Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2012
03/28/2012CN102393603A Photocuring resin composition, dry film, curing product and print circuit board
03/28/2012CN102392281A PCB copper electroplating groove
03/28/2012CN102391822A Adhesive, adhesive for connecting circuit, connecting body and semiconductor device
03/28/2012CN102014577B Process for manufacturing local gold-plated board
03/28/2012CN101977482B Method for etching outer circuit of PCB product with high aspect ratio
03/28/2012CN101861055B Method of PCB board processing technology
03/28/2012CN101820729B PCB depth-control machining method and device thereof
03/28/2012CN101808471B PIN needle dissembling device and PIN dissembling head
03/28/2012CN101785373B Multilayered wiring board and semiconductor device
03/28/2012CN101711100B Method for preparing multilayer printed circuit board
03/28/2012CN101681860B Method of transferring adhesive film
03/28/2012CN101663924B Electrically conductive composition for via-holes
03/28/2012CN101662892B Ultra-thin copper foil with carrier, method for producing ultra-thin copper foil with carrier and printed circuit board
03/28/2012CN101634809B Method for exposing single-sided flexible circuit board
03/28/2012CN101616542B Flexible and rigid compound circuit board with deprivable protective layer and manufacturing method thereof
03/28/2012CN101569248B Method of producing conductive circuit board
03/28/2012CN101534610B Built-in capacitor element circuit board and manufacture method thereof
03/28/2012CN101437366B Method for manufacturing circuit board with raised bonding pad
03/28/2012CN101431038B Method and paste for contacting metal surfaces
03/28/2012CN101355853B Producing method of wired circuit board
03/28/2012CN101303989B Solder bump forming method and apparatus
03/28/2012CN101234455B Soldering tin paste composition and soldering-tin precoating method
03/28/2012CN101188915B Method of manufacturing a component-embedded printed circuit board
03/28/2012CN101173917B Fast criterion for through hole ability of black hole agent used for flexible printed circuit board
03/28/2012CN101160017B Wired circuit board and electronic device
03/28/2012CN101146406B Shaping method for flexible printing line circuit
03/27/2012US8144972 Manufacturing method of printed circuit board and manufacturing apparatus for the same
03/27/2012US8144473 Electro-optical apparatus, flexible printed circuit board, manufacturing method for electro-optical apparatus, and electronic equipment
03/27/2012US8142840 Adhesion promotion in printed circuit boards
03/27/2012US8142605 Circuit-connecting material and circuit terminal connected structure and connecting method
03/27/2012US8141245 Method of forming a circuit board with improved via design
03/27/2012US8141242 Method of fabricating gold finger of circuit board
03/27/2012US8141241 Method of manufacturing a printed circuit board having metal bumps
03/27/2012US8141240 Manufacturing method for micro-SD flash memory card
03/27/2012CA2536440C Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards
03/27/2012CA2532172C Component for a circuit board and method for inserting said component into a circuit board
03/27/2012CA2504574C Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors
03/27/2012CA2475491C Lead-free tin-silver-copper alloy solder composition
03/22/2012WO2012037509A2 Electrically conductive adhesive for temporary bonding
03/22/2012WO2012036844A1 Systems and methods for integrating radio-frequency indentification circuitry into flexible circuits
03/22/2012WO2012036751A2 Different types of memory integrated in one chip by using a novel protocol
03/22/2012WO2012036097A1 Laser processing method
03/22/2012WO2012035943A1 Soldering device
03/22/2012WO2012035857A1 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate
03/22/2012WO2012035771A1 Entry sheet for drilling
03/22/2012WO2012035722A1 Processing device
03/22/2012WO2012035494A1 Printed temperature sensor
03/22/2012WO2012035493A1 Assembling and packaging a discrete electronic component
03/22/2012WO2012034945A1 Method and apparatus for transporting support to be printed
03/22/2012WO2012034889A1 Electronic component with improved conduction structure
03/22/2012WO2012034383A1 Multi-layer through-hole stacked layer structure
03/22/2012WO2012034190A1 A power supply device and components thereof
