| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/07/2010 | US20100251543 Multi-function module |
| 10/07/2010 | US20100251542 Electronic Device Comprising an Integrated Circuit and a Capacitance Element |
| 10/07/2010 | US20100251541 Wiring board receiving plate, and device and method for connection of wiring board using the same |
| 10/07/2010 | DE112008003405T5 Leiterplatte und Verfahren zum Aufbringen einer elektronischen Komponente auf einer Platine Printed circuit board and method for applying an electronic component on a circuit board |
| 10/07/2010 | DE10037183B4 Verfahren zum Verbinden von Leiterplatten und Verbindungsaufbau A method for connecting printed circuit boards and connection set-up |
| 10/06/2010 | EP2237652A1 Multilayer printed board and method for manufacturing the same |
| 10/06/2010 | EP2237651A1 Method for forming solder layer on printed-wiring board and slurry discharge device |
| 10/06/2010 | EP2237101A1 Liquid crystal module |
| 10/06/2010 | EP2236565A1 Low polarity nano silver gels |
| 10/06/2010 | EP2236017A1 Stacked foil sheet device |
| 10/06/2010 | EP2235768A2 Battery pack containing pcm employed with safety member |
| 10/06/2010 | EP2235741A1 Processing of electric and/or electronic elements on cellulosic material substrates |
| 10/06/2010 | EP2235667A1 Manufacture of a smart card |
| 10/06/2010 | EP1908339B1 Mounting electrical components |
| 10/06/2010 | EP1647051B1 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 10/06/2010 | EP1050888B1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| 10/06/2010 | CN201601903U 电路板叠板用叠板台 Board packs with pack station |
| 10/06/2010 | CN201601902U 波峰焊插件固定装置 Wave plug-in fixtures |
| 10/06/2010 | CN201601901U 电路板焊接工作台 Circuit board welding table |
| 10/06/2010 | CN201601900U 柔性电路板固持装置 Flexible circuit board holding device |
| 10/06/2010 | CN201601899U 电路板喷砂机喷盘快拆构造 Board sandblasting spray quick release plate tectonic |
| 10/06/2010 | CN201601898U 电路板组合机的夹持装置 Clamping device board combination machine |
| 10/06/2010 | CN201601897U 电路板对位机构 Board alignment mechanism |
| 10/06/2010 | CN201601896U 印制电路板制作中的活塞塞孔装置 Printed circuit board production in the hole means living Sese |
| 10/06/2010 | CN201601001U 变压器 Transformer |
| 10/06/2010 | CN201598343U 一种pcb板件电镀挂板夹具 One kind of peg board pcb board member plating jig |
| 10/06/2010 | CN201598342U 电路板电镀挂架 Circuit board plating rack |
| 10/06/2010 | CN201598332U 一种印制线路板微蚀液在线循环装置 One kind of printed circuit boards microetch fluid circulation device online |
| 10/06/2010 | CN201598324U 喷锡机 HAL machine |
| 10/06/2010 | CN201596831U 焊锡球针 Solder ball pin |
| 10/06/2010 | CN201596826U 焊锡球针 Solder ball pin |
| 10/06/2010 | CN1981566B Method for producing printed circuit board structures comprising via holes, electronic device unit, and use of a flexible strip conductor film in this device unit |
| 10/06/2010 | CN1960597B Hybrid multilayer circuit board and manufacture method thereof |
| 10/06/2010 | CN1900725B Lithographic contact elements |
| 10/06/2010 | CN1853113B A method of manufacturing an electronic device |
| 10/06/2010 | CN1821876B Solder resist ink composition |
| 10/06/2010 | CN1725933B Wired circuit forming board, wired circuit board, and thin metal layer forming method |
| 10/06/2010 | CN1717322B Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 10/06/2010 | CN1671273B Device with through-hole interconnection and method for manufacturing the same |
| 10/06/2010 | CN101855950A Method for forming elecroconductive thin line |
| 10/06/2010 | CN101855334A High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean |
| 10/06/2010 | CN101854779A Production process of metallized semi-pore |
| 10/06/2010 | CN101854778A Manufacturing process for plugging conductive holes of circuit board with resin |
| 10/06/2010 | CN101854777A Fabricating methods for special power electronic circuit board for power supply and power module |
| 10/06/2010 | CN101854775A Printed circuit board |
| 10/06/2010 | CN101854771A Printed wiring board |
| 10/06/2010 | CN101853794A Electronic components jointing method and salient point forming method and device |
| 10/06/2010 | CN101853789A Method for manufacturing golden finger of soldering-pan of flexible package carrying board |
| 10/06/2010 | CN101852991A Photosensitive composition, photosensitive film, photosensitive laminated body, permanent pattern forming method and printed board |
| 10/06/2010 | CN101852988A Photosensitive resin composition, and dry film and printed wiring board using the same |
| 10/06/2010 | CN101851769A Electrolytic copper foil, surface-treated electrolytic copper foil obtained by using the electrolytic copper foil, copper-clad laminate using the surface-treated electrolytic copper foil, and printed circuit board |
