| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/08/2010 | CN101911844A Metal-clad substrate, and method for production thereof |
| 12/08/2010 | CN101911843A A multilayer film for dry film resist |
| 12/08/2010 | CN101911842A Circuit board and method for mounting electronic component on printed board |
| 12/08/2010 | CN101910943A Layered photosensitive-resin product |
| 12/08/2010 | CN101910337A Aqueous coating agent for electronic component |
| 12/08/2010 | CN101910237A Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 12/08/2010 | CN101909877A Method for manufacturing double layer copper clad laminated board, and double layer copper clad laminated board |
| 12/08/2010 | CN101909837A Process for producing ceramic molded product |
| 12/08/2010 | CN101909419A Transmission line electromagnetic noise suppressor and preparation method thereof |
| 12/08/2010 | CN101909409A Manufacturing process for high-frequency multilayer mixed compression signal plate |
| 12/08/2010 | CN101909408A Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
| 12/08/2010 | CN101909407A Method for etching V-CUT on iron substrate |
| 12/08/2010 | CN101909406A Board interconnection structure |
| 12/08/2010 | CN101909405A Circuit board, circuit board manufacturing method, and cover ray film |
| 12/08/2010 | CN101909399A Circuit board structure and manufacture method thereof |
| 12/08/2010 | CN101908491A Method for manufacturing substrate |
| 12/08/2010 | CN101907946A Method for externally expanding single edge of circuit of touch panel |
| 12/08/2010 | CN101907569A System and method for attenuating the effect of ambient light on an optical sensor |
| 12/08/2010 | CN101906274A Adhesive, method of connecting wiring terminals and wiring structure |
| 12/08/2010 | CN101616547B Automatic board-launching system and baseplate-launching method |
| 12/08/2010 | CN101604634B Manufacture method of electronic component support plate |
| 12/08/2010 | CN101567356B Circuit board structure and manufacture method thereof |
| 12/08/2010 | CN101553084B Circuit base plate and manufacturing method thereof |
| 12/08/2010 | CN101533887B Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| 12/08/2010 | CN101466200B Device for carrying soft board |
| 12/08/2010 | CN101452283B Drilling control method and control device for printed circuit board |
| 12/08/2010 | CN101431863B Back glue attaching method for flexible printed circuit board |
| 12/08/2010 | CN101422090B Solder ball loading method and solder ball loading apparatus |
| 12/08/2010 | CN101409273B Ball-placing side surface structure for package substrate and manufacturing method thereof |
| 12/08/2010 | CN101389186B PCB soft hard board combining device |
| 12/08/2010 | CN101374382B Multi-layer circuit board with spatial transformation |
| 12/08/2010 | CN101360393B Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 12/08/2010 | CN101351115B Method for monitoring drilling quality of printed circuit board drilling department |
| 12/08/2010 | CN101351093B Method for preparing microwave high-frequency multi-layer circuit board |
| 12/08/2010 | CN101325844B Method for preparing solder pad of printed circuit board |
| 12/08/2010 | CN101313638B Multi-layer flexible printed circuit board and method for manufacturing the same |
| 12/08/2010 | CN101312137B Electronic component mounting system and electronic component mounting method |
| 12/08/2010 | CN101299903B Electromagnetic bandgap structure and printed circuit board |
| 12/08/2010 | CN101296571B Memory body device manufacturing carrier tool, manufacturing method and memory body device |
| 12/08/2010 | CN101290219B Centralized management system for solder check line, management device thereof and centralized management method |
| 12/08/2010 | CN101287361B Back-up table for chip mounter |
| 12/08/2010 | CN101273673B Board structure and electronic device |
| 12/08/2010 | CN101267911B Lead-free low-temperature solder |
| 12/08/2010 | CN101266484B Process control method and method for manufacturing electronic device |
| 12/08/2010 | CN101260188B Soluble polyimide resin and composition thereof, composite material and flexible circuit board using the resin or composition thereof |
| 12/08/2010 | CN101232967B Lead free solder paste used for electronic component, soldering method and the electronic component |
| 12/08/2010 | CN101232128B Circuit connecting material, circuit member connecting structure, and method of producing the same |
| 12/08/2010 | CN101211882B Printed circuit board and element module packaging structure and encapsulation method |
| 12/08/2010 | CN101207973B Roll label apparatus and method |
| 12/08/2010 | CN101183706B Embedded electronic component structure and method of producing the same |
| 12/08/2010 | CN101183212B Optical tool and method for forming soldering-resistant pattern |
| 12/08/2010 | CN101156218B Conductive paste composition and printed wiring board |
