Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2010
08/18/2010CN1680067B Laser machining apparatus for sheet-like workpiece
08/18/2010CN1638604B Method and device for contactless treatment of flat objects in through type treatment equipment
08/18/2010CN1638603B Method and device for treating flat objects in through type treating apparatus
08/18/2010CN1604722B Optical disc device
08/18/2010CN1551712B Electronic circuit connection structure and its connection method
08/18/2010CN101810067A Compression bonding device, compression bonding method, package, and pressing plate
08/18/2010CN101810063A Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
08/18/2010CN101809206A Copper foil for printed circuit and copper clad laminate
08/18/2010CN101809107A Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
08/18/2010CN101808499A Temporary storage system and access device thereof
08/18/2010CN101808479A Technique for reducing the number of layers in multilayer circuit board
08/18/2010CN101808478A Plug hole BGA screen and plug hole method of printed circuit board
08/18/2010CN101808477A Method for manufacturing circuit board
08/18/2010CN101808476A Method for manufacturing circuit board
08/18/2010CN101808475A Circuit board and preparation process thereof
08/18/2010CN101808474A Circuit board and manufacturing process thereof
08/18/2010CN101808473A Precise and fine circuit binding force improving binding force device and manufacturing method thereof
08/18/2010CN101808472A Method for producing electronic part unit
08/18/2010CN101808471A PIN needle dissembling device and PIN dissembling head
08/18/2010CN101808470A Method for manufacturing printed circuit board with optical function
08/18/2010CN101808469A Exposure method of printed wiring board
08/18/2010CN101808468A Film posting method
08/18/2010CN101808467A Lamination lay-up system and transfer machine thereof
08/18/2010CN101808466A Manufacturing method of copper-clad plate and glue solution for copper-clad plate
08/18/2010CN101808465A Board-flying type board collecting system
08/18/2010CN101808464A Method for manufacturing ultra-long microwave high-frequency circuit board
08/18/2010CN101808463A Wiring board processing method
08/18/2010CN101808462A Wiring board and preparation method thereof
08/18/2010CN101807554A Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
08/18/2010CN101807465A Surface adhesive type magnetic element and element-placing method thereof
08/18/2010CN101807001A Photosensitive resin composition and application thereof
08/18/2010CN101804511A Laser soldering apparatus
08/18/2010CN101547569B Technology for processing semi-hole of PCB board
08/18/2010CN101374385B Automatic panel-establishing method and apparatus
08/18/2010CN101313637B Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material
08/18/2010CN101267710B Printed circuit board unit and printed wiring board
08/18/2010CN101065843B Method for manufacturing an electronics module
08/18/2010CN101052266B Printed circuit board and manufacturing method thereof
08/17/2010US7777856 Flexible electrical display
08/17/2010US7777335 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
08/17/2010US7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric
08/17/2010US7776808 Cleaning agent for removing solder flux and method for cleaning solder flux
08/17/2010US7776720 Program-controlled dicing of a substrate using a pulsed laser
08/17/2010US7776651 Method for compensating for CTE mismatch using phase change lead-free super plastic solders
08/17/2010US7776438 Curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m
08/17/2010US7776199 photoresists; photolithography; electroplating; dry treatment; free from undercuts
08/17/2010US7775632 Nozzle arrangement with expandable actuator
08/17/2010US7774931 Method of fabricating an integrated intraocular retinal prosthesis device
08/17/2010US7774930 Method of manufacturing a micromachined polymer beam structure
08/17/2010US7774920 Fabrication of metallic microstructures via exposure of photosensitive compostion
08/17/2010CA2390451C Conductive electrical element and antenna with ink additive technology
08/12/2010WO2010090727A1 Substrate holding platen with high speed vacuum
08/12/2010WO2010090631A1 Method of producing electronic circuit boards using electrophotography
08/12/2010WO2010090121A1 Solder feeder, printer, and print method
08/12/2010WO2010089963A1 Circuit board structure
08/12/2010US20100203707 Substrate dividing method
08/12/2010US20100202122 Carrier assembly for an integrated circuit
