| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/01/2010 | EP2257141A2 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 12/01/2010 | EP2257140A1 Enhancing adhesion of molding materials with substates |
| 12/01/2010 | EP2257139A1 Method for manufacturing an article of a synthetic material comprising a metallizable part |
| 12/01/2010 | EP2257138A1 Method for Simultaneous Inspection and Cleaning of a Stencil |
| 12/01/2010 | EP2257137A1 Interconnect for tightly packed arrays with flex circuit |
| 12/01/2010 | EP2256861A1 Radio ic device |
| 12/01/2010 | EP2256801A2 Contact device for a power semiconductor module with a centring recess |
| 12/01/2010 | EP2256793A1 Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls |
| 12/01/2010 | EP2256550A1 Spin-printing of electronic and display components |
| 12/01/2010 | EP2255940A1 Method and device using pyrolysis for recycling used printed circuit board |
| 12/01/2010 | EP2255602A1 Imaging system and method for alignment |
| 12/01/2010 | EP2255601A2 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 12/01/2010 | EP2255408A1 Electrical connection |
| 12/01/2010 | EP2255383A2 Connection component with hollow inserts and method for making same |
| 12/01/2010 | CN201663761U Three-proofing-paint groove body for coating circuit board |
| 12/01/2010 | CN201663760U Automatic feeding device of etching solution additive for printed circuit board production line |
| 12/01/2010 | CN201663759U Circuit encapsulating structure |
| 12/01/2010 | CN201663758U Positioning tack board for printing of double-sided PCB board |
| 12/01/2010 | CN201663757U PCB plugboard frame |
| 12/01/2010 | CN1984527B Ultrathin copper foil with carrier and printed circuit board |
| 12/01/2010 | CN1949421B Method of manufacturing thin flim capacitor |
| 12/01/2010 | CN1935442B Free solder, method and device for reinforcing tin weldability |
| 12/01/2010 | CN1744796B Method for producing electroconductive pattern and use thereof |
| 12/01/2010 | CN1668168B Electric connector and solder-bearing wafer and method for firmly mounting a device |
| 12/01/2010 | CN1596485B Method for forming waveguide in a printed circuit board |
| 12/01/2010 | CN101904230A Methods of fluxless micro-piercing of solder balls, and resulting devices |
| 12/01/2010 | CN101904229A Improvements in or relating to circuit arrangements and associated apparatus and methods |
| 12/01/2010 | CN101904228A Copper foil for printed wiring board |
| 12/01/2010 | CN101903959A Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
| 12/01/2010 | CN101903485A Conductive adhesive precursor, method of using the same, and article |
| 12/01/2010 | CN101902885A Forming method of printing pattern |
| 12/01/2010 | CN101902884A Method for making composite material circuit board structure |
| 12/01/2010 | CN101902883A Method for manufacturing microwave high-frequency ceramic circuit board |
| 12/01/2010 | CN101902882A Board separator |
| 12/01/2010 | CN101902881A Silicon aluminium foil for isolating multilayer PCB circuit board, and manufacturing method thereof |
| 12/01/2010 | CN101902880A Special fixture for hot-air leveling of unit printed wiring board |
| 12/01/2010 | CN101902879A Improved frame structure for improving copper tilted edge of printed circuit board |
| 12/01/2010 | CN101902878A Novel high heat conduction electronic circuit substrate and manufacturing technology thereof |
| 12/01/2010 | CN101902874A Multi-layer printed circuit board |
| 12/01/2010 | CN101902000A Radio frequency connector and communication device |
| 12/01/2010 | CN101901975A Connector set and jointer for use therein |
| 12/01/2010 | CN101901972A Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 12/01/2010 | CN101901971A Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 12/01/2010 | CN101610643B Method for processing blind hole by laser |
| 12/01/2010 | CN101436551B Method for making copper-core layer multi-layer encapsulation substrate |
| 12/01/2010 | CN101425546B Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| 12/01/2010 | CN101395652B Pattern-forming device and pattern-forming method |
| 12/01/2010 | CN101394710B Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device |
| 12/01/2010 | CN101386128B Riveting tool device of support column for processing double-layer circuit board |
| 12/01/2010 | CN101384138B Fixing device for multilayer circuit board press fitting |
| 12/01/2010 | CN101370355B Module, circuit board assembly, communication equipment and module assembly method |
| 12/01/2010 | CN101276670B Surface adhesion type magnetic element |
