Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2010
10/21/2010US20100265456 Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles
10/21/2010US20100265153 Ku-band coaxial to microstrip mixed dielectric pcb interface with surface mount diplexer
10/21/2010US20100265011 Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufacture
10/21/2010US20100265005 PCB Mounted Directional Coupler Assembly
10/21/2010US20100264037 Method for Electrochemical Fabrication
10/21/2010US20100263923 Wiring substrate having columnar protruding part
10/21/2010US20100263922 Surface mounting chip carrier module
10/21/2010US20100263921 Circuit board and method of manufacturing the same
10/21/2010US20100263209 Electronic component mounting apparatus
10/21/2010US20100263208 Circuit connecting method
10/21/2010US20100263207 Panelizing Method for Printed Circuit Board Manufacturing
10/21/2010US20100263206 Producing method of wired circuit board
10/21/2010DE102009016368A1 Schaltungsträger mit elektrischen Leiterbahnen Circuit board fitted with electric conductors
10/21/2010DE10145396B4 Verfahren und Vorrichtung zum Aufbringen fluider Stoffe Method and apparatus for applying fluid materials
10/21/2010CA2758752A1 Method for conductively connecting a component on a transparent substrate
10/20/2010EP2242341A1 Process for producing structure with metal film, mother die for use in the process, and structure produced by the process
10/20/2010EP2241653A1 Composition and method for micro etching of copper and copper alloys
10/20/2010EP2240345A1 Light for vehicles
10/20/2010EP2240318A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element
10/20/2010EP1917844B1 Method for soldering smd components on a printed circuit board and reflow soldering furnace therefor
10/20/2010EP1752997B1 Inductor
10/20/2010EP1626867B1 Screen printing apparatus and screen printing method
10/20/2010CN201611981U 化金挂篮 Hanging Basket of Gold
10/20/2010CN201611404U 前处理线光学反光镜装置 Pre-treatment line optical mirror device
10/20/2010CN1975950B Sheet capacitor manufacturing method
10/20/2010CN101869008A Semiconductor device and multilayer wiring board
10/20/2010CN101869007A Electrical component mounting assemblies
10/20/2010CN101868563A Base processing agent for metal material and method for processing base for metal material
10/20/2010CN101868127A Preparation process of superconductive planar circuit
10/20/2010CN101868126A Electronic component mounting method
10/20/2010CN101868125A Method for preventing processed PCB board nickel-gold layer from being eroded
10/20/2010CN101868124A Circuit board stack structure for enhancing side soldering effect
10/20/2010CN101868123A Printed circuit board and design method thereof
10/20/2010CN101868122A PCB manufacturing process and hole plugging process thereof
10/20/2010CN101868121A Circuit board and method for forming connection part thereof
10/20/2010CN101868120A Printed wiring board and its manufacturing method
10/20/2010CN101868119A Flexible printed circuit board connecting structure body and manufacturing method thereof
10/20/2010CN101868118A High-frequency circuit substrate and production method thereof
10/20/2010CN101868116A Circuit board and manufacturing method thereof
10/20/2010CN101868115A Solder mask structure of heavy copper circuit board
10/20/2010CN101866248A Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof
10/20/2010CN101865682A Multilayer printed wiring board interlayer dislocation detection method
10/20/2010CN101864250A Surface mount adhesive for use in lead-free packaging process and preparation method
10/20/2010CN101864151A Flame retardant resin composition for highly peel-strenghthened printed circuit board, printed circuit board using the same and manufacturing method thereof
10/20/2010CN101863127A Method and apparatus for manufacturing substrates
10/20/2010CN101862896A Impulse heat-pressing head
10/20/2010CN101862895A Large-size hot-press head
10/20/2010CN101862875A Springboard mechanism
10/20/2010CN101389189B Circuit board producing method
10/20/2010CN101355850B Assembly substrate and method of manufacturing the same
10/20/2010CN101300909B A device for the high-speed drilling of boards for printed circuits
10/20/2010CN101001518B Installation system and installation method of electronic element
10/19/2010US7816780 Semiconductor apparatus and manufacturing method of semiconductor apparatus
10/19/2010US7816754 Ball grid array package construction with raised solder ball pads
10/19/2010US7816611 Circuit board
10/19/2010US7816247 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
10/19/2010US7816171 Component packaging apparatus, systems, and methods
10/19/2010US7815999 Insulated conductive particles and anisotropic conductive adhesive film containing the particles
10/19/2010US7815965 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
10/19/2010US7815441 Rigid-flexible board and method for manufacturing the same
10/19/2010US7815290 Inkjet printhead with paddle for ejecting ink from one of two nozzles
10/19/2010US7815122 Method for making an electronic label and electronic label obtained by said method
10/19/2010US7814650 Process of fabricating microelectronic structures
10/19/2010US7814649 Method of making circuitized substrate with filled isolation border
10/19/2010US7814648 Method of disposing an electronic device on an electrode formed on substrate
10/14/2010WO2010117383A1 Bonded hermetic feed through for an active implantable medical device
10/14/2010WO2010117371A1 Energy activated film and method of making the same
10/14/2010WO2010116976A1 Two-layer-copper-clad laminate and process for producing same
10/14/2010WO2010116868A1 Photosensitive resin composite and laminate thereof
10/14/2010WO2010116757A1 Solder resist composition, dry film using same, and printed wiring board
10/14/2010WO2010116664A1 Soldering device and method for managing soldering devices
10/14/2010WO2010116637A1 Electronic component mounting system and electronic component mounting method
10/14/2010WO2010116636A1 Electronic component mounting system and electronic component mounting method
10/14/2010WO2010115796A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
10/14/2010WO2010115774A1 A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
10/14/2010WO2010115757A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
10/14/2010WO2010115756A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
10/14/2010WO2010115746A1 Conductor grid for electronic housings and manufacturing method
10/14/2010WO2010115717A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
10/14/2010WO2010115603A1 Circuit carrier having electric conductive tracks
10/14/2010WO2010026571A3 Metal nanowire thin-films
10/14/2010US20100262214 Stitched components of an active implantable medical device
10/14/2010US20100261033 Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board
10/14/2010US20100259911 Magnetic microinductors for integrated circuit packaging
10/14/2010US20100259497 Integrated touch sensor electrode and backlight mask
10/14/2010US20100258949 Reduced Susceptibility To Electrostatic Discharge During 3D Semiconductor Device Bonding and Assembly
10/14/2010US20100258725 On-wafer butted microbolometer imaging array
10/14/2010US20100258341 Mounting board and method of producing the same
10/14/2010US20100257731 Device Suitable for Placing a Component on a Substrate, as well as Such a Method
10/14/2010DE102009016112A1 Device for wire bonding, has electrical components and electrical cable for electrical connection of electrical contact of one component with another component
10/14/2010DE102009015742A1 Electrically functional multi-layer foil system, has electrically conductive material arranged in passage hole to make electrically conductive connection between contact areas of foil substrates
10/14/2010DE102009002288A1 Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components
10/13/2010EP2240006A1 Ambient-curable anisotropic conductive adhesive
10/13/2010EP2240005A1 A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
10/13/2010EP2240004A1 Mounting aid for circuit board connector
10/13/2010EP2239142A1 Method for silk screen printing onto a conductor made of two superposed layers
10/13/2010EP2239131A1 Compression bonding device
10/13/2010EP2238815A2 Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening
10/13/2010EP2000013B1 Electrolytic method for filling holes and cavities with metals
10/13/2010EP1210848B1 Bidirectional interface tool for pwb development and method for customizing such a tool
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