| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/04/2010 | CN101795533A Circuit board and copper-spreading method thereof |
| 08/04/2010 | CN101795532A Single-layer flexible printed circuit and realization method thereof |
| 08/04/2010 | CN101795531A Stamp hole connection structure, circuit board and circuit board dividing method |
| 08/04/2010 | CN101795530A Circuit board and method for constructing the same |
| 08/04/2010 | CN101794951A A method of connecting printed circuit boards and corresponding arrangement |
| 08/04/2010 | CN101794078A Ultraviolet ray lamp exposure system, using method and calibrating method |
| 08/04/2010 | CN101794077A Operating platform and method of automatically installing shims |
| 08/04/2010 | CN101794076A Automatic substrate transport system and method |
| 08/04/2010 | CN101792521A Latent curing agent |
| 08/04/2010 | CN101791808A Cutting tool for separating circuit board and method for separating circuit board |
| 08/04/2010 | CN101791731A Cooling plant |
| 08/04/2010 | CN101348634B Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof |
| 08/04/2010 | CN101339908B Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat |
| 08/04/2010 | CN101325192B Substrate easy to measure temperature and manufacturing method thereof |
| 08/04/2010 | CN101291562B Capacitor and its manufacture method |
| 08/04/2010 | CN101170875B Circuit board and its manufacture method |
| 08/03/2010 | US7769190 Audio signal processing circuit and a display device incorporating the same |
| 08/03/2010 | US7767912 Integrated circuit carrier arrangement with electrical connection islands |
| 08/03/2010 | US7767266 Jetting device and method at a jetting device |
| 08/03/2010 | US7767074 Method of etching copper on cards |
| 08/03/2010 | US7767065 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 08/03/2010 | US7766458 Inkjet head capable of suppressing hindrance of deformation of a piezoelectric element |
| 08/03/2010 | US7765692 Method of manufacturing printed wiring board |
| 08/03/2010 | US7765691 Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate |
| 08/03/2010 | US7765690 Process for fabricating electronic components and electronic components obtained by this process |
| 08/03/2010 | US7765686 Multilayer wiring structure and method of manufacturing the same |
| 07/29/2010 | WO2010084872A1 (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material |
| 07/29/2010 | WO2010084871A1 Carboxyl group-containing polyurethane |
| 07/29/2010 | WO2010084867A1 Multilayer fluororesin film and printed circuit board |
| 07/29/2010 | WO2010084813A1 Multilayer ceramic electronic component and method for manufacturing same |
| 07/29/2010 | WO2010084728A1 Apparatus for adhering adhesive tape, and pressure bonding apparatus |
| 07/29/2010 | WO2010084592A1 Circuit board for mounting electronic component thereon |
| 07/29/2010 | WO2010084540A1 Circuit board, circuit module, and electronic device provided with circuit module |
| 07/29/2010 | WO2010038977A3 Entry sheet for perforating pcb (printed circuit board) and fabrication method thereof |
| 07/29/2010 | US20100190362 Component Part Having an Electrical Printed Circuit Board |
| 07/29/2010 | US20100190111 Conductive film and method for producing the same |
| 07/29/2010 | US20100188823 Method for Manufacturing an Electronic Module |
| 07/29/2010 | US20100188821 Device having electronic components mounted therein and method for manufacturing such device |
| 07/29/2010 | US20100188729 Ceramic Header Method and System |
| 07/29/2010 | US20100187003 Circuit board structure and fabrication method thereof |
| 07/29/2010 | US20100187000 Method for the production of a ceramic multilayer circuit arrangement, and multilayer circuit arrangement produced using said method |
| 07/29/2010 | US20100186997 Crimped solder on a flexible circuit board |
| 07/29/2010 | US20100186994 Improvements in and relating to manufacture of electrical circuits for electrical components |
| 07/29/2010 | US20100186231 Method for producing a metal-ceramic substrate for electric circuits on modules |
| 07/29/2010 | US20100186227 Wired circuit board and production method thereof |
| 07/29/2010 | US20100186226 Fluidic self-assembly for system integration |
| 07/29/2010 | DE112006000696B4 Leiterbahnbildung mittels Dochtwirkungsaktion Trace formation by wicking action |
| 07/29/2010 | DE102009031227A1 Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger Apparatus for soldering a conductor on a circuit carrier |
| 07/29/2010 | DE102009006181A1 Printed circuit or electronic component e.g. coil, manufacturing method, involves applying contours of conducting paths or component elements on ceramic substrate by silver paste, such that geometrical structures are formed on substrate |
