Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2012
01/25/2012CN202127552U Fixture for solder levelling of PCB (printed circuit board) finished small board
01/25/2012CN202127551U Lamination table for printed circuit boards
01/25/2012CN202127550U Soft circuit board attaching clamp
01/25/2012CN202126568U Filter of PCB (Printed Circuit Board) developing solution
01/25/2012CN202123299U Tool stand for welding circuit boards manually
01/25/2012CN1938380B Thermosetting resin composition and multilayered printed wiring board comprising the same
01/25/2012CN1822746B Printed board
01/25/2012CN1739323B Multilayer wiring board and its manufacturing method
01/25/2012CN102334394A Wiring substrate and method for manufacturing wiring substrate
01/25/2012CN102334393A Wiring board
01/25/2012CN102334392A Electronic part manufacturing method and electronic part manufactured by the method
01/25/2012CN102334391A Multi-layer circuit carrier and method for the production thereof
01/25/2012CN102334389A 连接单元 Connection unit
01/25/2012CN102334184A 电子电路装置 Electronic circuit means
01/25/2012CN102333908A Metal-coated polyimide resin substrate with excellent thermal aging resistance properties
01/25/2012CN102333623A A method of generating a hole or recess or well in a substrate, a device for carrying out the method, and a high frequency high voltage source for use in such a device
01/25/2012CN102333612A Jet solder bath
01/25/2012CN102333419A Latch assembly and carrier with same
01/25/2012CN102333418A Device and method for carrying out printing ink curing on flexible circuit board
01/25/2012CN102333417A Method for manufacturing circuit board
01/25/2012CN102333416A Unidirectional reinforcement material laminating system and method
01/25/2012CN102333414A Heat dissipation structure, manufacturing method for the same and electronic device with the same
01/25/2012CN102332890A Surface mounted quartz crystal oscillator of PCB (Printed Circuit Board) base and manufacture method thereof
01/25/2012CN102332332A Flexible flat cable and its manufacture method, flexible printing substrate and its manufacture method
01/25/2012CN102331684A Photosensitive element, formation method of corrosion-resisting pattern, manufacture method of printing circuit wiring board and printing circuit wiring board
01/25/2012CN102328116A Drill and method for manufacturing printed circuit board
01/25/2012CN101951728B Production method for replacing flexible circuit board with rigid circuit board
01/25/2012CN101803485B Method for manufacturing multilayer printed wiring board
01/25/2012CN101754584B Method for preparing conducting lines
01/25/2012CN101695221B Technique for accommodating electronic components on a multilayer signal routing device
01/25/2012CN101611660B Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film
01/25/2012CN101605430B Method for pressing layer gasket of rigid-flexible product
01/25/2012CN101605429B Method for machining rigid-flexible combination plate needing to be stamped and special die
01/25/2012CN101572995B Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way
01/25/2012CN101568224B Circuit board and electronic device having circuit board
01/25/2012CN101496227B Novel integrated circuit support structures and the fabrication thereof
01/25/2012CN101485237B Circuit board device, method for connecting wiring boards, and circuit substrate module device
01/25/2012CN101472407B Wiring substrate and manufacturing method thereof
01/25/2012CN101466199B Method for forming blind hole of circuit board using laser
01/25/2012CN101443669B Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig
01/25/2012CN101370887B Adhesive tape
01/25/2012CN101283061B Uv curable hybridcuring ink jet ink composition and solder mask using the same
01/25/2012CN101268146B Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
01/25/2012CN101112139B Jet solder bath
01/25/2012CN101044806B Multilayer printed wiring board and method for producing same
01/24/2012USRE43124 Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
01/24/2012US8102659 Flexible printed circuit board and liquid crystal display having the same
01/24/2012US8102005 Wiring substrate, semiconductor device and manufacturing method thereof
01/24/2012US8101931 RF screen assembly for microwave powered UV lamps
01/24/2012US8099866 Conductor-clad laminate, wiring circuit board, and processes for producing the same
