Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/25/2012 | CN202127552U Fixture for solder levelling of PCB (printed circuit board) finished small board |
01/25/2012 | CN202127551U Lamination table for printed circuit boards |
01/25/2012 | CN202127550U Soft circuit board attaching clamp |
01/25/2012 | CN202126568U Filter of PCB (Printed Circuit Board) developing solution |
01/25/2012 | CN202123299U Tool stand for welding circuit boards manually |
01/25/2012 | CN1938380B Thermosetting resin composition and multilayered printed wiring board comprising the same |
01/25/2012 | CN1822746B Printed board |
01/25/2012 | CN1739323B Multilayer wiring board and its manufacturing method |
01/25/2012 | CN102334394A Wiring substrate and method for manufacturing wiring substrate |
01/25/2012 | CN102334393A Wiring board |
01/25/2012 | CN102334392A Electronic part manufacturing method and electronic part manufactured by the method |
01/25/2012 | CN102334391A Multi-layer circuit carrier and method for the production thereof |
01/25/2012 | CN102334389A 连接单元 Connection unit |
01/25/2012 | CN102334184A 电子电路装置 Electronic circuit means |
01/25/2012 | CN102333908A Metal-coated polyimide resin substrate with excellent thermal aging resistance properties |
01/25/2012 | CN102333623A A method of generating a hole or recess or well in a substrate, a device for carrying out the method, and a high frequency high voltage source for use in such a device |
01/25/2012 | CN102333612A Jet solder bath |
01/25/2012 | CN102333419A Latch assembly and carrier with same |
01/25/2012 | CN102333418A Device and method for carrying out printing ink curing on flexible circuit board |
01/25/2012 | CN102333417A Method for manufacturing circuit board |
01/25/2012 | CN102333416A Unidirectional reinforcement material laminating system and method |
01/25/2012 | CN102333414A Heat dissipation structure, manufacturing method for the same and electronic device with the same |
01/25/2012 | CN102332890A Surface mounted quartz crystal oscillator of PCB (Printed Circuit Board) base and manufacture method thereof |
01/25/2012 | CN102332332A Flexible flat cable and its manufacture method, flexible printing substrate and its manufacture method |
01/25/2012 | CN102331684A Photosensitive element, formation method of corrosion-resisting pattern, manufacture method of printing circuit wiring board and printing circuit wiring board |
01/25/2012 | CN102328116A Drill and method for manufacturing printed circuit board |
01/25/2012 | CN101951728B Production method for replacing flexible circuit board with rigid circuit board |
01/25/2012 | CN101803485B Method for manufacturing multilayer printed wiring board |
01/25/2012 | CN101754584B Method for preparing conducting lines |
01/25/2012 | CN101695221B Technique for accommodating electronic components on a multilayer signal routing device |
01/25/2012 | CN101611660B Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film |
01/25/2012 | CN101605430B Method for pressing layer gasket of rigid-flexible product |
01/25/2012 | CN101605429B Method for machining rigid-flexible combination plate needing to be stamped and special die |
01/25/2012 | CN101572995B Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
01/25/2012 | CN101568224B Circuit board and electronic device having circuit board |
01/25/2012 | CN101496227B Novel integrated circuit support structures and the fabrication thereof |
01/25/2012 | CN101485237B Circuit board device, method for connecting wiring boards, and circuit substrate module device |
01/25/2012 | CN101472407B Wiring substrate and manufacturing method thereof |
01/25/2012 | CN101466199B Method for forming blind hole of circuit board using laser |
01/25/2012 | CN101443669B Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig |
01/25/2012 | CN101370887B Adhesive tape |
01/25/2012 | CN101283061B Uv curable hybridcuring ink jet ink composition and solder mask using the same |
01/25/2012 | CN101268146B Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
01/25/2012 | CN101112139B Jet solder bath |
01/25/2012 | CN101044806B Multilayer printed wiring board and method for producing same |
01/24/2012 | USRE43124 Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel |
01/24/2012 | US8102659 Flexible printed circuit board and liquid crystal display having the same |
01/24/2012 | US8102005 Wiring substrate, semiconductor device and manufacturing method thereof |
01/24/2012 | US8101931 RF screen assembly for microwave powered UV lamps |
01/24/2012 | US8099866 Conductor-clad laminate, wiring circuit board, and processes for producing the same |
