Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2012
04/04/2012EP2436243A1 Method and apparatus for building multilayer circuits
04/04/2012EP2436029A2 Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
04/04/2012EP1498946B1 Circuit board, process for producing the same and power module
04/04/2012DE202012100608U1 Vorrichtung mit einem Verlagerungselement A device with a displacement member
04/04/2012CN202183914U 用于波峰焊的工艺装备 For wave soldering process equipment
04/04/2012CN202183913U 软性电路板夹持治具及固定机构 Flexible printed circuit board holding fixture and fixing mechanism
04/04/2012CN202181361U 印刷电路板药水清洁装置和印刷电路板加工系统 A printed circuit board and the printed circuit cleaning device syrup board processing system
04/04/2012CN202181360U 一种化金挂篮 One kind of gold hanging basket
04/04/2012CN202180277U Wave soldering tray
04/04/2012CN1948004B 薄板状薄膜的贴附装置及贴附方法 Affixing device attached sheet-like film and method
04/04/2012CN1842252B 制造结合基板的方法和用于结合基板的基板 Binding the substrate and the method for manufacturing of substrates for binding
04/04/2012CN102405692A Manufacturing method for circuit board, and circuit board
04/04/2012CN102405691A 用于输送待处理的扁平材料的方法、保持装置、设备和系统以及装载或卸载设备 A method for transporting flat material to be processed, the holding device, equipment and systems, and loading or unloading equipment
04/04/2012CN102404946A 整合高密度多层板的低密度多层电路板及其制造方法 Integration of high-density multilayer low density multilayer circuit board and its manufacturing method
04/04/2012CN102404945A 防连锡治具 Anti-bridging Fixture
04/04/2012CN102404944A 快速封胶网板 Quick sealed plastic stencils
04/04/2012CN102404943A 除泡装置 Debubblers device
04/04/2012CN102404942A Method of manufacturing thick copper foil PCB (Printed Circuit Board)
04/04/2012CN102404941A 金手指防沾锡治具 Goldfinger anti-wetting Fixture
04/04/2012CN102404940A 用于制造印刷电路板的方法 The method for manufacturing a printed circuit board
04/04/2012CN102404939A 湿处理装置及湿处理方法 Wet processing apparatus and wet-processing method
04/04/2012CN102404938A 影响印制板电气特性的制程因素管控方法 Process factors affecting the electrical characteristics of the PCB management and control method
04/04/2012CN102404937A 湿处理装置及湿处理方法 Wet processing apparatus and wet-processing method
04/04/2012CN102404936A 一种埋入分立式器件线路板及其制造方法 A discrete devices embedded in the board and its manufacturing method
04/04/2012CN102404935A Multilayered through hole laminating structure
04/04/2012CN102404934A 电路板基板及其制作方法 Circuit board substrate and manufacturing method thereof
04/04/2012CN102404933A 一种金属基板贯穿热通路的印刷电路板及其制备方法 A metal substrate through the printed circuit board and a method for preparing a thermal path
04/04/2012CN102404932A Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same
04/04/2012CN102400116A 用于印刷电路板的镀覆装置 For plating of printed circuit board apparatus
04/04/2012CN102399526A Adhesive composition, circuit connection structure, semiconductor device, and solar cell module
04/04/2012CN102398097A 过锡炉治具 Tin stove Fixture
04/04/2012CN101848602B Multi-layer printed board
04/04/2012CN101803479B Method for fabricating electrical bonding pads on a wafer
04/04/2012CN101790902B 多层基底 Multilayer substrate
04/04/2012CN101653053B Multilayer wiring board and its manufacturing method
04/04/2012CN101583245B 导电性部件图案的制造方法 The method of manufacturing a conductive member pattern
04/04/2012CN101299911B 制作多层电路化衬底的方法 Production method of multilayered circuitized substrate
04/03/2012US8149588 Circular electronic apparatus
04/03/2012US8148643 Multilayered printed circuit board and manufacturing method thereof
04/03/2012US8147911 Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.
