| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/15/2010 | CN1959859B Polymer-ceramic dielectric composition, embedded capacitor and printed circuit board |
| 12/15/2010 | CN1909769B Retaining and connecting device for opto-electronic element |
| 12/15/2010 | CN1875322B Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device |
| 12/15/2010 | CN1578600B Parts coupling device and method and parts assembling device |
| 12/15/2010 | CN101918505A Electrically conductive adhesive |
| 12/15/2010 | CN101918219A Positioning device to position one or more plates for electronic circuits in a metal deposition unit, and related method |
| 12/15/2010 | CN101917828A Processing technology of golden finger |
| 12/15/2010 | CN101917827A Inlayer circuit conduction structure of circuit board and manufacture method thereof |
| 12/15/2010 | CN101917826A Method for increasing bonding force between conductor and non-conductive polymer dielectric layer in substrate of printed circuit board |
| 12/15/2010 | CN101917825A Connecting method and connecting device of photoelectric component and main printed circuit board |
| 12/15/2010 | CN101917824A Manufacture method of single-sided flexible circuit board |
| 12/15/2010 | CN101917823A Manufacturing method of circuit board |
| 12/15/2010 | CN101917822A Light emitting module, combined type circuit board device used by same and assembly method thereof |
| 12/15/2010 | CN101917821A High-density circuit board registration hole and manufacturing method thereof |
| 12/15/2010 | CN101917819A Printed wiring board |
| 12/15/2010 | CN101917818A Pad structure of circuit board and manufacturing method thereof |
| 12/15/2010 | CN101916752A 多层印刷线路板 Multilayer printed circuit boards |
| 12/15/2010 | CN101916001A Acf attaching method and acf attaching apparatus |
| 12/15/2010 | CN101914265A Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate |
| 12/15/2010 | CN101574773B Positioning pin assembly device of printed circuit board |
| 12/15/2010 | CN101501444B Soldering inspection method, soldering method, and soldering apparatus |
| 12/15/2010 | CN101460010B Silica gel board used for circuit board compressing and compressing method using the board |
| 12/15/2010 | CN101442886B Printed circuit board and manufacturing method of the same |
| 12/15/2010 | CN101421886B Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 12/15/2010 | CN101369542B Wiring board and manufacturing method therefor, and semiconductor device and manufacturing method therefor |
| 12/15/2010 | CN101301808B Surface mounting technology print stencil net frame |
| 12/15/2010 | CN101268724B Printing template of an smt process and method of coating it |
| 12/15/2010 | CN101212864B Inter-connecting structure between multi-layer base board and producing method |
| 12/15/2010 | CN101208174B Lead-free solder alloy |
| 12/15/2010 | CN101198212B Multilayer soft printed wiring board and production method thereof |
| 12/15/2010 | CN101151682B Conductive paste and wiring board using it |
| 12/15/2010 | CN101150930B A graphic plating method for dual-side and multi-layer flexible printed circuit board |
| 12/15/2010 | CN101128090B Printed wiring board and its manufacture |
| 12/15/2010 | CN101127343B Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device |
| 12/15/2010 | CN101000903B Printed circuit board and method of manufacturing semiconductor package using the same |
| 12/14/2010 | US7852634 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 12/14/2010 | US7851344 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
| 12/14/2010 | US7851124 Composition for forming wiring protective film and uses thereof |
| 12/14/2010 | US7851053 a copper clad laminate coated with copper foils of different thicknesses on both sides, a first copper foil on one side of the laminate is not recrystallizable by hot pressing and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil; reduce warping |
| 12/14/2010 | US7851020 allows making the unevenness of the functional liquids less conspicuous over the entire substrate |
| 12/14/2010 | US7851013 Underlay substrate, screen printing method and manufacturing method of printed circuit substrate |
| 12/14/2010 | US7849594 Manufacturing method for integrating passive component within substrate |
| 12/14/2010 | US7849593 Method of making multi-layer circuit board |
| 12/14/2010 | US7849591 Method of manufacturing a printed wiring board |
| 12/14/2010 | CA2465397C Resin composition |
| 12/14/2010 | CA2445604C Substrate adhesion enhancement to film |
| 12/09/2010 | WO2010140527A1 Reactive urethane compound, actinic-energy-ray-curable resin composition containing same, and use thereof |
| 12/09/2010 | WO2010140469A1 Connection method, connection structure, and electronic device |
| 12/09/2010 | WO2010140439A1 Method for manufacturing circuit board for electronic paper and method for manufacturing organic thin film transistor element |
| 12/09/2010 | WO2010140375A1 Jet soldering device and soldering method |