03/22/2012WO2012034152A1 Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
03/22/2012WO2011138684A3 Pick and bond method and apparatus for transferring adhesive element to substrate
03/22/2012WO2011138674A3 Method and apparatus for placing adhesive element on a matrix
03/22/2012US20120072647 Different types of memory integrated in one chip by using a novel protocol
03/22/2012US20120071209 Mobile wireless communications device with reduced interfering energy from the display and related methods
03/22/2012US20120069588 Moving Light Table
03/22/2012US20120069538 Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same
03/22/2012US20120069536 Integrated overmolded interconnect tab for surface-mounted circuits
03/22/2012US20120068960 Touch screen and method of manufacturing the same
03/22/2012US20120068771 Heterogeneous integration of harmonic loads and transistor feedback for improved amplifier performance
03/22/2012US20120068265 Wiring layer structure and process for manufacture thereof
03/22/2012US20120067961 Systems and methods for integrating radio-frequency identification circuitry into flexible circuits
03/22/2012US20120067848 Apparatus and method for wet processing substrate
03/22/2012US20120067637 Interposer with microspring contacts and methods of making and using same
03/22/2012US20120067633 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
03/22/2012US20120067632 Printed wiring board and method for manufacturing the same
03/22/2012US20120067628 Printed wiring board
03/22/2012US20120067624 Connection structure and connection method of wiring board
03/22/2012US20120067623 Heat-radiating substrate and method for manufacturing the same
03/22/2012US20120066903 Method of manufacturing fpcb substrate
03/22/2012US20120066902 Method of manufacturing printed circuit board including landless via
03/22/2012US20120066901 Printed wiring board and method for manufacturing the same
03/22/2012US20120066900 Led lighting assemblies with thermal overmolding
03/22/2012DE102011100716A1 Verkabelungselement-Steckeraufbau Wiring connector element structure
03/22/2012DE102011082990A1 Elektronische Vorrichtung Electronic device
03/22/2012DE102010045649A1 Elektronische Vorrichtung und Verfahren zum direkten Montieren passiver Komponenten Electronic device and method for direct mount passive components
03/21/2012EP2432305A1 Flex-rigid wiring board and method of manufacturing the same
03/21/2012EP2432304A2 Integrated overmolded interconnect tab for surface-mounted circuits
03/21/2012EP2432074A1 Component with at least one UHF dipole aerial
03/21/2012EP2431400A2 Modified polyimide and method for producing modified polyimide
03/21/2012EP2430892A1 Connection of printed circuit boards
03/21/2012EP2430891A1 Pluggable varistor
03/21/2012EP2430890A1 Method and system for the treatment of flat feedstock, and device for removing or keeping away treatment liquid
03/21/2012EP2430889A1 Method, treatment station, and system for the treatment of flat feedstock
03/21/2012EP2430887A1 System for and method of providing high resolution images using monolithic arrays of light emitting diodes
03/21/2012EP2430639A1 Reliable and durable conductive films comprising metal nanostructures
03/21/2012EP2429815A2 Multi-layer article for flexible printed circuits
03/21/2012EP2162228B1 An electrostatic spraying device and a method of electrostatic spraying
03/21/2012CN202172532U 柔性线路板自动贴片机 Flexible circuit board automatic placement machine
03/21/2012CN202172531U Device for removing glues of oversized blind hole plate
03/21/2012CN202172530U 一种丝印拉斜网的线路板 One kind of silk pull inclined wire circuit boards
03/21/2012CN202172529U 电路板热板烤箱的板材摆放台 PCB hot plate oven plate placed Taiwan
03/21/2012CN202172528U 加工印刷电路板的水平设备 Processing the printed circuit board level of the equipment
03/21/2012CN202172001U 用于将表面安装元件安装到印刷电路板上的线缆定位器 For the surface mounting element is mounted to a cable positioned on a printed circuit board
03/21/2012CN202171722U 电路板曝光机冷却系统管道 PCB exposure machine cooling system piping
03/21/2012CN1876371B Half-tone screen printing device
03/21/2012CN1672107B Method and apparatus of thermal analysis
03/21/2012CN102388687A Electronic component mounting system and electronic component mounting method
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