| 12/01/2010 | CN101189928B A method of supporting electronic components and an electronic device with elastic support for an electronic component |
| 12/01/2010 | CN101170879B Multilayer wiring board and method of manufacturing the same |
| 12/01/2010 | CN101102645B Circuit pattern formation device and method of forming circuit pattern to substrate |
| 12/01/2010 | CN101098784B Screen printer and screen printing method |
| 12/01/2010 | CN101039545B Wired circuit board and connection structure between wired circuit boards |
| 11/30/2010 | US7843700 Semiconductor device |
| 11/30/2010 | US7841863 Spring interconnect structures |
| 11/30/2010 | US7841862 Dielectric sheet |
| 11/30/2010 | US7841078 Method of optimizing land grid array geometry |
| 11/30/2010 | US7841077 Method for manufacturing a wiring substrate |
| 11/30/2010 | US7841076 Manufacturing method of wiring substrate and manufacturing method of semiconductor device |
| 11/30/2010 | US7841075 Methods for integration of thin-film capacitors into the build-up layers of a PWB |
| 11/29/2010 | CA2706053A1 Direct imprinting of porous substrates |
| 11/25/2010 | WO2010134734A2 Conductive contact terminal to be mounted on a substrate surface |
| 11/25/2010 | WO2010134549A1 Photosensitive resin composition |
| 11/25/2010 | WO2010134536A1 Electroconductive film pattern and method for forming an electroconductive film pattern |
| 11/25/2010 | WO2010134511A1 Semiconductor device and method for manufacturing semiconductor device |
| 11/25/2010 | WO2010134314A1 Photocurable heat-curable resin composition, dry film and cured product of the composition, and printed wiring board utilizing those materials |
| 11/25/2010 | WO2010134306A1 Electronic component mounting method and electronic component mounting structure |
| 11/25/2010 | WO2010134285A1 Printed circuit board and method of producing printed circuit board |
| 11/25/2010 | WO2010134262A1 Method of producing electronic component module having component-embedded layer |
| 11/25/2010 | WO2010090662A3 Barrier layer to prevent conductive anodic filaments |
| 11/25/2010 | WO2010088499A3 Crimped solder on a flexible circuit board |
| 11/25/2010 | US20100297814 Electronic system modules and method of fabrication |
| 11/25/2010 | US20100296792 Interface assembly, consolidation tooling and method of mounting an interface assembly to a substrate |
| 11/25/2010 | US20100296302 Interior components having illumination features |
| 11/25/2010 | US20100295903 Ink ejection nozzle arrangement for inkjet printer |
| 11/25/2010 | US20100295476 Fast switching, overshoot-free, current source and method |
| 11/25/2010 | US20100295179 Bga semiconductor device having a dummy bump |
| 11/25/2010 | US20100294551 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure |
| 11/25/2010 | US20100294546 Circuit board and method for a low profile wire connection |
| 11/25/2010 | US20100294545 Interconnect for tightly packed arrays with flex circuit |
| 11/25/2010 | US20100294544 Bending-Type Rigid Printed Wiring Board and Process for Producing the Same |
| 11/25/2010 | US20100294051 Process condition sensing wafer and data analysis system |
| 11/25/2010 | DE112008003532T5 Verfahren zum Herstellen eines Mehrschichtverdrahtungssubstrats A method of manufacturing a multilayer wiring substrate |
| 11/25/2010 | DE10331532B4 Beleuchtungsvorrichtung Lighting device |
| 11/25/2010 | DE102009023765A1 Method for chemical and electrolytic treatment of good such as printed circuit boards and conductor film with fluid jets in continuous treatment plant or band system, comprises guiding the fluid jet on the surface of the goods |
| 11/25/2010 | DE102009022238A1 Verfahren zur Herstellung von Kunststoff-Formteilen mit einer integrierten Leiterbahn A process for the production of plastic molded parts having an integrated printed conductor |
| 11/24/2010 | EP2253739A1 Etching method |
| 11/24/2010 | EP2253397A2 Method for filling metal into fine space |
| 11/24/2010 | EP2252916A1 Method of producing a microstructured product |
| 11/24/2010 | EP2252662A1 Methods and compositions for ink jet deposition of conductive features |
| 11/24/2010 | EP2252467A1 Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same |
| 11/24/2010 | EP1586222B1 Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors |
| 11/24/2010 | EP1569503B1 Method for supplying solder |
| 11/24/2010 | CN201657598U Convenient tubing parts taking device |
| 11/24/2010 | CN201657522U Bottom mold heating pulse pressing machine |
| 11/24/2010 | CN201657521U Through tin stove fixture shared by mainboard and power supply board |