| 12/09/2010 | WO2010140335A1 Method for manufacturing a substrate |
| 12/09/2010 | WO2010140270A1 Method for manufacturing multi-piece substrate, and multi-piece substrate |
| 12/09/2010 | WO2010140224A1 Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board |
| 12/09/2010 | WO2010140214A1 Method for manufacturing multilayer printed wiring board |
| 12/09/2010 | WO2010139549A1 Printed board arrangement |
| 12/09/2010 | WO2010106359A3 Liquid coverlays for flexible printed circuit boards |
| 12/09/2010 | US20100310761 Process for producing transparent electroconductive member |
| 12/09/2010 | US20100309643 Multi-chip hybrid-mounted device and method of manufacturing the same |
| 12/09/2010 | US20100309641 Interposer substrate, lsi chip and information terminal device using the interposer substrate, manufacturing method of interposer substrate, and manufacturing method of lsi chip |
| 12/09/2010 | US20100309640 Surface mount electronic device packaging assembly |
| 12/09/2010 | US20100308460 Method of Ball Grid Array Package Construction with Raised Solder Ball Pads |
| 12/09/2010 | US20100307809 Printed wiring board and method for manufacturing the same |
| 12/09/2010 | US20100307805 Circuit connecting material, connection structure and method for producing the same |
| 12/09/2010 | US20100307799 Carrier Structure for Electronic Components and Fabrication Method of the same |
| 12/09/2010 | US20100307797 Flexible printed circuit and method of manufacturing same |
| 12/09/2010 | US20100307682 Thermally-activated and -hardenable adhesive foil, especially for adhesion of electronic components and flexible printed circuit paths |
| 12/09/2010 | US20100307255 Physical quantity sensor device and method of manufacturing the same |
| 12/09/2010 | DE102009026642A1 Verbindungsanordnung und Verfahren zum Herstellen einer Verbindungsanordnung Connecting assembly and method for making a connector assembly |
| 12/09/2010 | DE102009023848A1 Method for print production of electric conductor path, involves printing printing ink on carrier along predetermined contour in predetermined coat thickness and predetermined coat width to produce print layer |
| 12/09/2010 | DE102004025609B4 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module |
| 12/08/2010 | EP2259669A1 Component-incorporating wiring board |
| 12/08/2010 | EP2259668A1 Method for manufacturing multilayer printed wiring board |
| 12/08/2010 | EP2259667A1 Flex-rigid wiring board and method for manufacturing the same |
| 12/08/2010 | EP2259666A1 Circuit board having built-in electronic parts and its manufacturing method |
| 12/08/2010 | EP2259665A1 Solution for surface treatment |
| 12/08/2010 | EP2259380A1 Connection device and method for producing same |
| 12/08/2010 | EP2259312A1 Inversely alternate stacked structure of integrated circuit modules |
| 12/08/2010 | EP2258022A1 Substrate integrated waveguide |
| 12/08/2010 | EP2101551B1 Piezoelectric Oscillator and a method of manufacturing the same |
| 12/08/2010 | EP2023701B1 Method for manufacturing ceramic multilayer substrate |
| 12/08/2010 | CN201667762U Circuit board clamp and board frame therewith |
| 12/08/2010 | CN201667761U Copper removing device for lead-free tin spray process |
| 12/08/2010 | CN1940145B Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| 12/08/2010 | CN1938799B Embedded capacitors using conductor filled vias |
| 12/08/2010 | CN1893765B Multi-layer printed circuit board, solder resist composition, and method for manufacturing multi-layer printed circuit board and semiconductor device |
| 12/08/2010 | CN1870884B Mounting method of flexible circuit board |
| 12/08/2010 | CN1798485B Multilayer printed wiring board and method of manufacturing the same |
| 12/08/2010 | CN1778155B Multilayer printed wiring board-use copper-clad laminate sheet, multilayer printed wiring board and production method for multilayer printed wiring board |
| 12/08/2010 | CN1767719B Multilayer substrate and manufacturing method thereof |
| 12/08/2010 | CN1703138B Joint unit and joint method |
| 12/08/2010 | CN1671274B Flexible substrate having interlaminar junctions, and process for producing the same |
| 12/08/2010 | CN101911853A Three-dimensional wiring board |
| 12/08/2010 | CN101911852A Multilayer printed wiring board and mounting body using the same |
| 12/08/2010 | CN101911851A Multilayer printed wiring board and a method for manufacturing multilayer printed wiring board |
| 12/08/2010 | CN101911850A Method for manufacturing multilayer printed wiring board |
| 12/08/2010 | CN101911849A Method for manufacturing ceramic electronic component and ceramic electronic component |
| 12/08/2010 | CN101911848A Multilayer printed board and method for manufacturing the same |
| 12/08/2010 | CN101911847A Method for manufacturing multilayer wiring board |
| 12/08/2010 | CN101911846A Method for forming circuit |
| 12/08/2010 | CN101911845A Mounted board and method for manufacturing the same |