| 10/06/2010 | CN101850313A Scaling powder spraying control system and method |
| 10/06/2010 | CN101494181B Solder ball printing device |
| 10/06/2010 | CN101448362B Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same |
| 10/06/2010 | CN101442174B Method for welding electric external down-lead on electrode of ITO conductive glass |
| 10/06/2010 | CN101374384B Method for cutting adhesive membrane of circuit board |
| 10/06/2010 | CN101370375B Positioning device |
| 10/06/2010 | CN101356866B Method and apparatus for mounting solder ball |
| 10/06/2010 | CN101343771B Electroplating apparatus |
| 10/06/2010 | CN101267711B Printing circuit substrate and exhausting method thereof |
| 10/06/2010 | CN101189923B Pattern forming method and method for forming multilayer wiring structure |
| 10/06/2010 | CN101151579B Photosensitive resin composition and circuit substrate employing the same |
| 10/06/2010 | CN101009263B Printed circuit board for semiconductor package and method of manufacturing the same |
| 10/05/2010 | US7809465 Device, method and program for soldering |
| 10/05/2010 | US7809460 Coating and developing apparatus, coating and developing method and storage medium in which a computer-readable program is stored |
| 10/05/2010 | US7808109 Fretting and whisker resistant coating system and method |
| 10/05/2010 | US7807944 Laser processing device, processing method, and method of producing circuit substrate using the method |
| 10/05/2010 | US7807934 Printed circuit board having protection means and a method of use thereof |
| 10/05/2010 | US7807932 Printed circuit board and method for manufacturing the same |
| 10/05/2010 | US7807334 Substrate having fine line, electron source and image display apparatus |
| 10/05/2010 | US7807073 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment |
| 10/05/2010 | US7805836 Manufacturing method of electronic board and multilayer wiring board |
| 10/05/2010 | US7805835 Method for selectively processing surface tension of solder mask layer in circuit board |
| 10/05/2010 | US7805834 Method for fabricating three-dimensional all organic interconnect structures |
| 09/30/2010 | WO2010111379A2 High data rate connector system |
| 09/30/2010 | WO2010111048A2 Printed circuit board via drilling stage assembly |
| 09/30/2010 | WO2010110433A1 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same |
| 09/30/2010 | WO2010110341A1 Localized jet soldering device and partial jet soldering method |
| 09/30/2010 | WO2010110335A1 Photosensitive resin composition and cured film |
| 09/30/2010 | WO2010110149A1 Surface treatment agent |
| 09/30/2010 | WO2010110094A1 Adhesive material reel |
| 09/30/2010 | WO2010109985A1 Method for manufacturing electronic component |
| 09/30/2010 | WO2010109842A1 Film with attached metal layer for electronic components, production method thereof, and applications thereof |
| 09/30/2010 | WO2010109718A1 Chip component mounting structure, chip component mounting method and liquid crystal display device |
| 09/30/2010 | WO2010109465A1 Process for sintering nanoparticles at low temperatures |
| 09/30/2010 | WO2010108905A1 Improvements in or relating to pcb-mounted integrated circuits |
| 09/30/2010 | US20100248505 Printed circuit board assembly and connecting method thereof |
| 09/30/2010 | US20100248162 Photosensitive Resin Composition, Photosensitive Element Using Same, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board |
| 09/30/2010 | US20100247791 Method of forming a layering of electronically-interactive material |
| 09/30/2010 | US20100247021 Optical device with large thermal impedance |
| 09/30/2010 | US20100246146 Electronic device and method of producing the same |
| 09/30/2010 | US20100246140 Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards |
| 09/30/2010 | US20100245308 Display apparatus, drive control method of display apparatus and manufacturing method of display apparatus |
| 09/30/2010 | US20100244625 Surface Acoustic Wave Device and Method for Production of Same |
| 09/30/2010 | US20100243718 Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
| 09/30/2010 | US20100243461 Method of fabricating circuit board |
| 09/30/2010 | US20100243309 Connecting structure for circuit board and connecting method using the same |
| 09/30/2010 | US20100243301 Organic polymer coating for protection against creep corrosion |
| 09/30/2010 | US20100243297 Printed circuit board and method of manufacturing the same |
| 09/30/2010 | US20100242603 Vertically integrated mems sensor device with multi-stimulus sensing |