Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2010
09/23/2010DE102009012627A1 Electrical component i.e. axial electrolytic capacitor, has two reflow-solderable component connections, where one of connections has device that concentrates heat at soldering point of component connection during reflow soldering
09/23/2010DE10105621B4 Elektrische Leiterplatte Electrical circuit board
09/22/2010EP2230892A1 Electro-magnetic sealing with solder bump array gasket on printed circuit board
09/22/2010EP2230891A1 Procedure for manufacture of printed circuit boards with high thermal conductibility base materials suitable for insertion on non-superficial components
09/22/2010EP2230890A1 Method for providing a conductive material structure on a carrier
09/22/2010EP2230328A1 Plating method, method for forming metal thin film, and plating catalyst liquid
09/22/2010EP2230073A1 Compression bonding device
09/22/2010EP1508261B1 Electronic assembly and method of making an electronic assembly
09/22/2010CN201590953U PCB surface treatment water removing facility
09/22/2010CN201590952U Welding-proof raising and positioning support leg
09/22/2010CN201590951U Plugboard frame specialized for printed circuit board
09/22/2010CN201590945U Damp-proof structure of circuit board
09/22/2010CN201590754U Surface mounted bending type rectifying bridge
09/22/2010CN201590304U Mounting structure of transformer used for LED TV and Monitor on PCB board
09/22/2010CN201589851U Circuit board detecting device
09/22/2010CN201588001U Plating fixture for printed circuit board
09/22/2010CN201586776U Processing cutting tool structure of printed circuit board
09/22/2010CN201586772U Lower padding plate used in hole-drilling process of printed circuit board
09/22/2010CN1972556B Via stub termination structures and methods for making same
09/22/2010CN1968567B Printed circuit board and method for manufacturing the same
09/22/2010CN1767721B Metal coated substrate and manufacturing method of the same
09/22/2010CN1678452B Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil
09/22/2010CN1617656B Treating method and treating device for electronic parts
09/22/2010CN101843181A Part built-in wiring board, and manufacturing method for the part built-in wiring board
09/22/2010CN101843180A Multi-piece substrate and method for manufacturing same
09/22/2010CN101842855A High temperature substrate protective structure
09/22/2010CN101842168A AEROSOL JET tm printing system for photovoltaic applications
09/22/2010CN101842166A Apparatus for anisotropic focusing
09/22/2010CN101841981A Interlayer welding system of multilayer printed circuit board
09/22/2010CN101841980A Method for forming a laminate
09/22/2010CN101841979A Metal clad laminated board
09/22/2010CN101841978A Method for manufacturing printed circuit board
09/22/2010CN101841977A Broken-line etching design method of soft printed circuit board electroplating lead
09/22/2010CN101841976A Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity
09/22/2010CN101841975A Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board
09/22/2010CN101841974A High-thermal conductivity circuit board and method for producing same by using electroplating method
09/22/2010CN101841973A High-thermal conductivity circuit board preparation method based on metal base and circuit board
09/22/2010CN101841972A Method for manufacturing high-AR and fine-line PCB
09/22/2010CN101841971A Auxiliary materials for lamination of flexibility circuit board and lamination process of same
09/22/2010CN101841970A Printed circuit board and electronic device having same
09/22/2010CN101841968A Circuit board with step-shaped blind hole and manufacturing method
09/22/2010CN101840898A Multilayer printed wiring board
09/22/2010CN101837497A Welding flux feeding device
09/22/2010CN101541141B Printed circuit board and method for avoiding electric short circuit
09/22/2010CN101483977B Circuit board and manufacturing method thereof
09/22/2010CN101442881B Method for joining electrode
09/22/2010CN101442876B Circuit board
09/22/2010CN101442875B Circuit board with multilayer welding-proof structure
09/22/2010CN101352109B Printed wiring board and process for producing the same
09/22/2010CN101347058B Method of producing multilayer ceramic substrate
09/22/2010CN101336047B Method for printing circuit board and combination thereof
09/22/2010CN101330798B System for processing overlapping membrane
09/22/2010CN101277591B Inner embedded type circuit board and method for manufacturing the same
09/22/2010CN101198477B Screen printing plate and screen printer and solar battery
09/22/2010CN101155475B Substrate manufacturing method, control substrate and projection apparatus
09/22/2010CN101147217B Electronic component module
09/22/2010CN101132668B Solder-paste coating method and instrument thereof
09/22/2010CN101102865B Baffle plate, hot air blower for solder treatment, and nozzle for the device
09/21/2010USRE41732 Liquid crystal display device video having signal driving circuit mounted on one side
09/21/2010US7801396 Optoelectric composite substrate and method of manufacturing the same
09/21/2010US7800918 Hierarchical module
09/21/2010US7800908 Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink
09/21/2010US7800216 Multilayer printed wiring board
09/21/2010US7800209 Wiring board with conductive wirings and protrusion electrodes
09/21/2010US7800078 Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
09/21/2010US7800002 Multilayer wiring board
09/21/2010US7799865 shelf life stability; coating is applied by vapor deposition; curable coated-conductive particles are dispersed within curable component; anisotropically conductive bond formed by the cure
09/21/2010US7799615 Power converter package and thermal management
09/21/2010US7799408 Conductive powder, conductive composition, and producing method of the same
09/21/2010US7797826 Method of power-ground plane partitioning to utilize channel/trenches
09/21/2010US7797825 Method of making an electrochemical sensor
09/21/2010US7797824 Printed circuit board and method for decreasing impedance of a power source thereof
09/21/2010US7797823 High density component assembly method and apparatus
09/21/2010US7797820 Component mounting apparatus
09/21/2010CA2441347C Heat radiating fin and heat radiating method using the same
09/16/2010WO2010104116A1 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
09/16/2010WO2010103939A1 Etching device and etching method
09/16/2010WO2010103918A1 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
09/16/2010WO2010103875A1 Electric circuit apparatus
09/16/2010WO2010103805A1 Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
09/16/2010WO2010103749A1 Jig for plating
09/16/2010WO2010103723A1 Board with built-in function element, method of producing same, and electronic equipment
09/16/2010WO2010103722A1 Circuit board
09/16/2010WO2010103721A1 Circuit board
09/16/2010WO2010103696A1 Electronic circuit and electronic device
09/16/2010WO2010103695A1 Method for manufacturing module with built-in component and module with built-in component
09/16/2010WO2010102315A1 Method and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element
09/16/2010WO2010081833A3 Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
09/16/2010WO2010077014A3 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board
09/16/2010US20100232744 Substrate for mounting ic chip, manufacturing method of substrate for mounting ic chip, device for optical communication, and manufacturing method of device for optical communication
09/16/2010US20100232127 Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device
09/16/2010US20100232121 Interconnect for Printed Board Assembly
09/16/2010US20100231638 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231637 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231636 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231545 Touch panel and method for producing the same
09/16/2010US20100231543 Display device with touch sensor function, manufacturing method of display device with touch sensor function, and electronic apparatus
09/16/2010US20100231292 Ultra-low power hybrid circuits
09/16/2010US20100230473 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL
09/16/2010US20100230151 Circuit layout and method and device for producing a circuit pattern on a substrate
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