Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2010
10/13/2010EP1008668B1 Apparatus for manufacturing thin film
10/13/2010CN201609011U 用于波峰焊的防漏件检查装置 Leakproof member inspection apparatus for soldering
10/13/2010CN201608988U 电路板叠板用叠板台 Circuit boards stacked pallets stacked board
10/13/2010CN201608987U 印刷电路板组件的夹持支架 Clamping bracket printed circuit board assembly
10/13/2010CN201608986U 焊接sim卡座用固定装置 Welding sim card with fixtures
10/13/2010CN201608985U 一种框型夹具及与电路板的组合 A combination of box-type fixtures and circuit board
10/13/2010CN201608984U 用于贴片机的支撑顶针组件 Support for thimble component placement machine
10/13/2010CN201608983U 一种smt用治具 One kind smt with fixture
10/13/2010CN201608982U 印刷电路板分板装置 Printed circuit board sub-board device
10/13/2010CN201608981U 一种锣板辅助模具 One kind of gong plate auxiliary mold
10/13/2010CN201608980U 一种应用于osp板子前处理线上的烘干装置 Applied to osp board pre-treatment line drying apparatus
10/13/2010CN201608979U 印刷电路板的贴合材预贴装置 A printed circuit board laminating apparatus of wood pre-paste
10/13/2010CN201608978U 挠性印制电路板贴胶治具 Flexible printed circuit board fixture gum paste
10/13/2010CN201608977U 内置超声波的制作印制电路板的烘箱 Built-in ultrasound production of printed circuit board in an oven
10/13/2010CN201608976U 自动翻转装置 Automatic turning device
10/13/2010CN201608974U 机械钻孔板 Mechanical drilling plate
10/13/2010CN201608965U 全印刷印制电路板 Fully printed printed circuit board
10/13/2010CN201608278U 电连接器的连接结构 Electrical connector structure
10/13/2010CN1960621B Circuit board supplying device, circuit board rolling device, circuit board processing system, circuit board supplying method and circuit board rolling method
10/13/2010CN1939102B Carrier substrate with a thermochromatic coating
10/13/2010CN1910972B Nozzle arrangement and method for processing a material for processing with a processing medium
10/13/2010CN1899005B Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same
10/13/2010CN1890604B Device and method for large area lithography
10/13/2010CN1842248B Off-grid decoupling device and method of ball grid array (BGA)
10/13/2010CN1838251B Apparatus and method for reducing solder pad size in an electrical lead suspension
10/13/2010CN1791310B Method for manufacturing a laminated board
10/13/2010CN1750734B Circuit board and method of manufacturing the same
10/13/2010CN1732291B Lead free bump and method of forming the same
10/13/2010CN1704848B Exposure device
10/13/2010CN1575100B Method for drilling process
10/13/2010CN1525492B Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
10/13/2010CN101861763A Component with bonding adhesive
10/13/2010CN101861647A Process for producing substrate for power module, substrate for power module, and power module
10/13/2010CN101861059A Method for manufacturing laminated ceramic electronic component
10/13/2010CN101861058A Method of PCB board processing technology
10/13/2010CN101861057A Method for manufacturing printed circuit board
10/13/2010CN101861056A Method for processing high-density integrated circuit
10/13/2010CN101861055A Method of PCB board processing technology
10/13/2010CN101861054A Method for removing goldplated plug lead wires
10/13/2010CN101861053A Component switching device
10/13/2010CN101861049A Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
10/13/2010CN101859213A Making method of capacitor-type touch panel
10/13/2010CN101858871A PCB board detecting method
10/13/2010CN101856770A Hot pressing head
10/13/2010CN101494953B Preparation method of double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit
10/13/2010CN101483990B Micro heat exchange system used in reflux welding furnace heating zone
10/13/2010CN101436575B Semiconductor package and mounting method thereof
10/13/2010CN101384436B Screen printing apparatus and screen printing method
10/13/2010CN101360388B Electricity connection terminal construction of circuit board and preparation thereof
10/13/2010CN101351084B Circuit board and metal surface treatment technique thereof
10/13/2010CN101335235B Method for dicing substrate
