| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/23/2010 | DE102010016307A1 Fixierungsanordnung für einen Verbinder einer fahrzeug-gestützten Steuervorrichtung Fixing arrangement for a connector of a vehicle-based controller |
| 12/23/2010 | DE102009029336A1 Verfahren und Struktur zum Schutz vor elektrostatischer Entladung für elektronische Produkte Method and structure for protecting against electrostatic discharge Electronic Products |
| 12/23/2010 | DE102009025641A1 Verwendung von hitzeaktivierbaren Klebebändern für die Verklebung von flexiblen Leiterplatten Use of heat-activatable adhesive tapes for bonding flexible printed circuit boards |
| 12/23/2010 | CA2708056A1 System and method for preparing conductive structures using radiation curable phase change gel inks |
| 12/22/2010 | EP2265102A1 Sensor device without housing |
| 12/22/2010 | EP2265101A1 Printed circuit board and method of manufacturing printed circuit board |
| 12/22/2010 | EP2265099A1 Semiconductor device and method of manufacturing the same |
| 12/22/2010 | EP2264748A2 Electric component mounting apparatus |
| 12/22/2010 | EP2264435A2 Method for improved process control in combustion applications |
| 12/22/2010 | EP2263430A2 Led lamp and method for its design |
| 12/22/2010 | EP1472916B1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board |
| 12/22/2010 | EP1442647B1 System and method for rapid alignment and accurate placement of electronic components on a printed circuit board |
| 12/22/2010 | EP1430493B1 Multiple terminal smt-bga-style wound capacitor |
| 12/22/2010 | CN201682700U Manufacture process of inner layer core board band board clamp of printed circuit board |
| 12/22/2010 | CN201682699U Semi-automatic welding production line circuit board clamp and driving device |
| 12/22/2010 | CN201682698U Printed circuit board double-sided resistance welding fast printing fixture |
| 12/22/2010 | CN201682697U Metal foil printing stencil with opening and lead corners |
| 12/22/2010 | CN201682692U Notching identification structure of non-transparent thin core plate |
| 12/22/2010 | CN201677109U Heating device and preheating module and preheating device utilizing same |
| 12/22/2010 | CN201676946U Punching die of circuit board |
| 12/22/2010 | CN1702863B Circuit device |
| 12/22/2010 | CN101926235A Non-etching non-resist adhesion composition and method of preparing work piece |
| 12/22/2010 | CN101926234A Method for forming thin layer of particulate on substrate |
| 12/22/2010 | CN101925861A Layered product of photosensitive resin |
| 12/22/2010 | CN101925268A Preparation method of sandwich plate |
| 12/22/2010 | CN101925267A Method for manufacturing printed circuit board |
| 12/22/2010 | CN101925266A Printed wiring board and method for manufacturing the same |
| 12/22/2010 | CN101925265A Copper filling-up method |
| 12/22/2010 | CN101925264A Double-sided circuit board and manufacturing method thereof |
| 12/22/2010 | CN101925263A Wave-soldering device and wave-soldering method |
| 12/22/2010 | CN101925262A Steel mesh and PCB (Printed Circuit Board) |
| 12/22/2010 | CN101925261A Electronic element welding method and circuit board structure of circuit board |
| 12/22/2010 | CN101925260A Multilayer printed wiring board |
| 12/22/2010 | CN101925259A Method for increasing current carrying capacity of PCB (Printed Circuit Board) line conductor through patch |
| 12/22/2010 | CN101925258A Printing machine |
| 12/22/2010 | CN101925257A Copper window manufacturing method of printed circuit board |
| 12/22/2010 | CN101925256A Connector for printed circuit board |
| 12/22/2010 | CN101925255A Circuit board embedded with electronic component and manufacturing method thereof |
| 12/22/2010 | CN101925253A Printed circuit board and drilling method thereof |
| 12/22/2010 | CN101925251A Flexible printed circuit and method of manufacturing same |
| 12/22/2010 | CN101925248A Circuit board and method for fixing wire on same |
| 12/22/2010 | CN101924049A Fabrication method of semiconductor integrated circuit device |
| 12/22/2010 | CN101924048A Method of manufacturing electronic component |
| 12/22/2010 | CN101922627A Metal base LED unit assembled lamp panel technology and lamp panel device |
| 12/22/2010 | CN101922038A Upright plating line plating equipment and clamp thereof |
| 12/22/2010 | CN101922001A Method for manufacturing printed circuit board by power triggering electroless plating addition process |
| 12/22/2010 | CN101524008B Component crimping apparatus control method, component crimping apparatus, and measuring tool |
| 12/22/2010 | CN101401494B Bump forming method and bump forming apparatus |