01/24/2012US8099865 Method for manufacturing a circuit board having an embedded component therein
01/24/2012DE212009000123U1 Betriebsmittel mit einer Fixierungseinheit Equipment with a fixing unit
01/24/2012CA2524673C Method for mounting an electronic component on a substrate
01/24/2012CA2504182C Cooling stations for use in a web printing process for the manufacture of electrochemical sensors
01/20/2012DE202011051963U1 Vorrichtung zur Säuberung Apparatus for cleaning
01/19/2012WO2012008686A2 Printing plate and method of manufacturing the same
01/19/2012WO2012008578A1 Wiring board manufacturing method
01/19/2012WO2012008472A1 Photosensitive resin composition and cured product thereof
01/19/2012WO2012008171A1 Substrate with embedded coil
01/19/2012WO2012007992A1 Flexible wiring board, dry film for coverlay, and production method for flexible wiring board
01/19/2012WO2012007893A1 An oled device and a method of manufacturing the same
01/19/2012WO2011116093A3 Solder return for wave solder nozzle
01/19/2012WO2011112409A3 Wiring substrate with customization layers
01/19/2012WO2011094303A3 hBN INSULATOR LAYERS AND ASSOCIATED METHODS
01/19/2012WO2011012462A3 Composition for metal plating comprising suppressing agent for void free submicron feature filling
01/19/2012US20120014124 Reduced profile lamp having enhanced illumination and method of construction thereof
01/19/2012US20120014077 Chassis Connection System and Apparatus
01/19/2012US20120014069 Power module
01/19/2012US20120014017 Suspension substrate, suspension, head suspension, hard disk drive, method for manufacturing suspension substrate, and method for testing continuity of suspension
01/19/2012US20120013592 Display device and method for manufacturing the same
01/19/2012US20120013545 Enhanced conductors
01/19/2012US20120013544 Position-sensing panel and method
01/19/2012US20120013360 Method of repairing probe card and probe board using the same
01/19/2012US20120012642 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
01/19/2012US20120012448 Keyboard illumination
01/19/2012US20120012378 Printed circuit board and method of manufacturing the same
01/19/2012US20120012371 Manufacturing method for circuit board, and circuit board
01/19/2012US20120012368 Multilayer wiring board and method for manufacturing the same
01/19/2012US20120011716 Method of manufacturing printed circuit board including outmost fine circuit pattern
01/19/2012US20120011715 Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
01/19/2012US20120011714 Method and device for controlling board stopping position and method for controlling board mounting position
01/19/2012US20120011713 Method for manufacturing multilayer printed circuit board
01/19/2012DE102010027313A1 Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung A support device for a semiconductor chip, an electronic device having a carrier device and an optoelectronic component with a support device
01/19/2012DE102009022659B4 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module
01/18/2012EP2408285A1 Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
01/18/2012EP2408284A1 Assembly, and associated method, for forming a solder connection
01/18/2012EP2408283A1 Method of fabricating pattern
01/18/2012EP2407794A1 Electronic circuit and electronic device
01/18/2012EP2407578A1 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
01/18/2012EP2407014A1 Method and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element
01/18/2012EP1984981B1 Electronic assembly with high density, low cost attachment
01/18/2012EP1880416B1 Process for minimizing electromigration in an electronic device
01/18/2012CN202121928U A pressing device with FPC simultaneously bonded at two sides of a two-sided substrate
01/18/2012CN202121882U Electronic component chip mounter device
01/18/2012CN202121881U Continuous electroplating protection film applying device used for double path flexible circuit board
01/18/2012CN202121880U Multi-channel washing series-connection washing overflow structure for horizontal line
01/18/2012CN202121879U Circuit board immersion silver surface processing device capable of improving cleaning effect
01/18/2012CN202121878U Circuit board silver immersing surface treatment equipment
01/18/2012CN202121877U Tool for fixing printed circuit board assembly (PCBA) board
01/18/2012CN202121876U Unidirectional reinforcing material jointing system