Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2011
11/24/2011WO2011145490A1 Electronic component to be embedded in substrate and component embedded substrate
11/24/2011WO2011145367A1 Transparent flexible printed wiring board and process for producing same
11/24/2011WO2011145336A1 Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards
11/24/2011WO2011145294A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board
11/24/2011WO2011143861A1 Capacitive touch panel and method for reducing visibility of metal conductors in the same
11/24/2011WO2011113762A4 Film system for led applications
11/24/2011WO2010121277A8 Method for pretreating a frame or carrier element for the production of a circuit board, and frame or carrier element and use therefor
11/24/2011WO2010111455A3 Plastic articles and methods of their manufacturing, optionally with partial metal coating
11/24/2011US20110289023 Retail Item Display Device
11/24/2011US20110287670 Method for high-frequency tuning an electrical device
11/24/2011US20110287243 Multilayer film for electronic circuitry applications and methods relating thereto
11/24/2011US20110287214 Method for forming a micro-surface structure and for producing a micro-electromechanical component, micro-surface structure and micro-electromechanical component having said micro-surface structure
11/24/2011US20110286132 Suspension board with circuit and producing method thereof
11/24/2011US20110286081 Electronically addressable microencapsulated ink and display thereof
11/24/2011US20110285444 Oscillator circuit, method for manufacturing oscillator circuit, inertial sensor using the oscillator circuit, and electronic device
11/24/2011US20110285416 Multi-point probe for testing electrical properties and a method of producing a multi-point probe
11/24/2011US20110285409 Nanofluidic channel with embedded transverse nanoelectrodes and method of fabricating for same
11/24/2011US20110285406 Inductive sensor and method of assembly
11/24/2011US20110284496 Method of Forming Electronic Circuit
11/24/2011US20110284282 Wiring board and method for manufacturing the same
11/24/2011US20110284275 Circuit board having grown metal layer in a flexible zone
11/24/2011US20110284274 Wired circuit board and producing method thereof
11/24/2011US20110283533 Method for generation of electrically conducting surface structures, apparatus therefor and use
11/24/2011US20110283532 Flexible wiring board and method of manufacturing same
11/23/2011EP2389052A1 Wiring substrate, method for producing wiring substrate, and via paste
11/23/2011EP2389051A1 Method of manufacturing printed circuit board
11/23/2011EP2389050A1 Assembly of at least two electrical circuit boards
11/23/2011EP2388861A1 Connector
11/23/2011EP2388813A2 Method for manufacturing power semiconductor substrates
11/23/2011EP2388142A1 Screen material and structure of a screen printing form
11/23/2011EP2387482A2 Drilling head for printed circuit boards
11/23/2011EP1776002B1 Composite electronic component and method for manufacturing the same
11/23/2011EP1722613B1 Method for manufacturing a three-dimensional circuit board
11/23/2011EP1640350B1 Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition
11/23/2011CN202050599U Tool for printing solder paste on soft printed circuit board
11/23/2011CN202050598U Printed circuit board (PCB) carrier
11/23/2011CN202050597U Automatic identification machine
11/23/2011CN202050596U Automatic bending jig for multiple flexible printed circuit boards
11/23/2011CN202050595U High-pixel heat-dissipation-type light-emitting diode (LED) circuit board
11/23/2011CN202050588U Flexible printed circuit board back adhesive tape and adhesive tape sticking jig
11/23/2011CN202047136U Film stripping machine with pickling device
11/23/2011CN202045673U Compound universal die frame
11/23/2011CN202045432U Device for controlling height of pin of wave-welding spot
11/23/2011CN1722539B Strain-resistant electrical connection device
11/23/2011CN1672475B Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
11/23/2011CN102257887A Multilayer printed board and method for manufacturing the same
11/23/2011CN102257081A Heat-curable ink composition
11/23/2011CN102257035A Composition for metal electroplating comprising leveling agent
11/23/2011CN102256453A Multilayer circuit board manufacturing method