04/03/2012US8147621 Oxidation of copper or chromium-nickel-iron alloy metal article; reduction in hydrogen; producing macroscopically smooth surface portions and a plurality of multiply curved nanopores; coating; semiconductors
04/03/2012US8147235 Device and method for large area lithography
04/03/2012US8146439 Sensor system and method for manufacturing a sensor system
04/03/2012US8146246 Method of manufacturing a wired circuit board
04/03/2012US8146245 Method for assembling a wafer level test probe card
04/03/2012US8146244 Method of manufacturing a handheld computing device
04/03/2012US8146243 Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
04/03/2012US8146241 Tool for reconfiguring the pins of a tractor trailer electrical connector
04/03/2012US8146239 Method of forming microcoil with conducting trace and attaching trace
03/2012
03/29/2012WO2012039437A1 Powdered sealant and sealing method
03/29/2012WO2012039436A1 Film sealant and sealing method
03/29/2012WO2012039380A1 Curable composition for inkjet and method for producing electronic component
03/29/2012WO2012039379A1 Curable composition for inkjet, and method for producing electronic component
03/29/2012WO2012039372A1 Curable composition for inkjet and method for producing electronic component
03/29/2012WO2012039285A1 Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board
03/29/2012WO2012039170A1 Circuit substrate working machine and circuit substrate working system
03/29/2012WO2012038490A1 Multiple information carrier
03/29/2012US20120076454 Optical module and method for manufacturing the same
03/29/2012US20120076003 Chassis management modules for advanced telecom computing architecture shelves, and methods for using the same
03/29/2012US20120075854 Led luminaire
03/29/2012US20120075821 Integrated circuit packaging system with a shield and method of manufacture thereof
03/29/2012US20120075816 Circuit device and method of manufacturing the same
03/29/2012US20120075576 Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles
03/29/2012US20120075032 Composite electronic module and method of manufacturing composite electronic module
03/29/2012US20120074094 Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier
03/29/2012US20120073897 Power steering apparatus
03/29/2012US20120073866 Touch screen panel and fabricating method therof
03/29/2012US20120073864 Direct mechanical/electrical printed circuit board interface
03/29/2012US20120073863 Anodized heat-radiating substrate and method of manufacturing the same
03/29/2012US20120073862 Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate
03/29/2012US20120073861 Printed circuit board and manufacturing method thereof
03/29/2012US20120073131 Method of producing wiring substrate
03/29/2012DE102011108198A1 Circuit board used for mounting electrical component e.g. LUXEON Rebel LED, has strip guard that is located on anodized coat that is arranged on top face of metal core
03/29/2012DE102010046566A1 Apparatus for soldering workpieces e.g. printed circuit boards, comprises wave forming units for generating solder waves, where each wave forming unit comprises housing having passage openings, through which molten solder is transportable
03/29/2012DE102010018858A1 Kontaktierungs- und Verbindungsanordnung auf der Basis von in einem Gehäuse eingebrachten Folienleitern Contacting and connection arrangement based on incorporated in a housing foil conductors
03/28/2012EP2434859A2 Conductive contact terminal to be mounted on a substrate surface
03/28/2012EP2434848A1 Flex-rigid wiring board and method of manufacturing the same
03/28/2012EP2434847A1 Circuit board
03/28/2012EP2434846A1 Wiring element, power distributor, and vehicle battery
03/28/2012EP2193696B1 High thermal performance packaging for optoelectronics devices
03/28/2012EP2015623B1 Circuit wiring board incorporating heat resistant substrate
03/28/2012EP1870191B1 Reflow oven
03/28/2012CN202178921U 移动终端lcd显示屏的fpc焊接结构 Fpc welded structure of the mobile terminal lcd display
03/28/2012CN202178918U 一种core涨缩性层偏可控的覆铜板 One kind of core sizing layer CCL controllable bias
03/28/2012CN202178142U Inductor/transformer and automobile power supply circuit board
03/28/2012CN202177779U 一种绿油菲林边对位检测装置 One kind of green oil film edge to position detection device
03/28/2012CN202174739U 一种pcb板热压治具 One kind of hot fixture pcb board
03/28/2012CN1946270B Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor
03/28/2012CN1863434B Component mounting board structure
03/28/2012CN102396300A Multi-layer flexible printed circuit board and method of manufacturing thereof
03/28/2012CN102396299A Back drill verification feature
03/28/2012CN102396298A Method for conductively connecting a component on a transparent substrate
03/28/2012CN102396297A Solder bump formation on a circuit board using a transfer sheet
03/28/2012CN102396113A Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
03/28/2012CN102396037A Composition for forming conductor layer, conductor substrate, and method for producing conductor substrate
03/28/2012CN102395924A Photosensitive resin composition, photosensitive element utilizing the composition, method for formation of resist pattern, and process for production of printed circuit board
03/28/2012CN102395250A Vacuum pumping device and method for circuit board
03/28/2012CN102395249A Manufacturing method of four-layer copper-based metal plate
03/28/2012CN102393605A Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
03/28/2012CN102393604A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
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