Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2010
11/17/2010CN1974207B Photogravure roller
11/17/2010CN1870861B Substrate, electronic component, and manufacturing method of these
11/17/2010CN101889190A Three-dimensional measurement device and board inspecting machine
11/17/2010CN101888749A Process for laminating PCB with internal through-hole structure
11/17/2010CN101888748A Manufacturing method of circuit board
11/17/2010CN101888747A Printed-circuit board, and method for manufacturing the same
11/17/2010CN101888746A Jet solder vessel
11/17/2010CN101888745A Printed wiring board and manufacturing method of the same
11/17/2010CN101888744A Surface treatment apparatus for substrate material
11/17/2010CN101888742A Printed wiring board and process for producing the same
11/17/2010CN101888740A Convex metal printed circuit board and manufacturing method thereof
11/17/2010CN101888738A Embedded substrate provided with side-inclined plane line layer assembly and manufacturing method thereof
11/17/2010CN101887880A Multilayer printed wiring board
11/17/2010CN101885096A Soldering device
11/17/2010CN101583242B Device and method for delivering material
11/17/2010CN101517831B Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
11/17/2010CN101492814B Process for producing double-layer flexible cover copper plate
11/17/2010CN101466206B Method for electroplating conductive hole of printed circuit board
11/17/2010CN101370357B Guiding plate and extraction apparatus of circuit board, and production method of circuit board
11/17/2010CN101365297B Circuit board cutting method
11/17/2010CN101360395B Circuit board leveling apparatus and method for leveling circuit board
11/17/2010CN101355845B Substrate with conductive projection and technique thereof
11/17/2010CN101351091B Line connection technique and structure thereof
11/17/2010CN101254893B Method for making micromachine moving piece and metal intraconnection thereof
11/17/2010CN101115354B Moulding circuit board and manufacturing method therefor
11/17/2010CN101081454B Automatic protection device for avoid the overflow of tin
11/17/2010CN101039549B Manufacturing method of wiring substrate and mask used for printing
11/17/2010CN101037062B Method and apparatus for screen printing
11/16/2010US7834454 Electronic structures including barrier layers defining lips
11/16/2010US7834277 Printed circuit board manufacturing method and printed circuit board
11/16/2010US7834275 Secure electronic entity such as a passport
11/16/2010US7833957 Removing solution
11/16/2010US7833910 Film substrate, fabrication method thereof, and image display substrate
11/16/2010US7833567 Method for forming electrical circuit by jetting molten metal
11/16/2010US7832098 Method of manufacturing a multilayered printed circuit board
11/16/2010US7832096 Method for producing an organic substrate with integral thermal dissipation channels
11/16/2010US7832093 Method of creating an electro-mechanical energy conversion device
11/16/2010US7832092 Method of manufacturing a printed wiring board lead frame package
11/16/2010US7832091 Method for manufacturing conductive contact holder
11/15/2010CA2704110A1 Method of improving isolation between circuits on a printed circuit board
11/11/2010WO2010129645A1 Method for integration of circuit components into the build-up layers of a printed wiring board
11/11/2010WO2010129604A1 Reliable and durable conductive films comprising metal nanostructures
11/11/2010WO2010129002A1 Method and apparatus for improving power and loss for interconect configurations
11/11/2010WO2010128833A2 Method for manufacturing an fpcb using a bonding sheet
11/11/2010WO2010128688A1 Electroless palladium plating solution
11/11/2010WO2010128107A1 Process for manufacturing conductive tracks
11/11/2010WO2010127496A1 Back drilling method of through via, circuit board and manufacturing method of circuit board
11/11/2010US20100285676 Connection terminal and transmission line
11/11/2010US20100284158 Packaging techniques and configurations
11/11/2010US20100283615 Conductive Pattern and Method of Making
11/11/2010US20100283570 Nano-encapsulated magnetic particle composite layers for integrated silicon voltage regulators
11/11/2010US20100282504 High impedance trace
11/11/2010US20100282502 Multilayer printed wiring board