11/23/2011CN102256452A Circuit board with built-in semiconductor chip and method of manufacturing the same
11/23/2011CN102256451A Printed circuit board embedded with chip device and manufacturing method thereof
11/23/2011CN102256450A Embedded circuit board of passive device and manufacturing method thereof
11/23/2011CN102256449A Organic soldering protective film manufacturing process for naked copper printed board
11/23/2011CN102256448A Method of manufacturing printed circuit board
11/23/2011CN102256447A Etching device and circuit board etching method
11/23/2011CN102256446A Pressing film method of flexible printed circuit
11/23/2011CN102256445A Method for manufacturing organic substrate
11/23/2011CN102256444A Printed circuit board (PCB) carrier
11/23/2011CN102256443A Inductors occupying space above circuit board components
11/23/2011CN102256441A Metal substrate of heat conducting aluminium-based core and preparation method thereof
11/23/2011CN102256440A Aluminum based circuit board, manufacturing method thereof and electroplate liquid used by method
11/23/2011CN102256439A Printed circuit board, fuel cell and method of manufacturing printed circuit board
11/23/2011CN102256438A Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof
11/23/2011CN102256437A Wired circuit board and producing method thereof
11/23/2011CN102256435A Multilayer printed circuit board using flexible interconnect structure, and method of making same
11/23/2011CN102254885A Passive device, passive device-embedded circuit board and manufacturing method
11/23/2011CN102254832A Ceramic substrate manufacturing method
11/23/2011CN102253612A Aligning method for dry films
11/23/2011CN102253611A Method of detecting alignment mark and method of manufacturing printed circuit board
11/23/2011CN102251271A Method for peeling nickel plated gold finger
11/23/2011CN102248244A Fully-automatic tin soldering machine
11/23/2011CN101636039B Printed circuit board before being formed and cut and manufacturing method thereof
11/23/2011CN101511900B Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board
11/23/2011CN101489791B Position matching method and screen printer
11/23/2011CN101489359B Method for avoiding solder bridge
11/23/2011CN101431861B Printed wiring board
11/23/2011CN101310573B Method for connecting printed circuit boards
11/23/2011CN101246826B Method for mounting electronic components
11/23/2011CN101170869B Print circuit board embedding capacitor and its manufacture method
11/22/2011US8064216 Edge connector
11/22/2011US8064213 Module with a built-in component, and electronic device with the same
11/22/2011US8063313 Printed circuit board and semiconductor package including the same
11/22/2011US8062734 electrically conductive sheet that is transparent for use in transmitted display devices while being protected from abrasion or harsh ambient conditions; layer of nonconductive polymeric material having integral conduit channels of a transparent conductive material; for electronics
11/22/2011US8062537 Method for manufacturing an electronics module
11/22/2011US8061025 Method of manufacturing heat radiation substrate having metal core
11/22/2011US8061024 Method of fabricating a circuit board and semiconductor package.
11/22/2011US8061023 Process of fabricating a semiconductor package
11/22/2011US8061022 Method for manufacturing hybrid printed circuit board
11/22/2011US8061021 Method of replacing electrical components of a monitoring system
11/22/2011CA2622581C Laminated substrate for mounting electronic parts
11/22/2011CA2569694C Method of forming circuit assembly
11/22/2011CA2393399C Soldering flux
11/17/2011WO2011142558A2 Conductive metal ink composition, and method for forming a conductive pattern
11/17/2011WO2011142500A1 Double-sided flexible printed circuit board and method of manufacturing the same
11/17/2011WO2011142242A1 Screen printer
11/17/2011WO2011142198A1 Method of manufacturing metal-base substrate and method of manufacturing circuit board
11/17/2011WO2011142100A1 Composite substrate and manufacturing method for same
11/17/2011WO2011141764A1 Method of manufacture of flexible printed circuits
11/17/2011WO2011140689A1 Three-dimension circuit device and manufacture method thereof
11/17/2011US20110281202 Printed circuit board, fuel cell and method of manufacturing printed circuit board