| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/11/2012 | CN102317864A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same |
| 01/11/2012 | CN102317031A Metal filler, low-temperature-bonding lead-free solder and bonded structure |
| 01/11/2012 | CN102316682A Method for processing multi-layer PCB (printed circuit board) |
| 01/11/2012 | CN102316681A Circuit board and manufacturing method thereof |
| 01/11/2012 | CN102316680A Wiring substrate and method for manufacturing wiring substrate |
| 01/11/2012 | CN102316679A Manufacture method for double-side aluminum circuit board |
| 01/11/2012 | CN102316678A Method for making circuit board |
| 01/11/2012 | CN102316677A Electroplating method for double-side and multilayer flexible printed circuit board |
| 01/11/2012 | CN102316676A Electronic component module and method of manufacturing the same |
| 01/11/2012 | CN102316675A Circuit board and manufacture method thereof |
| 01/11/2012 | CN102316668A Substrate with fine metal pattern, print circuit board and semiconductor device, and production method of substrate with fine metal pattern, print circuit board and semiconductor device |
| 01/11/2012 | CN102316667A LED (light emitting diode) printed circuit board and production method thereof |
| 01/11/2012 | CN102316665A Flexible circuit board and manufacture method thereof |
| 01/11/2012 | CN102316664A Flexible circuit board and manufacture method thereof |
| 01/11/2012 | CN102316662A Photoelectric circuit board and manufacture method thereof |
| 01/11/2012 | CN102315195A Semiconductor package substrate and manufacturing method of the same |
| 01/11/2012 | CN102315194A Microstructure and microstructure production method |
| 01/11/2012 | CN102315042A Temperature fuse, temperature fuse mounting method and protection device |
| 01/11/2012 | CN102310342A Water-soluble lubricating film with low water absorption and manufacturing method of water-soluble lubricating film |
| 01/11/2012 | CN102074157B Corrosion device for copper clad laminate |
| 01/11/2012 | CN101803484B Partially rigid flexible circuits and method of making same |
| 01/11/2012 | CN101754590B Making method of circuit board of built-in passive components |
| 01/11/2012 | CN101742818B Packaging method for combining telescopic screw with printed circuit board |
| 01/11/2012 | CN101681858B Electronic component connecting method and joined body |
| 01/11/2012 | CN101632136B Conductive ink for letterpress reverse printing |
| 01/11/2012 | CN101616545B Leveling device for circuit board and method for leveling and welding |
| 01/11/2012 | CN101569245B Metal compositions, donors and patterned multilayer compositions, shield and sensor |
| 01/11/2012 | CN101536260B Adhesive film, and connection structure and connecting method for circuit member |
| 01/11/2012 | CN101512758B Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device |
| 01/11/2012 | CN101050846B Method for producing flexible light source and flexible base board and flexible solid state light source |
| 01/11/2012 | CN101037573B Adhesive, method of connecting wiring terminals and wiring structure |
| 01/10/2012 | US8094456 Polishing pad |
| 01/10/2012 | US8094221 Solid-state imaging device |
| 01/10/2012 | US8093507 Printed wiring board and method for producing the same |
| 01/10/2012 | US8093502 Flex-rigid wiring board and manufacturing method thereof |
| 01/10/2012 | US8092696 Method for manufacturing printed circuit board |
| 01/10/2012 | US8092075 Agitation/deaeration device |
| 01/10/2012 | US8091223 Method for manufacturing board with built-in electronic elements |
| 01/10/2012 | US8091222 Method for forming an adapter apparatus using curable material |
| 01/10/2012 | US8091221 Method of fabricating circuit board |
| 01/10/2012 | US8091220 Methods of making small volume in vitro analyte sensors |
| 01/10/2012 | US8091219 Method for establishing a high speed mezzanine connection |
| 01/10/2012 | US8091218 Method of manufacturing a rigid printed wiring board |
| 01/10/2012 | US8091216 Electronic parts mounting apparatus and electronic parts mounting method |
| 01/10/2012 | CA2586290C Single or multi-layer printed circuit board with improved via design |
| 01/10/2012 | CA2394403C Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board |
| 01/06/2012 | CA2745514A1 Connector for electronic assemblies that screens and does not require soldering |
| 01/05/2012 | WO2012003280A2 Bumpless build-up layer package design with an interposer |
| 01/05/2012 | WO2012002448A1 Bending device |
| 01/05/2012 | WO2012002273A1 Joint structure manufacturing method, heating and melting treatment method, and system for same |
