| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/02/2010 | DE102009003495A1 Soldering process for electric connection of connectors with solar cell, comprises electrically connecting a metallic connector extending itself in a stretching device, on an electrode contact of the solar cell |
| 09/02/2010 | DE102009001221A1 Druckverfahren zur Herstellung individualisierter elektrischer und/oder elektronischer Strukturen Printing process for making individualized electrical and / or electronic structures |
| 09/01/2010 | EP2224797A1 Method for forming elecroconductive thin line |
| 09/01/2010 | EP2224796A1 Method for producing a metal structure on a substrate |
| 09/01/2010 | EP2224795A1 Method for producing a metal structure on a substrate |
| 09/01/2010 | EP2224794A1 Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| 09/01/2010 | EP2224541A1 Electrical connector |
| 09/01/2010 | EP2223982A2 Circuit connection material, circuit member connecting structure and method of connecting circuit member |
| 09/01/2010 | EP2223771A1 Flux for soldering and soldering paste composition |
| 09/01/2010 | EP2223581A1 Method for making an electric interconnection between two conducting layers |
| 09/01/2010 | EP2223580A1 Panelizing method for printed circuit board manufacturing |
| 09/01/2010 | EP2223324A1 Patterning a thick film paste in surface features |
| 09/01/2010 | EP2163145B1 Electronic module and method for producing an electronic module |
| 09/01/2010 | EP1985162B1 Holder for a flexible circuit board |
| 09/01/2010 | EP1719073B1 Method for producing rfid labels |
| 09/01/2010 | EP1309976B1 Photolithographically-patterned out-of-plane coil structures |
| 09/01/2010 | CN201571260U Electronic element automatic pin fishing and cutting equipment |
| 09/01/2010 | CN201571259U HF flushing device for panel |
| 09/01/2010 | CN201571258U Needle clearance correction device |
| 09/01/2010 | CN201571253U High-layer circuit board |
| 09/01/2010 | CN201565997U Slotted hole punching die of integrated circuit board |
| 09/01/2010 | CN201565688U Automatic repair welding device |
| 09/01/2010 | CN201565514U Universal PCB die and a special PCB structure thereof |
| 09/01/2010 | CN1997266B Resetting method for bad cascaded printed circuit board and its system |
| 09/01/2010 | CN1988767B Method for mounting chip component and circuit board |
| 09/01/2010 | CN1976557B Circuit board device and method for board-to-board connection |
| 09/01/2010 | CN1914001B Soldering flux and soldering method for soft soldering |
| 09/01/2010 | CN1886031B Method for forming fine patterns using soft mold |
| 09/01/2010 | CN101822132A Substrate with semiconductor element mounted thereon |
| 09/01/2010 | CN101821352A Adhesive and connecting structure using the same |
| 09/01/2010 | CN101820731A Method for processing blind hole with ultraviolet laser |
| 09/01/2010 | CN101820730A Method for preparing printed wiring board by selectively plating gold |
| 09/01/2010 | CN101820729A PCB depth-control machining method and device thereof |
| 09/01/2010 | CN101820728A Technological method for processing printed circuit board (PCB) with stepped groove |
| 09/01/2010 | CN101820726A Circuit board module and connection port collection board |
| 09/01/2010 | CN101820724A Circuit board |
| 09/01/2010 | CN101820721A Circuit board, base material for same and manufacture method of same |
| 09/01/2010 | CN101820718A Solder resist coating for rigid-flex circuit board |
| 09/01/2010 | CN101600305B Wave crest tin soldering machine, wave crest nozzle thereof and tin furnace |
| 09/01/2010 | CN101472396B Tool and method for drawing incising line of circuit board wiring diagram |
| 09/01/2010 | CN101395522B Component bonding method and component bonding device |
| 09/01/2010 | CN101386070B Silver powder |
| 09/01/2010 | CN101356642B Printed-circuit board, and method for manufacturing the same |
| 09/01/2010 | CN101351089B ACF drawing peeling mechanism and method for ACF-providing apparatus |
| 09/01/2010 | CN101350324B Packaging method and system of electric component |
| 09/01/2010 | CN101246871B Multi-layer ceramic substrate and its preparing process |
| 09/01/2010 | CN101188905B Method of producing printed circuit board incorporating resistance element |
| 09/01/2010 | CN101160023B Method for manufacturing cover lay of printed circuit board |
| 09/01/2010 | CN101111123B Hybrid multilayer circuit board and its manufacturing method |
| 09/01/2010 | CN101102647B Plasma semi-additive process method for manufacturing pcb |
| 09/01/2010 | CN101069459B Multilayer printed wiring board and process for producing the same |
| 09/01/2010 | CN101026269B Flat earth terminal and method of surface-mounting same |