01/24/2012 | US8099865 Method for manufacturing a circuit board having an embedded component therein |
01/24/2012 | DE212009000123U1 Betriebsmittel mit einer Fixierungseinheit Equipment with a fixing unit |
01/24/2012 | CA2524673C Method for mounting an electronic component on a substrate |
01/24/2012 | CA2504182C Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
01/20/2012 | DE202011051963U1 Vorrichtung zur Säuberung Apparatus for cleaning |
01/19/2012 | WO2012008686A2 Printing plate and method of manufacturing the same |
01/19/2012 | WO2012008578A1 Wiring board manufacturing method |
01/19/2012 | WO2012008472A1 Photosensitive resin composition and cured product thereof |
01/19/2012 | WO2012008171A1 Substrate with embedded coil |
01/19/2012 | WO2012007992A1 Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
01/19/2012 | WO2012007893A1 An oled device and a method of manufacturing the same |
01/19/2012 | WO2011116093A3 Solder return for wave solder nozzle |
01/19/2012 | WO2011112409A3 Wiring substrate with customization layers |
01/19/2012 | WO2011094303A3 hBN INSULATOR LAYERS AND ASSOCIATED METHODS |
01/19/2012 | WO2011012462A3 Composition for metal plating comprising suppressing agent for void free submicron feature filling |
01/19/2012 | US20120014124 Reduced profile lamp having enhanced illumination and method of construction thereof |
01/19/2012 | US20120014077 Chassis Connection System and Apparatus |
01/19/2012 | US20120014069 Power module |
01/19/2012 | US20120014017 Suspension substrate, suspension, head suspension, hard disk drive, method for manufacturing suspension substrate, and method for testing continuity of suspension |
01/19/2012 | US20120013592 Display device and method for manufacturing the same |
01/19/2012 | US20120013545 Enhanced conductors |
01/19/2012 | US20120013544 Position-sensing panel and method |
01/19/2012 | US20120013360 Method of repairing probe card and probe board using the same |
01/19/2012 | US20120012642 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
01/19/2012 | US20120012448 Keyboard illumination |
01/19/2012 | US20120012378 Printed circuit board and method of manufacturing the same |
01/19/2012 | US20120012371 Manufacturing method for circuit board, and circuit board |
01/19/2012 | US20120012368 Multilayer wiring board and method for manufacturing the same |
01/19/2012 | US20120011716 Method of manufacturing printed circuit board including outmost fine circuit pattern |
01/19/2012 | US20120011715 Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods |
01/19/2012 | US20120011714 Method and device for controlling board stopping position and method for controlling board mounting position |
01/19/2012 | US20120011713 Method for manufacturing multilayer printed circuit board |
01/19/2012 | DE102010027313A1 Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung A support device for a semiconductor chip, an electronic device having a carrier device and an optoelectronic component with a support device |
01/19/2012 | DE102009022659B4 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module |
01/18/2012 | EP2408285A1 Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same |
01/18/2012 | EP2408284A1 Assembly, and associated method, for forming a solder connection |
01/18/2012 | EP2408283A1 Method of fabricating pattern |
01/18/2012 | EP2407794A1 Electronic circuit and electronic device |
01/18/2012 | EP2407578A1 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same |
01/18/2012 | EP2407014A1 Method and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element |
01/18/2012 | EP1984981B1 Electronic assembly with high density, low cost attachment |
01/18/2012 | EP1880416B1 Process for minimizing electromigration in an electronic device |
01/18/2012 | CN202121928U A pressing device with FPC simultaneously bonded at two sides of a two-sided substrate |
01/18/2012 | CN202121882U Electronic component chip mounter device |
01/18/2012 | CN202121881U Continuous electroplating protection film applying device used for double path flexible circuit board |
01/18/2012 | CN202121880U Multi-channel washing series-connection washing overflow structure for horizontal line |
01/18/2012 | CN202121879U Circuit board immersion silver surface processing device capable of improving cleaning effect |
01/18/2012 | CN202121878U Circuit board silver immersing surface treatment equipment |
01/18/2012 | CN202121877U Tool for fixing printed circuit board assembly (PCBA) board |
01/18/2012 | CN202121876U Unidirectional reinforcing material jointing system |