| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/15/2012 | CN102355798A Manufacturing method of cylindrical module circuit board and sintering bracket |
| 02/15/2012 | CN102355797A Sintering process for metal substrate and printed board |
| 02/15/2012 | CN102355796A Manufacturing method of novel aluminum substrate |
| 02/15/2012 | CN102355795A 4.5-inch aluminum nitride ceramic substrate printing process with high production efficiency |
| 02/15/2012 | CN102355793A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device |
| 02/15/2012 | CN102350555A Pulse hot pressing welding machine |
| 02/15/2012 | CN101965102B 电路板模块 Circuit board module |
| 02/15/2012 | CN101894774B 电子部件安装方法和电子部件安装装置 Electronic component mounting method and an electronic component mounting apparatus |
| 02/15/2012 | CN101517739B 固体摄像装置 The solid-state imaging device |
| 02/15/2012 | CN101501151B 粘接剂组合物和电路部件的连接结构 Connection structure adhesive composition and the circuit member |
| 02/15/2012 | CN101347052B 印刷配线板的连接方法及连接装置 The connection method of the printed wiring board and the connecting means |
| 02/15/2012 | CN101233619B 微电子部件的封装及其制造方法 Package and method for manufacturing microelectronic components |
| 02/15/2012 | CN101066001B 布线基板及其制造方法以及半导体器件 Wiring board and its manufacturing method and a semiconductor device |
| 02/15/2012 | CN101060757B 用于形成无残余印刷电路板的工艺及其形成的印刷电路板 No residue for forming a printed circuit board and the formation process of a printed circuit board |
| 02/14/2012 | US8116092 Circuit board and method of manufacturing same |
| 02/14/2012 | US8116091 Printed circuit board |
| 02/14/2012 | US8116088 Semiconductor package and method of forming the same, and printed circuit board |
| 02/14/2012 | US8115322 Adhesive, method of connecting wiring terminals and wiring structure |
| 02/14/2012 | US8115111 Multilayer printed wiring board with filled viahole structure |
| 02/14/2012 | US8115110 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 02/14/2012 | US8114714 Electronic device and production method thereof |
| 02/14/2012 | US8114709 Electronic device and lead frame |
| 02/14/2012 | US8114468 Methods of forming a non-volatile resistive oxide memory array |
| 02/14/2012 | US8112885 Method for forming copper interconnection structures |
| 02/14/2012 | US8112883 Method and apparatus for manufacturing electronic circuit board |
| 02/14/2012 | US8112882 Method for producing a structure |
| 02/14/2012 | US8112881 Method for manufacturing multilayer wiring board |
| 02/14/2012 | US8112880 Method for manufacturing multilayer printed circuit boards |
| 02/14/2012 | CA2470373C Method for making a multilayer module with high-density printed circuits |
| 02/14/2012 | CA2470229C Method for making a non-detachable microcircuit card |
| 02/09/2012 | WO2012019092A1 Polymer composition for microelectronic assembly |
| 02/09/2012 | WO2012019091A1 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers |
| 02/09/2012 | WO2012018471A1 Systems and methods of coupling digitizing sensors to a structure |
| 02/09/2012 | WO2012018046A1 Semiconductor device bonding material |
| 02/09/2012 | WO2012017909A1 Method for producing printed wiring board, and printed wiring board |
| 02/09/2012 | WO2012017507A1 Circuit board and method for manufacturing same |
| 02/09/2012 | WO2012016932A1 Method to form solder deposits and non-melting bump structures on substrates |
| 02/09/2012 | WO2012016896A1 Multilayered rear contact film |
| 02/09/2012 | WO2012016864A1 Process for fabricating printed circuit boards |
| 02/09/2012 | WO2012016760A1 Optoelectronic lighting module and motor vehicle headlight |
| 02/09/2012 | WO2012016560A1 Screen printing machine and screen printing method for producing printed circuit boards for the electric industry |
| 02/09/2012 | WO2012016258A2 Adhesive for fixing and/or embedding an electronic component and metnod and use |
| 02/09/2012 | US20120034371 Metal plating compositions |
| 02/09/2012 | US20120033479 Modification of logic by morphological manipulation of a semiconductor resistive element |
| 02/09/2012 | US20120033395 Printed circuit board assembly sheet and method for manufacturing the same |
| 02/09/2012 | US20120033394 Method of fabricating embedded component package structure and the package structure thereof |
| 02/09/2012 | US20120032916 Capacitive touch member, manufacturing method therefor, and capacitive touch detection apparatus |
| 02/09/2012 | US20120032912 Touch substrate and method of manufacturing the same |
| 02/09/2012 | US20120032670 Rotational angle sensor and method manufacturing same, and throttle control device with rotational angle sensor |
| 02/09/2012 | US20120031873 Etching device and method for manufacturing printed circuit board using same |
| 02/09/2012 | US20120031658 Printed circuit board and method for manufacturing the same |
| 02/09/2012 | US20120031656 Substrate for printed wiring board, printed wiring board, and methods for producing same |