10/13/2010CN101304880B Screen printing apparatus and screen printing method
10/13/2010CN101267715B Multilayer build-up wiring board
10/13/2010CN101252091B Forming method of sliver hole on substrate and substrate structure
10/13/2010CN101146410B Base plate cleaning device
10/13/2010CN101115347B Printing distributing board and method for manufacturing same
10/13/2010CN101103057B Curable resin composition for ink-jet printing, cured object obtained therefrom, and printed wiring board using the same
10/13/2010CN101093366B Conveyer
10/13/2010CN101083877B Multi-head buried welding integration machine and its method for buried welding
10/13/2010CN101048031B Printing plate, printing board, and printing method for printed board
10/13/2010CN101008614B Method of monitoring depositing temperature of cu seed layer and method for forming cu layer by using the same
10/12/2010US7813796 Biocompatible bonding method and electronics package suitable for implantation
10/12/2010US7812262 Multilayer printed circuit board
10/12/2010US7812261 Multilayer printed wiring board and test body for printed wiring board
10/12/2010US7811523 Microfluidic analytical apparatus
10/12/2010US7811427 Monolithic structures including alignment and/or retention fixtures for accepting components
10/12/2010US7810702 Solder standoffs for injection molding of solder
10/12/2010US7810234 Method of forming a thin film capacitor
10/12/2010US7810233 System of fabricating a flexible electrode array
10/12/2010US7810232 Method of manufacturing a circuit board
10/12/2010CA2417172C Plant cultivating method, cultivating device, and its lighting device
10/12/2010CA2400928C Laser deposition of elements onto medical devices
10/07/2010WO2010114482A1 Long thermode assembly
10/07/2010WO2010114272A2 Low temperature fireable paste composition for forming an electrode or wiring
10/07/2010WO2010113806A1 Printed circuit board, manufacturing method therefor, multilayer printed circuit board, and semiconductor package
10/07/2010WO2010113744A1 Agent for removing conductive film and method for removing conductive film
10/07/2010WO2010113646A1 Surface treatment agent
10/07/2010WO2010113637A1 Solar cell printing device
10/07/2010WO2010113539A1 Circuit board
10/07/2010WO2010113448A1 Manufacturing method for circuit board, and circuit board
10/07/2010WO2010113367A1 Bonded body and method for manufacturing same
10/07/2010WO2010112504A1 Method for structuring a multi-layer film
10/07/2010WO2010112000A1 Metal/ceramic substrate
10/07/2010WO2010082105A3 Drilling head for printed circuit boards
10/07/2010WO2010077069A3 Plastic composition, and prepreg and printed circuit board using the same
10/07/2010WO2010077015A3 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board
10/07/2010WO2009030284A8 Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit
10/07/2010US20100255722 Sealed pin header, pin header contact pin and method for providing a sealed electrical connection between electronic devices
10/07/2010US20100255691 Cww3 connectors with wipe
10/07/2010US20100255688 Rf connector mounting means
10/07/2010US20100255286 Method for manufacturing resin substrate
10/07/2010US20100254666 Manufacturing method of opto-electric hybrid module and opto-electric hybrid module obtained thereby
10/07/2010US20100254113 Electronic board, method of manufacturing the same, and electronic device
10/07/2010US20100253435 Rf power amplifier circuit utilizing bondwires in impedance matching
10/07/2010US20100252311 Terminal assembly with regions of differing solderability
10/07/2010US20100252309 Polyimide film and wiring board
10/07/2010US20100252306 Interconnect substrates, methods and systems thereof
10/07/2010US20100252304 Wiring board and method of manufacturing the same
10/07/2010US20100252303 Circuit board and manufacturing method thereof
10/07/2010US20100251544 Manufacturing method of a flexible printed circuit board
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