Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2010
11/03/2010CN101296561B Flexible printing patchboard and sliding lid type mobile phone terminal using the same
11/03/2010CN101277589B Method for connecting two objects electrically
11/03/2010CN101185379B Generic patterned conductor for customizable electronic devices
11/03/2010CN101178417B High-precision rogowski current transformer
11/03/2010CN101155469B Circuit board and method for manufacturing semiconductor modules and circuit boards
11/03/2010CN101123851B Silk-screen printing method for flexible printing wiring plate
11/03/2010CN101113388B Black-hole carbon powder cleaning agent composition and cleaning method thereof
11/03/2010CN101030546B Capacitor attachment method
11/03/2010CN101014228B Method and equipment for disassembling circuit board using non-contacted impact
11/02/2010US7826023 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit
11/02/2010US7825555 Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor
11/02/2010US7825198 Thermosetting resin composition and multilayer printed wiring board using the same
11/02/2010US7825029 Method for the production of structured layers on substrates
11/02/2010US7824754 and Isopropyltris(dioctylpyrophosphate)titanate coupler; acrylated bisphenol-glycerol epoxy resin; nonunsaturated is a bisphenol-epichlorohydrin resin; insulating adhesive; anisotropically electroconductive adhesive film; curable at low temperature; circuit boards
11/02/2010US7823278 Method for fabricating electrical contact buttons
11/02/2010US7823277 Pre-nesting of the active area on plates to reduce thickness variation
11/02/2010US7823276 Parts mounting method
11/02/2010US7823275 Method for making an electronic switch that is mountable on a circuit board
11/02/2010US7823274 Method of making multilayered circuitized substrate assembly
11/02/2010US7823268 Angular transducer unit and method for its manufacture, as well as angular switching device and device for the detection of objects
11/01/2010CA2702704A1 Electronic apparatus for lighting applications
10/2010
10/28/2010WO2010122918A1 Substrate for printed wiring board, printed wiring board, and methods for producing same
10/28/2010WO2010122822A1 Process for production of multilayer ceramic substrate
10/28/2010WO2010122764A1 Soldering material and electronic component assembly
10/28/2010WO2010122736A1 Screen printing device and screen printing method
10/28/2010WO2010121938A1 Multilayer printed circuit board manufacture
10/28/2010WO2010121815A1 Method, retaining means, apparatus and system for transporting a flat material feedstock, and loading or unloading device
10/28/2010WO2010121277A1 Method for pretreating a frame or carrier element for the production of a circuit board, and frame or carrier element and use therefor
10/28/2010US20100273313 Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same
10/28/2010US20100271789 Device for protecting the pins of an electronic component
10/28/2010US20100270685 Die bonding utilizing a patterned adhesion layer
10/28/2010US20100270067 Printed circuit board and method of manufacturing the same
10/28/2010US20100270061 Floating Metal Elements in a Package Substrate
10/28/2010US20100270057 Circuit board and method for manufacturing the same
10/28/2010US20100269336 Methods for fabricating circuit boards
10/28/2010US20100269335 Method of manufacturing printed circuit board having embedded resistors
10/28/2010US20100269334 Electronic component for an electronic carrier substrate
10/28/2010US20100269333 Method for Mounting Flip Chip and Substrate Used Therein
10/28/2010DE10346292B4 Elktronikgehäuse mit anschlußleitungslosem Leitungsrahmen und Sensormodul, das dasselbe umfaßt Elktronikgehäuse with connection cable and Wi-lead frame sensor module comprising the same
10/28/2010DE102010027980A1 Betriebsgerät mit Bauelement auf Zwischenschicht Operating equipment with component on interlayer
10/28/2010DE102009018541A1 Contacting unit for electronic component, is porous metallic layered structure, and contact surface of electronic component and layered structure geometrically fit to each other, where thickness of layer is ten micrometers
10/28/2010DE102009018393A1 Verfahren, Haltemittel, Vorrichtung und System zum Transportieren eines flächigen Behandlungsgutes und Be- oder Entladeeinrichtung Method, retaining means, apparatus and system for transporting an extensive treatment of the goods and loading or unloading
10/28/2010DE102009017659A1 Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat Method for conductive connection of a device on a substrate transprenten
10/28/2010DE102006033269B4 Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper A method for producing an assembly comprising a flexible circuit carrier, a base plate and a sealing body
10/27/2010EP2244545A2 Electrical connection device
10/27/2010EP2244542A1 Multilayer printed circuit board manufacture
10/27/2010EP2244541A1 Surface mount circuit board, method for manufacturing a surface mount circuit board, and method for mounting surface mount electronc devices
