Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2010
09/09/2010US20100224397 Wiring board and method for manufacturing the same
09/09/2010US20100224391 Suspension board with circuit and production method thereof
09/09/2010US20100224121 Apparatus for the coating of a substrate
09/09/2010US20100223784 Electronic substrate, manufacturing method for electronic substrate, and electronic device
09/09/2010US20100223783 System and Method for Assembly of a Processor and Socket on an Information Handling System Printed Circuit Board
09/09/2010DE102010005249A1 Verfahren zum Demontieren eines elektronischen Bauelementes Procedures for dismantling an electronic component
09/09/2010DE102009011553A1 Isolierpasten Isolierpasten
09/09/2010DE102009011538A1 Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
09/09/2010DE102009001373A1 Verfahren zum Einbetten einer elektrischen Baugruppe A method of embedding an electrical component
09/09/2010DE102005056892B4 Elektronikmodul für eine Systemplatine mit Durchgangslöchern und Verfahren zur Herstellung und Kühlung eines derartigen Elektronikmoduls Electronic module for a system board with through holes and methods for producing and cooling of such electronic module
09/08/2010EP2227076A1 Multilayer circuit board and production method thereof and communication device
09/08/2010EP2227075A1 Forming method of metallic pattern and metallic pattern
09/08/2010EP2227071A2 Ignition device for a high pressure gas discharge lamp
09/08/2010EP2226747A2 Circuit assembly and method and device for creating a wiring pattern on a substrate
09/08/2010EP2226410A1 Etchant and replenishment solution for producing copper wiring
09/08/2010EP2226346A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board
09/08/2010EP2225807A1 Method for contacting a rigid circuit board to a contact partner and arrangement of a rigid circuit board and contact partner
09/08/2010EP2225796A1 Method for producing an antenna system
09/08/2010EP1774841B1 Method for the production of a metal-ceramic substrate
09/08/2010EP1405278B1 Identification device comprising a transponder and a discontinuously metallised retroreflective or holographic image field and method of making such a device
09/08/2010CN201577238U Single-sided flexible circuit board
09/08/2010CN201577237U Copper bar aligning equipment
09/08/2010CN201572980U Backstroke soldering machine
09/08/2010CN1976560B Core substrate and multiplayer printed circuit board using paste bump and method of manufacturing thereof
09/08/2010CN1946267B Embedding method for printed circuit board and printed circuit board
09/08/2010CN1924599B Conduction checking device and method for printed base plate
09/08/2010CN1871884B Support element for a second printed circuit board arranged on a first circuit board
09/08/2010CN1829418B Method and apparatus for perforating printed circuit board
09/08/2010CN1819746B Wired circuit board and producing method thereof
09/08/2010CN1636796B Connecting structure between busbar base and printed circuit board
09/08/2010CN101827958A Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit substrate
09/08/2010CN101827957A Metal covered polyimide composite, process for producing the composite, and apparatus for producing the composite
09/08/2010CN101827876A Resin composition
09/08/2010CN101827502A Environment-friendly preparation method of multilayer circuit board and special device thereof
09/08/2010CN101827501A Through-hole backflow welding technology and relevant template and jig
09/08/2010CN101827500A Formation method of conical structural hole
09/08/2010CN101827499A Circuit board printing method for preventing carbon oil leakage short circuit and circuit board
09/08/2010CN101827498A Alignment process of matrix-shaped laser drilling blind hole of circuit board
09/08/2010CN101827497A Automatic loading and unloading system of vertical plating through hole wire plugging bracket in industry of printed circuit boards
09/08/2010CN101827496A Method for machining PCB with step groove
09/08/2010CN101827495A Composite metal foil and manufacturing method thereof and printed wiring board
09/08/2010CN101827494A Wiring board and method for manufacturing the same
09/08/2010CN101827493A Combination of chip and circuit board and assembly method for chip
09/08/2010CN101827492A Circuit board module, manufacturing method thereof and electronic device applying same
09/08/2010CN101827490A Multilayer printed wiring board
09/08/2010CN101826496A Printed wiring board and manufacturing method thereof
09/08/2010CN101826468A Method for manufacturing substrate
09/08/2010CN101826409A Side control structure of electronic structure and circuit board manufacturing method thereof
09/08/2010CN101824643A Harmomegathus difference-resistant plate fixing device for sheet manufactured by gantry electrofacing
09/08/2010CN101824634A Process for manufacturing circuit board
09/08/2010CN101823151A Waterborne through-hole silver paste and preparation method and application thereof
