Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2010
11/10/2010CN101256973B Method for fabricating layered microelectronic contact
11/10/2010CN101212870B Laminated multi-layer circuit board and its production method
11/10/2010CN101165886B Semiconductor packaging member for semiconductor device stacking and its manufacture method
11/10/2010CN101160021B Whole panel cutting device and cutting method for jigsaw of printed circuit board
11/10/2010CN101159036B RFID label technique
11/10/2010CN101101899B Laminose board, manufacturing method thereof, electronic element and device with the laminose board
11/10/2010CN101069456B Mounting structure for electronic component
11/09/2010USRE41914 Thermal management in electronic displays
11/09/2010US7830667 Flexible wiring substrate and method for producing the same
11/09/2010US7830666 Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
11/09/2010US7830367 Touch panel and protective panel for display window of electronic device using the same
11/09/2010US7830228 Miniature RF and microwave components and methods for fabricating such components
11/09/2010US7829976 Microelectronic devices and methods for forming interconnects in microelectronic devices
11/09/2010US7829799 Method for manufacturing a miniaturized three-dimensional electric component
11/09/2010US7829199 Sn Zn alloy solder having a composition comprising Zn, Ag, Al, Cu, Mg; lead-free; soldering electronic component, and a circuit board
11/09/2010US7829190 Electrical interconnect using locally conductive adhesive
11/09/2010US7829159 Method of forming organosilicon oxide film and multilayer resist structure
11/09/2010US7828952 Building up a three-dimensional structure from a number of adhered layers by depositing a first material onto a substrate; selectively etching to a desired depth; depositing a second material at least into the voids created; at least one of the deposition processes is an electrodeposition process
11/09/2010US7827682 Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
11/09/2010US7827681 Method of manufacturing electronic component integrated substrate
11/09/2010US7827680 Electroplating process of electroplating an elecrically conductive sustrate
11/09/2010US7827679 Thermal management circuit board and methods of producing the same
11/04/2010WO2010126989A1 Thin-film capacitor structures embedded in semiconductor packages and methods of making
11/04/2010WO2010126966A1 Thin-film capacitor structures embedded in semiconductor packages and methods of making
11/04/2010WO2010126957A1 Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
11/04/2010WO2010126410A1 Assembly for carrying electronic components
11/04/2010WO2010126160A1 Wiring substrate and method for manufacturing wiring substrate
11/04/2010WO2010126159A1 Connecting unit
11/04/2010WO2010126132A2 Modified polyimide and method for producing modified polyimide
11/04/2010WO2010126006A1 Photosensitive resin composition, photosensitive element utilizing the composition, method for formation of resist pattern, and process for production of printed circuit board
11/04/2010WO2010125965A1 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
11/04/2010WO2010125924A1 Ceramic multilayer substrate producing method
11/04/2010WO2010125858A1 Multilayered resin circuit board, and manufacturing method of multilayered resin circuit board
11/04/2010WO2010125814A1 Device mounting structure and device mounting method
11/04/2010WO2010125809A1 Process for production of circuit board
11/04/2010WO2010125753A1 Process for production of circuit board
11/04/2010WO2010125721A1 Photo-curable and heat-curable resin composition
11/04/2010WO2010125720A1 Photo-curable and heat-curable resin composition
11/04/2010WO2009141800A3 High dielectric constant laser direct structuring materials
11/04/2010US20100279396 Micro-scaled animal cell incubator and production method thereof
11/04/2010US20100279002 Systems and Methods Affecting Profiles of Solutions Dispensed Across Microelectronic Topographies During Electroless Plating Processes
11/04/2010US20100278600 Support board for perforation processing and method of perforation processing
11/04/2010US20100277882 Motherboard and motherboard layout method
11/04/2010US20100277881 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
11/04/2010US20100276497 Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires and a device thereby obtained