| 07/29/2010 | DE102009005996A1 Verfahren zum Herstellen einer elektrischen und mechanischen Verbindung und Anordnung, die eine solche aufweist Comprises methods for making an electrical and mechanical connection and assembly such a |
| 07/29/2010 | DE102009004346A1 Unipolar or multipolar surge protection devices i.e. producer-specific standard plug-in modules, mounting device for use in power inverter for photovoltaic application, has chambers with interior contacts and mechanical fastening unit |
| 07/28/2010 | EP2211598A2 Method for making a sensor module |
| 07/28/2010 | EP2211596A1 Circuit-connecting material and circuit terminal connection structure |
| 07/28/2010 | EP2211354A1 Coated conductive powder and conductive adhesive using the same |
| 07/28/2010 | EP2209632A1 Screen for commercial screen printing |
| 07/28/2010 | EP2044819B1 Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier |
| 07/28/2010 | EP1609206B1 Coaxial waveguide microstructures and methods of formation thereof |
| 07/28/2010 | CN201536048U 一种超薄pcb变压器 An ultra-thin pcb transformer |
| 07/28/2010 | CN201534253U Positioning guiding device of wave-soldering furnace |
| 07/28/2010 | CN201534123U Thin substrate wet processing device |
| 07/28/2010 | CN1988788B Heat equalizing sheet elementproducing method |
| 07/28/2010 | CN1921079B Method of manufacturing a wiring board |
| 07/28/2010 | CN101790903A Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 07/28/2010 | CN101790902A multi-layer substrate |
| 07/28/2010 | CN101790797A Solderless integrated package connector and heat sink for led |
| 07/28/2010 | CN101790290A Method for manufacturing embedded high-conductivity printed circuit board (PCB) |
| 07/28/2010 | CN101790289A PCB with interconnected blind holes and processing method thereof |
| 07/28/2010 | CN101790288A Manufacturing method of novel printed circuit board |
| 07/28/2010 | CN101790287A Manufacturing process for quickly interconnecting electronic components |
| 07/28/2010 | CN101790286A Process for machining holes |
| 07/28/2010 | CN101790285A Communication device and method for manufacturing circuit board of communication device |
| 07/28/2010 | CN101790284A PCB (printed circuit board) punch forming method and composite punch die |
| 07/28/2010 | CN101790283A Printed wiring board |
| 07/28/2010 | CN101790281A Printed wiring board |
| 07/28/2010 | CN101790279A Composite reinforcing film and manufacturing method thereof |
| 07/28/2010 | CN101790278A Full photophobic copper-clad laminate and preparation method thereof |
| 07/28/2010 | CN101790277A Method for manufacturing PCB (printed circuit board), PCB and device |
| 07/28/2010 | CN101789383A Method for making packaging substrate with recess structure |
| 07/28/2010 | CN101787126A Polyamide acid composition, method for manufacturing two-layer process flexible copper-clad plates by use of same, and obtained two-layer process flexible copper-clad plate |
| 07/28/2010 | CN101496155B Apparatus and process for metallization of base sheet of photo-volt battery |
| 07/28/2010 | CN101237766B Circuit board carrier |
| 07/28/2010 | CN101126883B Liquid crystal display device |
| 07/28/2010 | CN101120623B Manufacturing method of multi-layer circuit board and multi-layer circuit board |
| 07/28/2010 | CN101120622B Member for interconnecting wiring films and method for producing the same |
| 07/28/2010 | CN101022701B Printed circuit board processing device and drilling processing method therefor |
| 07/27/2010 | US7764351 Method for decreasing misalignment of a printed circuit board and a liquid crystal display device with the printed circuit board |
| 07/27/2010 | US7763809 Multilayered substrate for semiconductor device and method of manufacturing same |
| 07/27/2010 | US7763195 Injection molding method with surface modification |
| 07/27/2010 | US7763151 Process for producing transparent conductive laminate |
| 07/27/2010 | US7762184 Production unit including a printing device and upper and lower sealed chambers |
| 07/27/2010 | US7762141 Pressure sensor and manufacturing method thereof |
| 07/27/2010 | US7761984 Process for producing multi-layer printed wiring board |
| 07/27/2010 | US7761983 Method of assembling a wafer probe |
| 07/27/2010 | US7761982 Method for manufacturing IC-embedded substrate |
| 07/27/2010 | CA2552089C Circuit board mounting bracket |
| 07/27/2010 | CA2351792C Method and apparatus for improved process control in combustion applications |
| 07/22/2010 | WO2010082658A1 Resin composition |
| 07/22/2010 | WO2010082616A1 Connector |
| 07/22/2010 | WO2010082441A1 Device for sticking films, device for transferring/fixing small piece member and head device thereof |
| 07/22/2010 | WO2010082429A1 Method of manufacturing pattern electrode and pattern electrode |