| 12/08/2010 | CN101142860B Printed circuit board |
| 12/08/2010 | CN101121348B Ink-jetting pattern transfer producing process and its device |
| 12/08/2010 | CN101106121B Wiring substrate, semiconductor device, and method of manufacturing the same |
| 12/08/2010 | CN101066003B Printed board and designing method therefor and IC package terminal designing method and connecting method therefor |
| 12/08/2010 | CN101060208B Anisotropic conductive sheet and method of manufacturing the same |
| 12/08/2010 | CN101047062B Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
| 12/08/2010 | CN101037646B Cleaning agent for removing solder flux and method for cleaning solder flux |
| 12/07/2010 | US7847393 Conductive connecting pins for a package substrate |
| 12/07/2010 | US7847318 Multilayer build-up wiring board including a chip mount region |
| 12/07/2010 | US7847211 Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device |
| 12/07/2010 | US7847198 Wiring board and method for manufacturing the same, and semiconductor device |
| 12/07/2010 | US7847197 Multilayer circuit board and manufacturing method thereof |
| 12/07/2010 | US7846641 free of laser irradiation defect; thin film layer of antimony doped tin oxide or mixed oxides of tin and iridium; thin film layer is irradiated with an excimer laser light or a YAG laser light |
| 12/07/2010 | US7846547 acrylic acid-styrene copolymers; surface treated with trimethylolpropane-tri- beta -aziridinylpropionate; solvent-resistance, conduction reliability; for use in anisotropic conductive adhesive |
| 12/07/2010 | US7846317 Processing a printed wiring board by single bath electrodeposition |
| 12/07/2010 | US7846285 bonding a hermetically sealed electronics package to an electrode or a flexible circuit with a plated platinum and/or gold; implanting in a living eye tissue to enable restoration of sight to certain non-sighted individuals |
| 12/07/2010 | US7846101 High resolution intravascular ultrasound transducer assembly having a flexible substrate |
| 12/07/2010 | US7845073 Method of manufacturing circuit board embedding thin film capacitor |
| 12/07/2010 | US7845072 Method and apparatus for adjusting a multi-substrate probe structure |
| 12/07/2010 | US7845071 Method of manufacturing electronic part |
| 12/07/2010 | US7845070 Manufacturing method of ink jet head |
| 12/07/2010 | CA2559289C Variable watt density layered heater |
| 12/02/2010 | WO2010138400A1 Method and apparatus for building multilayer circuits |
| 12/02/2010 | WO2010137714A1 Device and method for evaluating wettability of solder paste |
| 12/02/2010 | WO2010137558A1 Method for manufacturing prepreg for printed wiring board and device for manufacturing prepreg for printed wiring board |
| 12/02/2010 | WO2010137549A1 Flexible circuit board and method for manufacturing same |
| 12/02/2010 | WO2010137421A1 Wiring board and method for manufacturing same |
| 12/02/2010 | WO2010137420A1 Wiring board and method for manufacturing same |
| 12/02/2010 | WO2010137418A1 Application apparatus, applicator, and application method |
| 12/02/2010 | WO2010137413A1 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same |
| 12/02/2010 | WO2010137243A1 Device for cleaning screen printing mask, screen printing machine, and method for cleaning screen printing mask |
| 12/02/2010 | WO2010136597A1 Method of manufacturing an electrical component on a substrate |
| 12/02/2010 | WO2010136596A2 Method of manufacturing an electrical circuit on a substrate |
| 12/02/2010 | WO2010136006A1 Optoelectronic module and method for producing an optoelectronic module |
| 12/02/2010 | WO2010136004A1 Lock housing part having an outer recess for inserting electric conductors |
| 12/02/2010 | WO2010111379A3 High data rate connector system |
| 12/02/2010 | WO2010098921A3 High speed autofocus interferometric inspection systems & methods |
| 12/02/2010 | US20100304584 Connector set and jointer for use therein |
| 12/02/2010 | US20100304580 Electrical component interface |
| 12/02/2010 | US20100302750 Display substrate having arched signal transmission line and manufacture method thereof |
| 12/02/2010 | US20100302746 High voltage recessed connector contact |
| 12/02/2010 | US20100302737 Power electronics power module with imbedded gate circuitry |
| 12/02/2010 | US20100300736 Composite multi-layer substrate and module using the substrate |
| 12/02/2010 | US20100299920 Methods for manufacturing device mounting board and circuit substrate |
| 12/02/2010 | US20100299919 Method for making a positive temperature coefficient device |
| 12/02/2010 | US20100299917 Method for Manufacturing A Printed Circuit Board |
| 12/01/2010 | EP2257143A1 Solder connecting method, electronic device and method for manufacturing same |
| 12/01/2010 | EP2257142A1 Fixing of a construction element to a substrate and/or a connection element to the construction element or the substrate using pressure sintering |