11/04/2010US20100276192 Method for removing a stub of a via hole and a printed circuit board designed based on the method
11/04/2010US20100276190 Electronic component and method of mounting the same
11/04/2010US20100276188 Method and apparatus for improving power gain and loss for interconect configurations
11/04/2010US20100276182 Method for hot embossing at least one conductor track onto a substrate and substrate having at least one conductor track
11/04/2010US20100275440 Highly conductive thermal interface and no pump-out thermal interface greases and method therefore
11/04/2010DE10306618B4 Planare Kontaktstruktur mit Kontaktzungen für eine variable Steckposition Planar contact structure with reeds for a variable slot position
11/04/2010DE102009019782A1 Method for producing plated-through printed circuit board, involves producing connections of components and conducting connections in recesses for forming plated-through holes between conducting layers in reflow process
11/03/2010EP2247171A1 Metal-clad substrate, and method for production thereof
11/03/2010EP2247170A1 Method for electroconductive pattern formation
11/03/2010EP2246866A1 Electric component and circuit arrangement
11/03/2010EP2246400A1 Circuit connecting material
11/03/2010EP2245914A1 Method for forming a thin layer of particulate on a substrate
11/03/2010EP2245660A2 Nanoscale metal paste for interconnect and method of use
11/03/2010EP1802184B1 Method for manufacturing an electro-conductive pattern material
11/03/2010EP1445347B1 Method of plating nonconductor product
11/03/2010EP1399269B1 Waveform generator for microdeposition control system
11/03/2010EP1399267B1 Microdeposition apparatus
11/03/2010CN201623924U Novel on-line automatic board brushing device
11/03/2010CN201623923U Printing template
11/03/2010CN201623922U Laser cutting and gluing machine of circuit board
11/03/2010CN201623921U Forming and processing support for large-sized plates
11/03/2010CN201623917U Circuit jointed board
11/03/2010CN201619020U PCB board grinding brush leveling apparatus
11/03/2010CN201618872U Large-size PCB drilling improved device
11/03/2010CN1983481B Method for forming an outer electrode
11/03/2010CN1965044B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
11/03/2010CN1925725B Method for manufacturing circuit substrate
11/03/2010CN1809787B Aqueous developable photoimageable thick film compositions
11/03/2010CN1784274B Vibrator and portable terminal device mounted with the vibrator
11/03/2010CN1729730B PCB method and apparatus for producing landless interconnects
11/03/2010CN1720766B Method for manufacturing flexible wiring circuit board
11/03/2010CN1551708B Multi-layer wiring board
11/03/2010CN101878679A Method for manufacturing multilayer printed wiring board
11/03/2010CN101878678A Improved systems and methods for drilling holes in printed circuit boards
11/03/2010CN101878509A Electrically conductive paste, and electrical and electronic device comprising the same
11/03/2010CN101877945A Method for removing via stub and PCB designed by using the method
11/03/2010CN101877944A Full implanting board of printed circuit board and connecting method thereof
11/03/2010CN101877943A Crest welder pot
11/03/2010CN101877942A Locking mechanism
11/03/2010CN101877941A Roller mechanism
11/03/2010CN101877940A Magnet welding device and welding method
11/03/2010CN101877939A Circuit board stationary fixture
11/03/2010CN101877938A Manufacturing method of sheet printed circuit board and sheet printed circuit board
11/03/2010CN101877932A Double-sided inserted backplane and slot position connector
11/03/2010CN101877261A Method for solving insulation restriction
11/03/2010CN101877260A Method for solving insulation limits
11/03/2010CN101875146A Impeller mechanism
11/03/2010CN101875145A Pressure plate positioning device
11/03/2010CN101875144A Locking pinch plate and hold-down mechanism
11/03/2010CN101875143A Crest welder impeller device
11/03/2010CN101875084A Quick-change die carrier for flexible circuit board
11/03/2010CN101875078A Circuit board stamping mould
11/03/2010CN101461701B Minitype sensor and method for producing the same
11/03/2010CN101442884B Method for processing on-state hole of multilayer printed circuit board
11/03/2010CN101431862B Positioning method for printed circuit board in drilling process
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