10/27/2010EP2244540A1 Electronic devices with light source
10/27/2010EP2244285A1 Method to form solder deposits on substrates
10/27/2010EP2243592A1 Solder bonding structure and soldering flux
10/27/2010EP2243590A1 Method of regulating nickel concentration in lead-free solder containing nickel
10/27/2010EP2243342A1 Electronic component and method for producing such an electronic component
10/27/2010EP2243341A1 A method of depth routing an electronic layup and apparatus for effecting such a method
10/27/2010EP1726191B1 Flexible circuit board assembly
10/27/2010CN201616958U 通孔直插式组件维修治具 Through-hole assembly-line maintenance Fixture
10/27/2010CN201616957U 印刷电路板分板装置 Printed circuit board sub-board device
10/27/2010CN201616956U 电路板基材撕膜装置 Circuit board substrate tear film device
10/27/2010CN201616952U 双面线路板 Double-sided circuit boards
10/27/2010CN1741712B Method of forming wiring pattern and method of forming gate electrode for TFT
10/27/2010CN1717965B Method for mounting electronic component
10/27/2010CN101874429A Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component
10/27/2010CN101874428A Tip printing and scrape coating systems and methods for manufacturing electronic devices
10/27/2010CN101873770A Electroplating copper plughole process of circuit board
10/27/2010CN101873769A Method for forming welding convex block
10/27/2010CN101873768A Method for preparing printing electron by adopting catalytic type nano particles
10/27/2010CN101873767A Sodium-sprayed circuit board
10/27/2010CN101873766A Method for manufacturing conductor track structure
10/27/2010CN101873765A Automatic solution adding system
10/27/2010CN101873764A Production method of special circuit board assembly for automobile taillight
10/27/2010CN101873761A Circuit board having optical readable mark code and manufacturing method thereof
10/27/2010CN101872131A Positioning device and alignment method for exposure alignment of PCB (Polychlorinated Biphenyl) board green oil
10/27/2010CN101872124A Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
10/27/2010CN101870764A Resin composition for printed circuit board and printed circuit board using the same
10/27/2010CN101869885A Ultrasonic soldering flux coating process and device
10/27/2010CN101300911B Circuit module and method for manufacturing circuit module
10/27/2010CN101072470B Glass circuit board and its manufacturing method
10/27/2010CN101019474B Structured surface using ablatable radiation sensitive material
10/26/2010US7822566 Method, device and program for setting a reference value for substrate inspection
10/26/2010US7822302 Circuit board and method for manufacturing the same
10/26/2010US7821136 layer of metal composite is applied on substrate, comprising metal flakes, nanometer metal spheres, and metal precursors; precursors comprise mixture of inorganic salts and organic acidic salts; layer of metal composite is cured to induce exothermic reaction, forming a conductive layer at low temperature
10/26/2010US7821105 Method of manufacturing semiconductor device and semiconductor device
10/26/2010US7820917 Circuit board
10/26/2010US7820529 Method for manufacturing integrated circuit
10/26/2010US7820490 Method for LTCC circuitry
10/26/2010US7820363 Process for forming a solder mask, apparatus thereof and process for forming electric-circuit patterned internal dielectric layer
10/26/2010US7820279 reduced precious metallic particles ( Ag, Au, Pt, Pd, Rh, Ir) dispersed in a polymeric(acrylonitrile-butadiene-styrene terpolymer) matrix; high transparency, wear resistance, radiation resistance, electroconductivity; liquid-crystal displays and printed circuit boards
10/26/2010US7820232 drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, reducing the copper fine particles with the surface oxide film layer with glycerol reducing agent, baking the copper fine particles produced
10/26/2010US7818878 Integrated circuit device mounting with folded substrate and interposer
10/26/2010US7818877 Formation method of metal layer on resin layer
10/21/2010WO2010120277A1 Back drill verification feature
10/21/2010WO2010119836A1 Lead-free solder alloy, solder ball, and electronic member comprising solder bump
10/21/2010WO2010119787A1 Composition for forming conductor layer, conductor substrate, and method for producing conductor substrate
10/21/2010WO2010119537A1 Laser machining method and laser machining device
10/21/2010WO2010118821A1 Method for conductively connecting a component on a transparent substrate
10/21/2010WO2010097270A3 Printing method for producing individualized electric and/or electronic structures
10/21/2010US20100266753 Connector chip and manufacturing method thereof
10/21/2010US20100266752 Method for forming circuit board structure of composite material
10/21/2010US20100265685 Wiring-connecting material and wiring-connected board production process using the same
10/21/2010US20100265682 Semiconductor Chip Package with Undermount Passive Devices
10/21/2010US20100265671 Package structure of printed circuit board and package method thereof
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