| 01/05/2012 | WO2012002236A1 Wiring board, semiconductor device, and manufacturing methods thereof |
| 01/05/2012 | WO2012002173A1 Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY |
| 01/05/2012 | WO2012002147A1 Pb-FREE SOLDER ALLOY |
| 01/05/2012 | WO2012002133A1 Multilayer ceramic electronic component and method for producing same |
| 01/05/2012 | WO2012001742A1 Via structures and compact three-dimensional filters with the extended low noise out-of-band area |
| 01/05/2012 | WO2012001644A1 Method for encapsulating integrated circuit component solder joints with epoxy flux and apparatus provided with encapsulated solder joint |
| 01/05/2012 | WO2011112707A3 Attachment of a device to a substrate for operation under variable conditions |
| 01/05/2012 | WO2011106091A3 Method and structure for coaxial via routing in printed circuit boards for improved signal integrity |
| 01/05/2012 | US20120004012 Double-sided touch sensitive panel and flex circuit bonding |
| 01/05/2012 | US20120003859 Connector set and jointer for use therein |
| 01/05/2012 | US20120003844 Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies |
| 01/05/2012 | US20120002915 Optical module and fabrication method |
| 01/05/2012 | US20120002452 Compact inverter |
| 01/05/2012 | US20120002386 Method and Apparatus for Improving the Reliability of Solder Joints |
| 01/05/2012 | US20120002384 Casing for electronic ballast |
| 01/05/2012 | US20120002381 Method for manufacturing a liquid-tight electronic device, and liquid-tight electronic device |
| 01/05/2012 | US20120002377 Galvanic isolation transformer |
| 01/05/2012 | US20120001656 Apparatus, System, and Method for Direct Phase Probing and Mapping of Electromagnetic Signals |
| 01/05/2012 | US20120001627 Surface-mountable magnetic field sensor having a semiconductor chip and method for producing a circuit board having a magnetic field sensor |
| 01/05/2012 | US20120000697 Printed circuit board and method of manufacturing the same |
| 01/05/2012 | US20120000696 Liquid coverlays for flexible printed circuit boards |
| 01/05/2012 | US20120000387 Detonator cartridge and methods of use |
| 01/05/2012 | US20120000067 Method of manufacturing printed circuit board having flow preventing dam |
| 01/05/2012 | DE112009000012T5 Glaskeramikzusammensetzung, Glaskeramik-Sinterkörper und keramisches Mehrschicht-Elektronikbauteil Glass ceramic composition, ceramic sintered bodies and ceramic multi-layer electronic component |
| 01/05/2012 | DE102010025966A1 Interposer und Verfahren zum Herstellen von Löchern in einem Interposer Interposer and method for making holes in an interposer |
| 01/04/2012 | EP2403325A1 Wiring board, electronic device package, and methods of production of the same |
| 01/04/2012 | EP2403324A2 Light-emitting module and illumination device |
| 01/04/2012 | EP2403075A2 Connector for interconnecting conductors of circuit boards |
| 01/04/2012 | EP2402928A1 Character display module |
| 01/04/2012 | EP2402875A1 Noise analysis design method |
| 01/04/2012 | EP2402485A1 Metal-coated polyimide resin substrate with excellent thermal aging resistance properties |
| 01/04/2012 | EP2402102A1 Jet solder bath |
| 01/04/2012 | EP2401897A1 Multi-layer circuit carrier and method for the production thereof |
| 01/04/2012 | EP2401152A2 Printing method for producing individualized electric and/or electronic structures |
| 01/04/2012 | EP1953818B1 Electronic component mounting board |
| 01/04/2012 | EP1585604B1 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 01/04/2012 | EP1350270B1 Stacked die package |
| 01/04/2012 | CN202103964U Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
| 01/04/2012 | CN202103963U Anti-tin-sweat printing formwork opening structure |
| 01/04/2012 | CN202103962U Improved furnace-through fixture structure |
| 01/04/2012 | CN202103961U Crimping device of PCB (printed circuit board) connector |
| 01/04/2012 | CN202103960U Automatic production line for LED (Light-Emitting Diode) application product |
| 01/04/2012 | CN202103959U Photoelectric sheet multi-spliced concave-convex jig |
| 01/04/2012 | CN202103958U Bottom structure used during FPC electroplating process |
| 01/04/2012 | CN202103957U Medical liquid reflux device |
| 01/04/2012 | CN202103956U Forming machine for processing circuit board |
| 01/04/2012 | CN202103955U Vertical supporting device |
| 01/04/2012 | CN202103954U Horizontal production line provided with filter screen |
| 01/04/2012 | CN202103953U Semi-automatic pneumatic plate separating machine |
| 01/04/2012 | CN202102242U Image developing platform of screen printing plate |