Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2010
09/16/2010US20100230148 Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element
09/16/2010US20100230145 Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias
09/16/2010US20100230141 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
09/16/2010US20100230139 Printed circuit boards by massive parallel assembly
09/16/2010US20100230137 Method for manufacturing conductive pattern forming body
09/16/2010US20100229384 Flexible Electrode Array for Artificial Vision
09/16/2010US20100229383 Wafer level test probe card
09/16/2010US20100229382 Method of attaching an electronic device to an mlcc having a curved surface
09/16/2010US20100229375 Method for manufacturing integrated circuit device having antenna conductors
09/16/2010DE102010002540A1 Platine, IC-Karte mit der Platine und Herstellungsverfahren hierfür Board, IC card with the printed circuit board and manufacturing method thereof
09/16/2010DE102008058287B4 Elektronisches Modul mit einem Dichtelement und Verfahren zum Herstellen des Moduls An electronic module with a sealing element and method of manufacturing of the module
09/16/2010DE102004001763B4 Magnetooptischer Kopf The magneto-optical head
09/16/2010DE10125577B4 Kontaktier-Heizvorrichtung Kontaktier heater
09/15/2010EP2229041A1 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
09/15/2010EP2228803A2 Non-metallic, integrated sensor-interconnect device
09/15/2010EP2228596A1 Optical semiconductor device, socket, and optical semiconductor unit
09/15/2010EP2228138A1 Device for coating a substrate
09/15/2010EP2227928A1 Method for producing an electrical conductor by applying at least one paste, in particular thick-film paste
09/15/2010EP2227927A1 Parts made of electrostructural composite material
09/15/2010EP2227818A2 Thermal safety device
09/15/2010EP1547142B1 Selective connection in ic packaging
09/15/2010EP1211920B1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
09/15/2010EP1028180B1 Method for producing very small metal ball
09/15/2010CN201585207U Black oxide hanging basket of inner cores of printed circuit boards
09/15/2010CN201585206U Pin locator of bendcutting printed board connector
09/15/2010CN201585205U Hot air leveling machine
09/15/2010CN201585204U Circuit board part rack
09/15/2010CN201585203U Contraposition fixture
09/15/2010CN201585202U Automatic laser tapping machine
09/15/2010CN201582163U Defoaming device
09/15/2010CN201579539U PCB/FPC laser cutting machine
09/15/2010CN201579512U Guide plate of crest welder
09/15/2010CN1968566B Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board
09/15/2010CN1938456B Copper foil and its manufacturing method
09/15/2010CN1717149B Circuitized substrate
09/15/2010CN101836520A Wiring board with built-in component and method for manufacturing wiring board with built-in component
09/15/2010CN101836519A Flex-rigid wiring board and method for manufacturing the same
09/15/2010CN101836518A Ceramic multilayer substrate
09/15/2010CN101836517A Wiring board receiving plate, and device and method for connection of wiring board using same
09/15/2010CN101836516A A method of soldering components on circuit boards and corresponding circuit board
09/15/2010CN101836515A Anisotropically conductive adhesive
09/15/2010CN101836514A Negative imaging method for providing a patterned metal layer having high conductivity
09/15/2010CN101836512A Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media
09/15/2010CN101836333A Conductive particle, circuit connecting material, and connection structure
09/15/2010CN101836268A Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
09/15/2010CN101836264A Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
09/15/2010CN101835859A Circuit connecting material, connection structure and method for producing the same
09/15/2010CN101835351A Manufacture process of sectional golden finger
09/15/2010CN101835350A PCB connector strengthening method and device
09/15/2010CN101835349A Reflow soldering method
09/15/2010CN101835348A CCD (Charge Coupled Device) galvanometer type laser welding device and method
09/15/2010CN101835347A Printed circuit board assembly and manufacturing method thereof
09/15/2010CN101835346A Nickel-gold electroplating process of PCB
09/15/2010CN101835345A Regulation handle
09/15/2010CN101835344A Dripping device
09/15/2010CN101835343A Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board
09/15/2010CN101835342A Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
09/15/2010CN101831248A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831247A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831246A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101830365A PCB receiving machine push rod with adjustable thrust
09/15/2010CN101829660A Substrate conveying device
09/15/2010CN101483975B Manufacturing method for planar resistor printed board with thick metal plated on circuit surface
09/15/2010CN101287334B Manufacturing method of highly heat conductive circuit base board
09/15/2010CN101271883B Production method of circuit substrates and inductor wire
09/15/2010CN101263751B Process for molding circuit component
09/15/2010CN101212866B Module
09/15/2010CN101115865B Method for depositing palladium layers and palladium bath therefor
09/15/2010CN101103657B Lead wire connection method for touch panel
09/15/2010CN101031198B Parts supply device
09/14/2010USRE41669 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
09/14/2010US7796845 Circuit board and method for manufacturing the same
09/14/2010US7796400 Modular integrated circuit chip carrier
09/14/2010US7795995 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
09/14/2010US7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
09/14/2010US7795624 Support body for semiconductor element, method for manufacturing the same and semiconductor device
09/14/2010US7795542 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/14/2010US7795325 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
09/14/2010US7795076 Method, system, and apparatus for transfer of dies using a die plate having die cavities
09/14/2010US7794785 Cleaning method, storage method, pattern formation method, device manufacturing method, electro-optical device, and electronic apparatus
09/14/2010US7794053 Inkjet printhead with high nozzle area density
09/14/2010US7793413 Method of mounting electronic components
09/14/2010US7793412 Component-embedded board fabrication method
09/14/2010US7793411 Method for manufacturing electronic substrate
09/14/2010US7793410 Method of making a plurality of flow sensors
09/12/2010CA2695854A1 Metal nanoparticle composition with improved adhesion
09/10/2010WO2010101912A1 Method and apparatus for manufacturing mosaic tape for use in communication cable
09/10/2010WO2010101822A1 Multilayer film for electronic circuitry applications and methods relating thereto
09/10/2010WO2010101167A1 Semiconductor device and method for manufacturing same
09/10/2010WO2010101163A1 Substrate with built-in functional element, and electronic device using the substrate
09/10/2010WO2010100931A1 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
09/10/2010WO2010100864A1 Method for manufacturing electronic circuit module
09/10/2010WO2010100855A1 Mounted structure and motor
09/10/2010WO2010100812A1 Printed circuit board, electronic device, and method of producing printed circuit board
09/10/2010WO2010099999A1 Method for embedding an electric assembly
09/10/2010CA2753384A1 Method and apparatus for manufacturing mosaic tape for use in communication cable
09/09/2010US20100227101 Peeling Sheet With Adhesive of Epoxy Acrylate, Non-Unsaturated Resin and Bis(methacryloyloxyethyl) Hydrogen Phosphate
09/09/2010US20100226110 Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same
09/09/2010US20100226108 Printed circuit board and method of manufacturing printed circuit board
09/09/2010US20100226101 Multi-Part Substrate Assemblies for Low Profile Portable Electronic Devices
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