/2010CN101778535A Low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation
07/14/2010CN101778534A Photoelectric mixed circuit board and manufacturing method thereof
07/14/2010CN101777547A Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent
07/14/2010CN101777503A Solder ball printer
07/14/2010CN101777055A PCB (Printed circuit board) plate welding method
07/14/2010CN101515576B COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling theCOF packaging structure thereof
07/14/2010CN101461700B Minitype sensor and method for producing the same
07/14/2010CN101437357B Welding pad structure for printed circuit board and method for forming the same
07/14/2010CN101372755B Top clamp type side shielding apparatus for electroplating printed circuit board
07/14/2010CN101262743B Method for forming photoresist-laminated substrate, method for plating insulating substrate, method for surface treating metal layer of circuit board, and method for manufacturing multi layer ceramic
07/14/2010CN101257773B Method of manufacturing multi-layered printed circuit board
07/14/2010CN101241801B A design method for digital controllable variable capacitor
07/14/2010CN101164784B Heat unit, liquid droplet discharging apparatus, and method for discharging liquid
07/14/2010CN101142676B Electronic device and carrier substrate
07/14/2010CN101001973B Barrier film for flexible copper substrate and sputtering target for forming barrier film
07/13/2010US7755468 Chip resistor and manufacturing method therefor
07/13/2010US7755199 Flexible lead surface-mount semiconductor package
07/13/2010US7755182 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
07/13/2010US7755030 Optical device including a wiring having a reentrant cavity
07/13/2010US7755022 System and method for attenuating the effect of ambient light on an optical sensor
07/13/2010US7754978 Multilayer printed wiring board and method of manufacturing the same
07/13/2010US7754976 Compact circuit carrier package
07/13/2010US7754803 Resin composition
07/13/2010US7754790 Epoxy acrylate, a resin component having no unsaturated double bond; a bis(methacryloyloxyethyl) hydrogen phosphate; and a radical polymerization initiator; low-temperature curability, high adhesion, high reliability
07/13/2010US7754321 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board
07/13/2010US7753744 Grouped element transmission channel link with pedestal aspects
07/13/2010US7753492 Micro-electromechanical fluid ejection mechanism having a shape memory alloy actuator
07/13/2010US7752750 Method of forming wiring
07/13/2010US7752748 Method for detecting condition of nozzle member
07/13/2010US7752747 Manufacturing method of electronic component
07/13/2010US7752746 Method of partially attaching an additional attaching material for various types of printed circuit boards
07/13/2010US7752745 Method of making wired circuit board holding sheet
07/08/2010WO2010077465A1 Electroactive polymers and articles containing them
07/08/2010WO2010077069A2 Plastic composition, and prepreg and printed circuit board using the same
07/08/2010WO2010077015A2 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board
07/08/2010WO2010077014A2 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board
07/08/2010WO2010076875A1 Printed wiring board and method for manufacturing same
07/08/2010WO2010076547A1 Method and apparatus for forming grooves in the surface of a polymer layer
07/08/2010WO2010076099A1 Electrical circuit assembly, control device and method for producing an electrical circuit assembly
07/08/2010US20100172116 Shielded electronic components and method of manufacturing the same
07/08/2010US20100172115 Apparatus for electromagentically shielding a portion of a circuit board
07/08/2010US20100172113 Methods for forming packaged products
07/08/2010US20100171872 Optical device, imaging device, and method for manufacturing optical device
07/08/2010US20100171508 In-Circuit Test Assembly
07/08/2010US20100170868 Spin-on spacer materials for double- and triple-patterning lithography
07/08/2010US20100170706 Electronic module and method for manufacturing an electronic module
07/08/2010US20100170703 Rigid-flex module and manufacturing method
07/08/2010US20100170700 Solid printed circuit board and method of manufacturing the same
07/08/2010US20100170088 Method Of Fabricating Board Having High Density Core Layer And Structure Thereof
07/08/2010US20100170087 Method of manufacturing a circuit board
1 ... 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 257 258 259 260 261 ... 1185