| 02/09/2012 | US20120031655 Multi-Layer Circuit Assembly And Process For Preparing The Same |
| 02/09/2012 | US20120031652 Circuit board and manufacturing method thereof |
| 02/09/2012 | US20120031650 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| 02/09/2012 | US20120031647 Conductive pattern and manufacturing method thereof |
| 02/09/2012 | US20120031198 Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board |
| 02/09/2012 | US20120030943 Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
| 02/09/2012 | US20120030942 Method for manufacturing multi-layer printed circuit board |
| 02/09/2012 | US20120030941 Electronic component mounting device and method for producing the same |
| 02/09/2012 | US20120030940 Method of manufacturing component embedded printed circuit board |
| 02/09/2012 | US20120030939 Wired circuit board and producing method thereof |
| 02/09/2012 | US20120030938 Method of manufacturing printed circuit board |
| 02/09/2012 | DE102010033813A1 Anschluss- und Messvorrichtung für den Anschluss einer Stromversorgung an eine Leiterplatte Connection and measuring device for connecting a power supply to a printed circuit board |
| 02/09/2012 | DE102010033193A1 Siebdruckmaschine und Siebdruckverfahren zur Herstellung von Platinen für die Elektroindustrie Screen printing machine and screen printing process for the production of printed circuit boards for the electrical industry |
| 02/09/2012 | DE102009038674B4 Trägervorrichtung, Anordnung mit einer solchen Trägervorrichtung sowie Verfahren zur Herstellung eines mindestens eine keramische Schicht umfassenden struktururierten Schichtstapels A carrier device, carrier device comprising such a device and method for producing a ceramic layer at least comprising a layer stack struktururierten |
| 02/09/2012 | DE102007013737B4 Verfahren zur Herstellung eines Substrats mit Substratkern für eine elektronische Baugruppe A method for producing a substrate with substrate core for an electronic assembly |
| 02/09/2012 | DE102004044946B4 Verfahren zum Trennen eines Halbleiterwafers A method for separating a semiconductor wafer |
| 02/09/2012 | DE102004025714B4 Verfahren und Füllvorrichtung zum Verfüllen von verflüssigtem Material Procedures and filler for filling of liquefied material |
| 02/08/2012 | EP2416635A1 Multilayer printed wiring boards with copper filled through-holes |
| 02/08/2012 | EP2416634A1 Method to form solder deposits on substrates |
| 02/08/2012 | EP2416633A1 Method for fixing and/or embedding an electronic component and adhesive for use in such a method |
| 02/08/2012 | EP2416632A1 Circuit substrate and manufacturing method thereof |
| 02/08/2012 | EP2416385A1 Multi-layer back contact film |
| 02/08/2012 | EP2416355A1 Circuit board |
| 02/08/2012 | EP2416328A2 Low temperature fireable paste composition for forming an electrode or wiring |
| 02/08/2012 | EP2416064A1 Electric signal switch assembly, preferably electric signal light assembly |
| 02/08/2012 | EP2415849A1 Agent for removing conductive film and method for removing conductive film |
| 02/08/2012 | EP2415332A2 Conductor structural element and method for producing a conductor structural element |
| 02/08/2012 | EP2414304A1 Metal/ceramic substrate |
| 02/08/2012 | EP2165362B1 Low resistance through-wafer via |
| 02/08/2012 | EP1835792B1 Method of manufacturing printed wiring board |
| 02/08/2012 | CN202143308U 一种智能排风吹风待机系统 An intelligent ventilation hair standby system |
| 02/08/2012 | CN202143307U 阻焊退膜架 Solder back film frame |
| 02/08/2012 | CN202143306U 基板湿制程液体吸取装置 Substrate wet process liquid suction device |
| 02/08/2012 | CN202143305U 一种pcb生产用的简易灌胶模具 One kind of simple pcb production Glue mold |
| 02/08/2012 | CN202143303U 具有加固装置的柔性电路板 Reinforcing means having a flexible circuit board |
| 02/08/2012 | CN202141888U 一种菲林对位台结构 One kind of film on the bit platform structure |
| 02/08/2012 | CN202138862U 一种用于pcb除钯浸泡的固定装置 A pcb fixtures except for palladium immersion |
| 02/08/2012 | CN202138836U 一种具有节水装置的水洗机 A washing machine with a water-saving device |
| 02/08/2012 | CN202138059U 烘烤架 Baking rack |
| 02/08/2012 | CN202137483U 电子线路板的自动锡焊机构 Automatic soldering agency electronic circuit board |
| 02/08/2012 | CN202137145U 一种线路板沉锡线后处理装置 A circuit board tin line post-processing device |
| 02/08/2012 | CN1988251B 无线射频识别天线的制作方法及其天线结构 The method of making the RFID antenna and the antenna structure |
| 02/08/2012 | CN1949500B 配线板、半导体器件及制造配线板和半导体器件的方法 The method of wiring board, a semiconductor device and manufacturing wiring board and a semiconductor device |
| 02/08/2012 | CN1799294B 填充微盲孔的方法 The method of filling micro blind hole |
| 02/08/2012 | CN1799292B 基板制造方法 The method of manufacturing a substrate |
| 02/08/2012 | CN1750927B 聚酰亚胺金属层积体 Polyimide metal laminate |
| 02/08/2012 | CN102349362A Electronic component mounting method and electronic component mounting structure |
| 02/08/2012 | CN102349361A Method and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element |