11/11/2010DE19980206B4 Grundplatte für eine Leiterplatte unter Verwendung einer wärmebeständigen Isolationsschicht, deren Herstellverfahren und Verfahren zur Herstellung der Leiterplatte Base plate for a printed circuit board using a heat-resistant insulating layer, the production method and methods for producing the printed circuit board
11/11/2010DE102009018184A1 Flachbaugruppe und Verfahren zu deren Herstellung Printed circuit board assembly and process for their preparation
11/11/2010DE102009003495B4 Lötverfahren und Lötvorrichtung Soldering and soldering device
11/11/2010DE102009002954A1 Electrical contact for use between e.g. flexible flat cable and contact pin, has holding down clamp arranged on side, which is turned towards radiant heat coupled heat source, of contact
11/11/2010DE102008017569B4 Verfahren zur Herstellung eines organischen Substrats mit eingebetteten Aktivchips A process for producing an organic substrate with embedded active chips
11/10/2010EP2249630A1 Circuit board
11/10/2010EP2249382A1 Circuit board module and electronic apparatus
11/10/2010EP2249167A1 Wiring board and probe card
11/10/2010EP2248921A1 Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material
11/10/2010EP2248402A1 Non-etching non-resist adhesion composition and method of preparing a work piece
11/10/2010EP2248401A2 Method for producing printed circuit boards comprising fitted components
11/10/2010EP2248400A2 Method of connection of flexible printed circuit board and electronic device obtained thereby
11/10/2010EP2151148B1 Method for producing a circuit board having a cavity for the integration of components
11/10/2010EP2064930B1 Electronic component mounting structure
11/10/2010CN201629942U Shield assembling and fixing die
11/10/2010CN201629917U Uniform filling component
11/10/2010CN201629916U Full-automatic wave wind reflow welding machine
11/10/2010CN201629915U Movable screen frame capable of fast fixing SMT stencil steel sheets and generating tension
11/10/2010CN201629914U Shield welding spot mask printed stencil
11/10/2010CN201629902U Novel PCB board
11/10/2010CN201628843U Positioning device for green oil exposure alignment
11/10/2010CN1937887B Structure and method for reducing warp of substrate
11/10/2010CN1910974B Paste for soldering and soldering method using the same
11/10/2010CN1909764B Multi-layer printed circuit board
11/10/2010CN1909763B Multi-layer printed circuit board
11/10/2010CN1886033B Circuit pattern forming method, circuit pattern forming device and printed circuit board
11/10/2010CN1863436B Method of manufacturing a wiring board and the wiring board
11/10/2010CN1764344B Wired circuit board
11/10/2010CN1731915B 多层电路板装置 Multi-layer circuit board apparatus
11/10/2010CN101884258A Method for making an electric interconnection between two conducting layers
11/10/2010CN101884257A Multilayer wiring board having cavity section
11/10/2010CN101884256A Substrate and semiconductor device
11/10/2010CN101884255A Method of disposing selectively two types of substances on surface of substrate
11/10/2010CN101884254A Electronic apparatus produced using lead-free bonding material for soldering
11/10/2010CN101883880A Method and device for supplying electrical power
11/10/2010CN101883474A Method of manufacturing flexible printed circuit board
11/10/2010CN101883473A Double-faced electricity conductive composite board and manufacture method thereof
11/10/2010CN101883472A PCB encapsulation of surface patch capacitor, method thereof, PCB and equipment
11/10/2010CN101883471A Flying plate type dust-binding plate receiving machine
11/10/2010CN101883470A Prepreg for printed board and laminated plate adhered with metal foil
11/10/2010CN101574746B Double-diamond end mill slotting method and slotting machine for carrying out same
11/10/2010CN101478858B Circuit board construction, manufacturing method and liquid crystal display
11/10/2010CN101400220B Method for producing wiring substrate
11/10/2010CN101378624B Module structure integrating perimeter circuit and manufacturing method thereof
11/10/2010CN101371352B Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
11/10/2010CN101321430B Circuit board assembly and manufacturing method thereof
11/10/2010CN101300912B Multilayer circuit plate, method for fabricating multilayer circuit plate, circuit plate, and method for fabricating the circuit plate
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