| 09/01/2010 | CN101024353B Method of forming piezoelectric actuator of inkjet head |
| 09/01/2010 | CN101022911B Solder paste dispenser for a stencil printer |
| 08/31/2010 | US7786002 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies |
| 08/31/2010 | US7785708 Adhesive film for circuit connection, and circuit connection structure |
| 08/31/2010 | US7784177 Method of manufacturing an image drum |
| 08/26/2010 | WO2010096513A1 Electrical connector assembly with back plate |
| 08/26/2010 | WO2010096456A1 Electrical isolating structure for conductors in a substrate |
| 08/26/2010 | WO2010095738A1 Starting liquid for forming protective film, protective film, and wired substrate having protective film |
| 08/26/2010 | WO2010095723A1 Conductive substrate |
| 08/26/2010 | WO2010095672A1 Metal thin film production method and metal thin film |
| 08/26/2010 | WO2010095311A1 Pressure-bonding method and pressure-bonding apparatus |
| 08/26/2010 | WO2010095211A1 Method for manufacturing module with built-in component |
| 08/26/2010 | WO2010095210A1 Method for manufacturing module with built-in component |
| 08/26/2010 | WO2010095208A1 Module with built-in component and method for manufacturing the module |
| 08/26/2010 | WO2010094347A1 Improved substrate support material useful for screen printing processes |
| 08/26/2010 | WO2010094345A1 Autotuned screen printing process |
| 08/26/2010 | WO2010094344A1 Method and apparatus for screen printing a multiple layer pattern |
| 08/26/2010 | WO2010067977A3 Method for manufacturing a printed circuit board |
| 08/26/2010 | US20100216283 Electronic device and lead frame |
| 08/26/2010 | US20100215982 Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite |
| 08/26/2010 | US20100215843 Method and apparatus for applying electronic circuits to curved surfaces |
| 08/26/2010 | US20100215840 METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn |
| 08/26/2010 | US20100215839 Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits |
| 08/26/2010 | US20100214753 Pb-free solder-connected structure and electronic device |
| 08/26/2010 | US20100214752 Multilayer wiring board and method for manufacturing the same |
| 08/26/2010 | US20100214750 Electronics module comprising an embedded microcircuit |
| 08/26/2010 | US20100214748 Metal roof truss connector assembly |
| 08/26/2010 | US20100214741 Electronic component mounting structure and electronic component mounting method |
| 08/26/2010 | US20100214041 Coupled Microstrip Lines with Tunable Characteristic Impedance and Wavelength |
| 08/26/2010 | US20100213581 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin |
| 08/26/2010 | US20100213040 Switch structure on sidewall of circuit board for electronic device and manufacturing method of the circuit board |
| 08/26/2010 | US20100212946 Wiring board and method for manufacturing the same |
| 08/26/2010 | US20100212943 Circuit connection material, circuit member connecting structure and method of connecting circuit member |
| 08/26/2010 | US20100212940 Soldermask-less printed wiring board |
| 08/26/2010 | US20100212153 Method for Fabricating a Bond |
| 08/26/2010 | US20100212152 Multilayer substrate with built-in chip-type electronic component and method for manufacturing the same |
| 08/26/2010 | US20100212151 Electronic component mounting system and operation instruction method for use with the same |
| 08/26/2010 | US20100212150 Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same |
| 08/26/2010 | US20100212149 Light and process of manufacturing a light |
| 08/26/2010 | DE4401616B4 Keramische Mehrfachschichten-Verdrahtungskarte Ceramic multi-layer wiring board |
| 08/26/2010 | DE112008002725T5 Verfahren und Vorrichtung zum Versorgen mit elektrischem Strom Method and device for supplying electric current |
| 08/26/2010 | DE10344494B4 Störschutzverfahren für Motorsteuerungsmodule Störschutzverfahren for engine control modules |
| 08/26/2010 | DE102010005465A1 Electrical or electronic component e.g. integrated circuit, has metallic contact layer arranged on solid metallic socket and forming structure e.g. micro structure, including elevations and slots with height of specific value |
| 08/26/2010 | DE102009009813A1 Lötverfahren und Schaltung Soldering and circuit |
| 08/25/2010 | EP2222149A1 Electronic component mounting structure and electronic component mounting method |
| 08/25/2010 | EP2222148A1 Rollers for transporting thin substrate and chemical treatment method using the same |
| 08/25/2010 | EP2222146A1 Circuit connecting material and structure for connecting circuit member |
| 08/25/2010 | EP2221161A1 Hot-pressing cushion material, and method for manufacturing laminated plate |