Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2010
08/25/2010EP2221140A1 Flux for soldering, soldering paste composition, and method of soldering
08/25/2010EP2220919A1 Method for the production of a circuit board layer (circuit plane) for a particularly multi-layer circuit board (ceramic substrate)
08/25/2010EP2220918A1 Improvements in or relating to circuit arrangements and associated apparatus and methods
08/25/2010EP2220917A1 Tip printing and scrape coating systems and methods for manufacturing electronic devices
08/25/2010EP2219911A1 Connecting element and related fluid assembly
08/25/2010EP2219517A2 Apparatus and methods for the measurement of cardiac output
08/25/2010EP1728106B1 Method for imaging regular patterns
08/25/2010CN201563306U Crest welder
08/25/2010CN201563305U Improved structure of automatic cutting and grinding line
08/25/2010CN201563304U Circuit board engraver
08/25/2010CN201563303U PCB (Printed Circuit Board) electric heating hot melt machine and heating head thereof
08/25/2010CN201563302U Positioning pin and PCB positioning equipment
08/25/2010CN201563301U Dry film laminating device for flexible circuit boards
08/25/2010CN201563300U Continuous dry film laminating system for flexible circuit board
08/25/2010CN201563299U Inserting frame special for vertical blackening line
08/25/2010CN201563298U Positioning device for producing ceramic circuit board
08/25/2010CN201563294U Welding structure of circuit board
08/25/2010CN201563285U Novel ceramic circuit board
08/25/2010CN201562867U Cleaning device for cleaning inserting endpoint
08/25/2010CN201562542U Stacked coil
08/25/2010CN201560237U Solution exchanging system
08/25/2010CN201559005U Flow guiding plate
08/25/2010CN1990148B Soldering method and apparatus
08/25/2010CN1977369B Method and apparatus for mounting conductive ball
08/25/2010CN1771772B Multilayer printed wiring board
08/25/2010CN101816221A Circuit connecting material, circuit connection structure, and method for producing the same
08/25/2010CN101816068A IC mounting substrate and method for manufacturing the same
08/25/2010CN101815769A Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
08/25/2010CN101815409A Method for manufacturing circuit board through injection molding
08/25/2010CN101815408A Fully automatic circuit board manufacturing machine
08/25/2010CN101815407A Sheet immersing treatment method and device
08/25/2010CN101815406A Process for cutting printed circuit board
08/25/2010CN101815405A Nickel-less immersion gold electric gold thickening process for printed circuit board
08/25/2010CN101815404A High-frequency mixed compression process for printed circuit board
08/25/2010CN101815403A Method for producing metal template of printed circuit board
08/25/2010CN101815402A Circuit board and a manufacturing approach thereof
08/25/2010CN101815401A Circuit board and a fabricating method thereof
08/25/2010CN101814356A Wiring board, method of manufacturing same, tuner module, and electronic device
08/25/2010CN101534599B LED radiating substrate and manufacturing method thereof
08/25/2010CN101394712B Hole blackening solution and preparation thereof
08/25/2010CN101376734B Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof
08/25/2010CN101309552B Conducting construction of circuit board and manufacturing method therefor
08/25/2010CN101267716B Multilayer build-up wiring board
08/25/2010CN101175377B System and method for removing electronic components
08/25/2010CN101142052B Laser machining apparatus, program generating device and laser processing method
08/25/2010CN101106098B Ball filling device and method
08/25/2010CN101017733B Ic socket
08/25/2010CN101016979B Manufacture method of lamp string
08/24/2010US7781889 Shielded via
08/24/2010US7781328 Multilayer substrate
08/24/2010US7780877 such as antenna substrates and print substrates, that are low in dielectric loss in the high frequency band for higher speed of information and electronic equipment units; base member made of acrylic acid-tetrafluoroethylene graft polymer
08/24/2010US7779539 Method for preventing broken circuits of a flexible printed circuit
08/24/2010US7779538 Method for mutually connecting circuit boards
08/19/2010WO2010094017A1 Process for thick film circuit patterning
08/19/2010WO2010093031A1 Solder bump formation on a circuit board using a transfer sheet
08/19/2010WO2010092970A1 Sintered body of low temperature cofired ceramic and multilayer ceramic substrate
08/19/2010WO2010092969A1 Low temperature cofired ceramic material and ceramic substrate
08/19/2010WO2010092932A1 Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device
08/19/2010US20100210136 Flexible holder for connector
08/19/2010US20100209680 Methods for producing pattern-forming body
08/19/2010US20100209054 Opto-electric hybrid module and method of manufacturing the same
08/19/2010US20100208442 Wiring board assembly and manufacturing method thereof
08/19/2010US20100208439 Wiring board, method of manufacturing same, tuner module, and electronic device
08/19/2010US20100208437 Multilayer wiring substrate and method for manufacturing the same
08/19/2010US20100207275 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
08/19/2010US20100207218 Electronic component device, and method of manufacturing the same
08/19/2010US20100206619 Package substrate strucutre with cavity and method for making the same
08/19/2010US20100206618 Coreless Substrate and Method for Making the Same
08/19/2010US20100206602 Bump Structure With Multiple Layers And Method Of Manufacture
08/19/2010US20100206462 Process for placing, securing and interconnecting electronic components
08/19/2010US20100206133 Method of refining solder materials
08/19/2010DE202010006339U1 SMD-fähiger Leiterplatten-Durchsteckkontakt SMD-compatible PCB Through Hole Contact
08/19/2010DE102009007204A1 Printed circuit board for use as LED module utilized for lighting purpose, has contact bridge arranged on connection point, connected with track at point and soldered with line at another connection point that is spaced apart from point
08/19/2010DE102009006757B3 Lötstopplack-Beschichtung für starrbiegsame Leiterplatten Solder mask coating for printed circuit boards starrbiegsame
08/19/2010DE10033352B4 Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
08/19/2010CA2752128A1 Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device
08/18/2010EP2219427A1 Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, and air-conditioner
08/18/2010EP2219426A1 Method for manufacturing contacts
08/18/2010EP2219067A1 A backlight unit comprising a light emitting diode on a module substrate, a device comprising said unit
08/18/2010EP2218141A2 Solder connection element
08/18/2010EP2218104A2 Method and means for connecting thin metal layers
08/18/2010EP1806957B1 Multilayer substrate incorporating chip type electronic component and production method therefor
08/18/2010EP1598863B1 Semiconductor device and radiation detector employing it
08/18/2010CN201557331U Welding device
08/18/2010CN201557330U Selective wave soldering machine
08/18/2010CN201557329U Air blow jig for welding wire and repair welding of circuit board
08/18/2010CN201557328U Clamp for welding circuit board component
08/18/2010CN201557327U Steerable board dismounting device for printed circuit boards
08/18/2010CN201557326U Full-automatic laser plotting machine automatic sheet loading and blanking device
08/18/2010CN201552797U Heat conducting silica gel screen printing fixture
08/18/2010CN201552613U Punching system for flexible circuit boards
08/18/2010CN201552362U Electromagnetic pump wave generator with function of soldering flux recovery
08/18/2010CN201552361U Single power electromagnetic pump double-wave peak generator
08/18/2010CN201552360U Mechanical pump type wave generator with function of soldering flux recovery
08/18/2010CN201552357U Selective atomizing machine
08/18/2010CN201552352U Wave generator with function of soldering flux recovery
08/18/2010CN1997261B Electronic carrier board and its packaging structure
08/18/2010CN1819744B Punched hole processing method of flexible printed circuit lining
08/18/2010CN1758830B High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
08/18/2010CN1685507B Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
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