| 12/22/2010 | CN101370354B Capacitor-embedded printed circuit board and manufacturing method thereof |
| 12/22/2010 | CN101238762B Surface mounting component having magnetic layer thereon and method of forming same |
| 12/22/2010 | CN101225276B Method for preparing copper clad laminate with high glass transition temperature |
| 12/22/2010 | CN101106861B Method of manufacturing rigid-flexible printed circuit board |
| 12/21/2010 | US7855894 Printed circuit board |
| 12/21/2010 | US7855448 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 12/21/2010 | US7855342 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 12/21/2010 | US7855341 Methods and apparatus for a flexible circuit interposer |
| 12/21/2010 | US7854062 Method for manufacturing circuit device |
| 12/16/2010 | WO2010144792A1 Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
| 12/16/2010 | WO2010143667A1 Resin composition, cured product, and circuit board using same |
| 12/16/2010 | WO2010143599A1 Method of producing electronic module, and electronic module |
| 12/16/2010 | WO2010143597A1 Method for manufacturing circuit board, circuit board manufactured by the method, and base substrate used for the circuit board |
| 12/16/2010 | WO2010143507A1 Insulating resin film, bonded body using insulating resin film, and method for manufacturing bonded body |
| 12/16/2010 | WO2010143401A1 Offset printing device |
| 12/16/2010 | WO2010143379A1 Method of producing electronic component mounting structure, and electronic component mounting structure |
| 12/16/2010 | WO2010142725A1 Brazing crucible |
| 12/16/2010 | WO2010121666A3 Electronic structure |
| 12/16/2010 | WO2010036114A3 Method and kit for manufacturing metal nanoparticles and metal-containing nanostructured composite materials |
| 12/16/2010 | US20100317239 Compliant pin control module and method for making the same |
| 12/16/2010 | US20100317156 Method for manufacturing integrated circuit |
| 12/16/2010 | US20100316884 Copper-clad laminate |
| 12/16/2010 | US20100316794 Electroconductive bonding material and electric/electronic device using the same |
| 12/16/2010 | US20100315795 Method of manufacturing electronic component |
| 12/16/2010 | US20100315794 Circuit board and method of mounting electronic component on printed board |
| 12/16/2010 | US20100315105 Method for shielding a substrate from electromagnetic interference |
| 12/16/2010 | US20100314967 Surface acoustic wave sensor device |
| 12/16/2010 | US20100314164 Flexible printed circuit and fabrication method thereof |
| 12/16/2010 | US20100313947 Method and apparatus for applying a material on a substrate |
| 12/16/2010 | US20100313414 Processes and structures for IC fabrication |
| 12/16/2010 | US20100313413 Processes and structures for IC fabrication |
| 12/16/2010 | DE202010012416U1 Kapselung für Transponder Encapsulation for transponders |
| 12/16/2010 | DE112009000323T5 Verfahren und Vorrichtung zum Anlegen einer präzisen Druckkraft während der Produktion Method and apparatus for applying a precise pressure force during production |
| 12/15/2010 | EP2262353A2 Casing for enclosing electronic device |
| 12/15/2010 | EP2262352A1 Method for producing rigid-flex circuit board, and rigid-flex circuit board |
| 12/15/2010 | EP2261993A2 Semiconductor device and method for making the same |
| 12/15/2010 | EP2261979A1 Polymer sheet with organic semiconductors |
| 12/15/2010 | EP2261293A1 Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device |
| 12/15/2010 | EP2260684A1 Component carrier for electrical/electronic components and associated manufacturing method |
| 12/15/2010 | EP2260683A1 Method for the production of an electronic assembly |
| 12/15/2010 | EP2259921A1 Method for manufacturing laminated circuit board |
| 12/15/2010 | EP2051570B1 Method of producing multilayer ceramic substrate |
| 12/15/2010 | EP1668697B1 Electrical circuit apparatus and methods for assembling same |
| 12/15/2010 | EP1665915B1 High reliability multilayer circuit substrates and methods for their formation |
| 12/15/2010 | EP1511629B1 Device and method for positioning a substrate to be printed |
| 12/15/2010 | EP1388187B1 Connector and contact wafer |
| 12/15/2010 | EP1203662B1 Solder-paste printing device and printing method |
| 12/15/2010 | EP0964442B1 Ball arranging substrate for forming bump, ball arranging head, ball arranging apparatus, and ball arranging method |
| 12/15/2010 | CN201674727U 热压裁剪装置 Hot cutting device |
| 12/15/2010 | CN201674726U Printed circuit board |
| 12/15/2010 | CN201674723U Circuit board and laminated board structure thereof |
| 12/15/2010 | CN201669484U Semiconductor electronic welding reflux furnace |