Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2010
07/01/2010US20100167597 Electrode junction structure and manufacturing method thereof
07/01/2010US20100167589 Telecommunications jack with adjustable crosstalk compensation
07/01/2010US20100167561 Structure and process for a contact grid array formed in a circuitized substrate
07/01/2010US20100167466 Semiconductor package substrate with metal bumps
07/01/2010US20100165657 Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same
07/01/2010US20100165590 Electronic device, electronic component, and method of manufacturing electronic device
07/01/2010US20100165587 Memory card and method for manufacturing the same
07/01/2010US20100165583 Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module
07/01/2010US20100164890 Input device for flexible display device and manufacturing method thereof
07/01/2010US20100163297 Printed wiring board and method for manufacturing the same
07/01/2010US20100163288 Multilayered printed circuit board
07/01/2010US20100163286 Circuit Board Structure and Manufacturing Method Thereof and Liquid Crystal Display Containing the Same
07/01/2010US20100163283 Electronic circuitry integrated in fabrics
07/01/2010US20100163282 Printed wiring board, method for manufacturing printed wiring board, and electric device
07/01/2010US20100162562 Method of manufacturing rigid-flexible printed circuit board
07/01/2010US20100162561 Sliding package retention device for lga sockets
07/01/2010DE102009050743A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method
07/01/2010DE102009034239A1 Halbleitervorrichtung mit Stiftanschlüssen A semiconductor device having pin terminals
07/01/2010DE102008062516A1 Leiterplatte mit aufgewachsener Metallschicht in einer biegbaren Zone PCB with metal layer grew up in a flexible zone
07/01/2010DE102008057832B4 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder Power semiconductor module with auxiliary pre-stressed contact spring
07/01/2010DE102008055137A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component
07/01/2010DE102008055134A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component
07/01/2010DE10031260B4 Verfahren und Vorrichtung zum Beseitigen von Abfall Method and apparatus for removing waste
07/01/2010CA2748245A1 Flexible substrate and electronic device
06/2010
06/30/2010EP2203035A2 Automated machine tool and method for drilling reference holes in circuit boards
06/30/2010EP2203034A1 Attachment device and electronic apparatus
06/30/2010EP2202755A1 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
06/30/2010EP2202021A1 Apparatus for and method of coating flux with a movable nozzle
06/30/2010EP2201828A1 A method of soldering components on circuit boards and corresponding circuit board
06/30/2010EP2201827A1 Negative imaging method for providing a patterned metal layer having high conductivity
06/30/2010EP2200838A1 Composition and method for providing a patterned metal layer having high conductivity
06/30/2010EP2019577B1 Multilayer module with case
06/30/2010CN201518558U Support device of wave soldering printed circuit board
06/30/2010CN1939717B 丝网印刷装置 Screen printing apparatus
06/30/2010CN101766063A Composite for multilayer circuit board
06/30/2010CN101765343A Multi-layer printed circuit board and manufacturing method thereof
06/30/2010CN101765342A Manufacturing method of aluminum-substrate printed circuit board in-hole metallization
06/30/2010CN101765341A Molding structure and method for laser-assisting base plate line
06/30/2010CN101765340A Interlayer conduction manufacturing method of circuit board
06/30/2010CN101765339A Carrying tool and wave-soldering method
06/30/2010CN101765338A Refluxing soft soldering apparatus
06/30/2010CN101765337A Adjustable base
06/30/2010CN101765336A Width adjusting mechanism
06/30/2010CN101765335A Automatic retractor device
06/30/2010CN101765334A Automatic tensioning device
06/30/2010CN101765333A 线路板焊接工装 PCB welding equipment
06/30/2010CN101765332A External flow four-opening type pot opening
06/30/2010CN101765331A Cylinder independent die opening
06/30/2010CN101765330A Avoidance pot mouth with tin retaining plate internally
06/30/2010CN101765329A Lug boss side tin overflowing pot opening
06/30/2010CN101765328A Internal flow double open kettle opening
06/30/2010CN101765327A Fixed insertion type pot mouth
06/30/2010CN101765326A Internally concave double-edge open type pot mouth with tin retaining plates
06/30/2010CN101765325A Dual open type pot opening with tin-blocking plate
06/30/2010CN101765324A Tin-overflowing temperature-supplement type pot
06/30/2010CN101765323A Tin-overflowing pot having flange on side walls
06/30/2010CN101765322A L-shaped upstream side flowing spout
06/30/2010CN101765321A Fixed kettle mouth
06/30/2010CN101765320A Fixed type shortened pot mouth
06/30/2010CN101765319A Fixed type pot mouth
06/30/2010CN101765318A Fixed plug-in pot opening with outer block
06/30/2010CN101765317A Fixed type lengthened pot mouth with flange
06/30/2010CN101765316A Sheet type spout for avoidance of grounding block element
06/30/2010CN101765315A Concave spout for avoidance of grounding block element
06/30/2010CN101765314A L-shaped upstream side flowing spout
06/30/2010CN101765313A Combined-part type die Schnauze
06/30/2010CN101765312A Two-sided straddle type and part-avoiding type spout
06/30/2010CN101765311A Extension wire assembled pot mouth
06/30/2010CN101765310A Extension wire single-row pot mouth
06/30/2010CN101765309A Single-opened spout for dodging chip element
06/30/2010CN101765308A Closed-type spout for dodging chip element
06/30/2010CN101765307A Double-opening spout for dodging chip element
06/30/2010CN101765306A External baffle insertion type pot opening
06/30/2010CN101765305A Single-surface bestriding type part avoidance pot opening
06/30/2010CN101765304A Plug-in type spout
06/30/2010CN101765303A 智能控制预热装置 Intelligent Control preheating device
06/30/2010CN101765302A Lengthened plug-in pot opening with flange
06/30/2010CN101765301A Internal flow full open kettle opening
06/30/2010CN101765300A Internal opening full flow convex pot mouth
06/30/2010CN101765299A Lug boss top opening type tin overflowing pot opening
06/30/2010CN101765298A Processing technology of printed circuit board
06/30/2010CN101765297A Method for forming insulating layer and conducting layer on conducting layer as well as forming electric connection between conducting layers and method for producing corresponding multi-layer circuit board
06/30/2010CN101765296A Drilling method of motherboard of circuit board
06/30/2010CN101765295A Wiring board and method for manufacturing the same
06/30/2010CN101765294A Connecting structure of flexile printed circuit board and method for manufacturing same
06/30/2010CN101764009A Electrode junction structure and manufacturing method thereof
06/30/2010CN101763942A Capacitor, circuit board and method for manufacturing circuit board
06/30/2010CN101758338A Low-temperature solubilizer of organic solderability preservative and application method thereof
06/30/2010CN101758308A Welding device for crest welder
06/30/2010CN101026923B Printed wiring board and connection configuration of the same
06/29/2010US7747341 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing
06/29/2010US7746648 Modular heat-radiation structure and controller including the structure
06/29/2010US7745926 Composite multi-layer substrate and module using the substrate
06/29/2010US7745735 Cross-over of conductive interconnects and a method of crossing conductive interconnects
06/29/2010US7745013 Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
06/29/2010US7744802 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
06/29/2010US7744378 Plug for connection strips and method for the production thereof
06/29/2010US7743493 Method for manufacturing a ceramic electronic component
06/29/2010US7743492 Method for forming cast flexible substrate and resultant substrate and electronic device
06/29/2010US7743491 Mounting method of passive component
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