09/08/2010CN101459105B Manufacturing method for thin-film circuit or thin-film switch
09/08/2010CN101448372B Hot dip coating tin technology for preventing approach legs of SMT parts from bridging
09/08/2010CN101442880B Conversion method for layer-exchange hole-through conductive capability in PCB
09/08/2010CN101424706B Test anchor point making method and test anchor point and veneer
09/08/2010CN101400218B Method of interconnecting layers of a printed circuit board
09/08/2010CN101375648B Boring method and boring device
09/08/2010CN101375645B Substrate structure and electronic device
09/08/2010CN101370361B Method for manufacturing printed wiring board with embedded electric device
09/08/2010CN101341805B Structure and method of fixing electronic parts to circuit board
09/08/2010CN101331811B Composition for removing residue from wiring board and cleaning method
09/08/2010CN101299904B Electromagnetic bandgap structure and printed circuit board
09/08/2010CN101175378B Method of manufacturing circuit board
09/08/2010CN101094936B Microfabrication using patterned topography and self-assembled monolayers
09/08/2010CN101084703B Multilayer printed circuit board and method for manufacturing same
09/08/2010CN101037031B Method and apparatus for film adhesion
09/08/2010CN101009406B Backboard connector combination
09/07/2010US7791120 Circuit device and manufacturing method thereof
09/07/2010US7790508 constructing strip-like electrically conducting contacts on a semiconductor component such as a solar cell, by applying an electrically conducting paste-like substance containing a solvent adhering to a support and subsequent hardening of the substance
09/07/2010US7790354 dry film resist; flexible; insulating protective coating; electroless gold plating resistance; isocyanatoalkyl acrylate, unsaturated co-monomer, thermosetting epoxy, photopolymerization catalyst, polylactone
09/07/2010US7790269 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
09/07/2010US7790009 electrochemical pattern replication; master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating; for micro or nanostructure; sensors, flat panel display and printed circuit boards
09/07/2010CA2340889C Methods and apparatus for meter i/o board addressing and communication
09/02/2010WO2010099245A1 Space transformer connector printed circuit board assembly
09/02/2010WO2010098921A2 High speed autofocus interferometric inspection systems & methods
09/02/2010WO2010098485A1 Wiring board
09/02/2010WO2010098357A1 Metal filler, low-temperature-bonding lead-free solder and bonded structure
09/02/2010WO2010098354A1 Adhesive material reel
09/02/2010WO2010098276A1 Wiring board, electronic device package, and methods of production of the same
09/02/2010WO2010098239A1 Jet solder bath
09/02/2010WO2010098235A1 Metal-coated polyimide resin substrate with excellent thermal aging resistance properties
09/02/2010WO2010098183A1 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
09/02/2010WO2010098175A1 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
09/02/2010WO2010097991A1 Noise analysis design method
09/02/2010WO2010097835A1 Printed board and electronic device provided with printed board
09/02/2010WO2010097387A1 Multi-layer circuit carrier and method for the production thereof
09/02/2010WO2010097270A2 Printing method for producing individualized electric and/or electronic structures
09/02/2010WO2010097231A1 Apparatus and method for producing a conductive structured polymer film
09/02/2010WO2010097230A2 Method for producing a metal structure on a substrate
09/02/2010US20100221412 Method for manufacturing a substrate
09/02/2010US20100220970 Multiple quantum dot waveguides
09/02/2010US20100218978 Method of making an electrical circuit
09/02/2010US20100218891 Multi-layered interconnect structure using liquid crystalline polymer dielectric
09/02/2010US20100218372 Method of soldering components on circuit boards and corresponding circuit board
09/02/2010US20100218371 Manufacturing method for a wireless communication device and manufacturing apparatus
09/02/2010US20100218364 Packaging substrate having pattern-matched metal layers
09/02/2010DE202010009091U1 Kontakteinrichtung zur Direktkontaktierung einer einsteckbaren Leiterplatte Contact device for direct contacting a pluggable PCB
09/02/2010DE202005021830U1 Einrichtung zur Erzeugung einer Beschichtung von Druckprodukten einer Druckmaschine mit modifizierbarer Tropfencharakteristik Means for generating a coating of printed products of a printing press with modifiable characteristic drops
09/02/2010DE102010002050A1 Leiterplatte mit daran befestigtem IC, Leiterplatte und Verfahren zur Fertigung der Leiterplatte mit daran befestigtem IC Circuit board with attached IC, PCB and method of manufacturing the circuit board with attached IC
09/02/2010DE102009010874A1 Mehrlagige Schaltungsanordnung und Verfahren zu deren Herstellung Multi-layer circuitry and methods for their preparation
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