08/12/2010US20100201750 Fluid ejection device with overlapping firing chamber and drive fet
08/12/2010US20100201470 Surface mount magnetic device and placement method thereof
08/12/2010US20100200287 Printed wiring board, and design method for printed wiring board
08/12/2010US20100200283 Insulation paste for a metal core substrate and electronic device
08/12/2010US20100200279 Electronic component mounting substrate and method for manufacturing electronic component mounting substrate
08/12/2010US20100200277 Multi-layer circuit board, method of manufacturing the same, and communication device
08/12/2010US20100200276 Implementations of twisted differential pairs on a circuit board
08/12/2010US20100200154 Fabricating process of circuit board with embedded passive component
08/12/2010US20100199492 Conformal shielding employing segment buildup
08/12/2010US20100199491 Manufacturing method of image pick-up device, image pick-up device and optical element
08/12/2010DE202010001099U1 Mehrfach verwendbare Bohrunterlage zum Bohren von Leiterplatten Multi-purpose drilling for drilling of printed circuit boards
08/12/2010DE202005021831U1 Einrichtung zur Erzeugung einer Beschichtung von Druckprodukten einer Druckmaschine mittels Ink-Jet-Köpfen Means for generating a coating of printed products of a printing press by means of ink-jet heads
08/12/2010DE202005021829U1 Einrichtung zur Erzeugung einer Beschichtung von Druckprodukten einer Druckmaschine mittels digitaler Bilddaten Means for generating a coating of printed products of a printing press by means of digital image data
08/12/2010DE10335439B4 Verfahren und Vorrichtung für die Bearbeitung von flexiblen Schaltungsträgern Method and device for the processing of flexible circuit supports
08/12/2010DE102009007800A1 Aerosol-Drucker, dessen Verwendung und Verfahren zur Herstellung von Linienunterbrechungen bei kontinuierlichen Aerosol-Druckverfahren Aerosol printer, its use and process for preparing aerosol line interruptions in continuous printing method
08/12/2010DE102009006871A1 Component carrier for use with positioning aid for supporting placement of component of system in target area on surface of component carrier, has pole shoe which is arranged in or on component carrier at distance from surface
08/12/2010DE102009000491A1 Sintered ceramic substrate used in data transmission systems, particularly microwave circuits, has metallic-hermetic through holes, where holes are filled with mesh made of one or multiple electrically conductive materials
08/12/2010DE102008002969B4 Kontaktstift für Durchkontaktierungen Pin for vias
08/12/2010CA2692067A1 Organoamine stabilized silver nanoparticles and process for producing same
08/11/2010EP2217045A1 Wiring substrate and method of manufacturing the same
08/11/2010EP2217044A1 Circuit board and method for manufacturing the same
08/11/2010EP2217043A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
08/11/2010EP2216790A1 Electrically conductive paste, and electrical and electronic device comprising the same
08/11/2010EP2216427A1 Copper foil for printed circuit and copper clad laminate
08/11/2010EP2216175A1 Screen printing method
08/11/2010EP2215203A1 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean
08/11/2010EP2116114B1 Production process of printed circuits on which electronic components without leading wire are soldered
08/11/2010EP2024281B1 Potassium monopersulfate solutions
08/11/2010CN201550367U Reversible clamp for welding circuit board
08/11/2010CN201550366U 钢网 Stencil
08/11/2010CN201550365U Crimping connector device
08/11/2010CN201550364U Rack for silk-screen frame of printed wiring board
08/11/2010CN201550363U Cooling water supply system of circuit board exposure machine
08/11/2010CN201550359U Circuit board and steel mesh for manufacturing pad
08/11/2010CN201550356U Circuit board capable of loading large current
08/11/2010CN201545928U Electroplating tank with shielding device
08/11/2010CN201544507U Adhesive-obstructing film for fast pressing of flexible circuit boards
08/11/2010CN201543940U Wave soldering machine and mechanical claw thereof
08/11/2010CN201543726U Salient point processing mold for flexible salient point circuit board
08/11/2010CN1944717B Negative pressure electroplating method for PCB
08/11/2010CN1722940B Method for manufacturing multi-layer printed circuit board and multi-layer printed circuit board
08/11/2010CN101803485A Method for manufacturing multilayer printed wiring board
08/11/2010CN101803484A Partially rigid flexible circuits and method of making same