| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/22/2010 | WO2010082283A1 Apparatus and method of recycling resin crystalization flux |
| 07/22/2010 | WO2010082105A2 Drilling head for printed circuit boards |
| 07/22/2010 | WO2010081833A2 Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface |
| 07/22/2010 | WO2010081677A1 Method for generation of electrically conducting surface structures, device and use |
| 07/22/2010 | WO2010054623A3 Method for positioning and/or guiding at least one random processing head for the metallization of thin substrates at a defined distance above the substrate surface |
| 07/22/2010 | US20100184289 Substrate and method of manufacturing the same |
| 07/22/2010 | US20100182675 Methods of fabricating mems with spacers between plates and devices formed by same |
| 07/22/2010 | US20100182584 Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| 07/22/2010 | US20100182253 Touch screen panel and method of fabricating the same |
| 07/22/2010 | US20100180782 Printing in a Medium |
| 07/22/2010 | US20100180668 Sensor element of a gas sensor |
| 07/22/2010 | US20100180438 Method for Making Arrangement for Energy Conditioning |
| 07/22/2010 | DE102010004995A1 Verfahren zur Herstellung von Merkmalen elektronischer Schaltungen Process for the preparation of features of electronic circuits |
| 07/22/2010 | DE102009005570A1 Verfahren zum Herstellen einer Antenne auf einem Substrat A method of manufacturing an antenna on a substrate |
| 07/22/2010 | DE102009004652A1 Electric component i.e. radio frequency identification semiconductor chip, assembling method, involves implementing activation of adhesive during insertion of component into adhesive so that activation and insertion overlap with each other |
| 07/22/2010 | DE102006062841B4 Eine Vorrichtung und ein Verfahren zum Löten eines Bauteils an eine Platine An apparatus and a method of soldering a component to a circuit board |
| 07/21/2010 | EP2209358A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 07/21/2010 | EP2209355A1 Electronic control device |
| 07/21/2010 | EP2209062A1 Protective panel with touch input function of electronic device display window and electronic device |
| 07/21/2010 | EP2208237A1 Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit |
| 07/21/2010 | EP2208207A1 High temperature substrate protective structure |
| 07/21/2010 | EP1730234B1 Resin molded article with reduced dielectric loss tangent and production method therefor |
| 07/21/2010 | EP1724320B1 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet |
| 07/21/2010 | EP1605078B1 Soldering process using imidazole compound |
| 07/21/2010 | CN201533474U Novel AC servo driver |
| 07/21/2010 | CN201533454U Width adjusting mechanism |
| 07/21/2010 | CN201533453U Organic solvent recovering device in silk-screen printing process of PCB |
| 07/21/2010 | CN201533452U Film loading alternate rack with printed circuit board |
| 07/21/2010 | CN201532822U Resistance moulding frock |
| 07/21/2010 | CN201532523U Full-automatic double-side exposure machine |
| 07/21/2010 | CN201529826U Heating component of reflow welder |
| 07/21/2010 | CN201529825U Adjustable tin stove |
| 07/21/2010 | CN201529824U Tin stove |
| 07/21/2010 | CN201529823U Tin stove capable of adjusting flow |
| 07/21/2010 | CN201529822U Full-automatic ball mounting machine |
| 07/21/2010 | CN1984530B Medium laminated substrate |
| 07/21/2010 | CN1942046B Alternating micro-vias and through-hole in order to create improved PCB routing channels |
| 07/21/2010 | CN1878460B Installation work management method, installation machine and preparation support method, installation assembly line |
| 07/21/2010 | CN1849036B Thin circuit substrate and its manufacturing method |
| 07/21/2010 | CN1752744B Check method, manufacture method and check device for distributed substrate |
| 07/21/2010 | CN1599552B Electronic unit mounting device |
| 07/21/2010 | CN101785374A ceramic multilayer substrate |
| 07/21/2010 | CN101785373A Multilayered wiring board and semiconductor device |
| 07/21/2010 | CN101785372A Automated direct emulsion process for making printed circuits and multilayer printed circuits |
| 07/21/2010 | CN101785371A Fpc-based relay connector |
| 07/21/2010 | CN101785103A Low resistance through-wafer via |
| 07/21/2010 | CN101784957A Negative photosensitive material and circuit board |
| 07/21/2010 | CN101784614A Resin composition and multilayer resin film employing the same |
| 07/21/2010 | CN101784578A Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same |
| 07/21/2010 | CN101784502A Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer |
| 07/21/2010 | CN101784366A Flux for soldering and soldering paste composition |
| 07/21/2010 | CN101784365A Flux for soldering, soldering paste composition, and method of soldering |
| 07/21/2010 | CN101784168A Tin-floating device |
| 07/21/2010 | CN101784167A Wave-solderinging temperature measuring device |
| 07/21/2010 | CN101784166A PCB (Printed Circuit Board) art border structure |
| 07/21/2010 | CN101784165A Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| 07/21/2010 | CN101784164A Making method of groove type printed circuit board |
| 07/21/2010 | CN101784163A Printed circuit board and processing method of printed circuit board |
| 07/21/2010 | CN101784162A Manufacturing method for microwave high frequency metal base circuit board |
| 07/21/2010 | CN101784161A Method for manufacturing circuit board containing step holes |
| 07/21/2010 | CN101784160A Method for manufacturing press in type printed circuit board with high thermal conductivity |
| 07/21/2010 | CN101784159A Method for encapsulating PCB by adopting low pressure injection molding technology |
| 07/21/2010 | CN101784158A Circuit board with heat dissipation structures and method for manufacturing same |
| 07/21/2010 | CN101784156A Circuit board and preparation method thereof |
| 07/21/2010 | CN101783302A Method for forming pre-welding material of packaging base plate |
| 07/21/2010 | CN101782725A Printed circuit board positioning exposure device and positioning exposure method |
| 07/21/2010 | CN101782719A Ink-jet resisting agent |
| 07/21/2010 | CN101781790A Method and electrolytic bath for reducing thickness of metal layer of base plate |
| 07/21/2010 | CN101781789A Method and electrolytic bath for polishing metal layer of base plate |
| 07/21/2010 | CN101780614A Imidazole derivative solution capable of being used as organic solderability preservative |
| 07/21/2010 | CN101780605A Wave-soldering brazing filler metal active agent |
| 07/21/2010 | CN101780575A Wave-soldering tin-soldering spout device and wave-soldering soldering system |
| 07/21/2010 | CN101364115B Nitrogen closed-loop control method and system |
| 07/21/2010 | CN101309559B Multi-layer printed circuit board, design method thereof, and final product of mainboard |
| 07/21/2010 | CN101160019B Wiring board |
| 07/21/2010 | CN101056501B Circuit board and manufacturing method thereof |
| 07/21/2010 | CN101052269B Wired circuit board and production method thereof |
| 07/20/2010 | US7760470 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 07/20/2010 | US7759613 Reflowing apparatus and reflowing method |
| 07/20/2010 | US7759581 Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 07/20/2010 | US7759240 Use of palladium in IC manufacturing with conductive polymer bump |
| 07/20/2010 | US7759002 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
| 07/20/2010 | US7758759 Solidifying the printed etch-resist ink carrier vehicle including one or more preferably two metal chelating compounds by cooling and then removing the exposed metal or alloy by chemical etching; the ink has a viscosity of not greater than 30 cPs (mPa*s) at the firing temperature |
| 07/20/2010 | US7758222 Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| 07/20/2010 | US7758166 Inkjet nozzle with paddle layer sandwiched between first and second wafers |
| 07/20/2010 | US7757929 Methods for manufacturing optical modules having an optical sub-assembly |
| 07/20/2010 | US7757631 Apparatus for forming a circuit |
| 07/20/2010 | US7757628 System for depositing electronically interactive liquefied material onto a support surface |
| 07/20/2010 | US7757464 Manufacturing method for packaging electronic products in a band-shaped package |
| 07/20/2010 | US7757393 Capacitive microaccelerometers and fabrication methods |
| 07/20/2010 | US7757392 Method of producing an electronic component |
| 07/20/2010 | US7757391 Method for applying viscous medium on a substrate |
| 07/20/2010 | US7757390 Method for production of a semiconductor component |
| 07/20/2010 | US7757389 Method of manufacturing an ultrasonic probe |
| 07/20/2010 | CA2289239C Formation of thin film capacitors |
| 07/15/2010 | WO2010080750A1 Headliner with integral wire harness |
| 07/15/2010 | WO2010078907A1 Functional material for printed electronic components |
| 07/15/2010 | WO2010078611A1 Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element |
| 07/15/2010 | WO2010036075A3 Cliche for off-set printing and product manufactured using the same |
| 07/15/2010 | WO2010035235A3 Transferring assembly and method for transferring a radiofrequency identification device onto an object |