Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2012
01/18/2012CN202121875U Bidirectional reinforcing material applying system
01/18/2012CN202121874U Pneumatic push rod device capable of detecting barrier
01/18/2012CN202121872U Copper foil for printed circuit board
01/18/2012CN102326462A Jet soldering device and soldering method
01/18/2012CN102326461A Wiring board, electronic device package, and methods of production of same
01/18/2012CN102326460A Conductive substrate
01/18/2012CN102326459A Improved substrate support material useful for screen printing processes
01/18/2012CN102326226A Auto-tuned screen printing process
01/18/2012CN102326213A Metal thin film production method and metal thin film
01/18/2012CN102325819A Starting liquid for forming protective film, protective film, and wired substrate having protective film
01/18/2012CN102325654A Method and apparatus for screen printing a multiple layer pattern
01/18/2012CN102325432A Manufacturing method of cathode/anode aluminum foil circuit boards
01/18/2012CN102325431A Method for making copper cylinder on circuit board and circuit board with surface copper cylinders
01/18/2012CN102325430A Adhesive tape
01/18/2012CN102325429A Method for bonding upper and lower magnetic cores of module power supply
01/18/2012CN102325428A Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter
01/18/2012CN102325427A Printed circuit board solder resist ink coating technology and coating apparatus
01/18/2012CN102325426A Circuit board fabrication method for laminating asymmetric light guide panel on outer layer of multilayer panel again
01/18/2012CN102324405A Manufacturing method of semiconductor device
01/18/2012CN102320064A Stamping and cutting mould
01/18/2012CN101820730B Method for preparing printed wiring board by selectively plating gold
01/18/2012CN101808475B Circuit board and preparation process thereof
01/18/2012CN101792521B Latent curing agent
01/18/2012CN101730390B Manufacturing method of metal plating
01/18/2012CN101716744B Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board
01/18/2012CN101668384B Copper foil for printed circuit board with taking environmental conservation into consideration and manufacturing method thereof
01/18/2012CN101405657B Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
01/18/2012CN101397402B Thermosetting resin composite and cured resin
01/18/2012CN101325846B 多层配线基板及其制造方法 A multilayer wiring board and its manufacturing method
01/18/2012CN101232009B Mounting structures for integrated circuit modules
01/18/2012CN101151948B Production method of solder circuit board
01/18/2012CN101124516B Pattern formation material, pattern formation device, and pattern formation method
01/18/2012CN101066004B Method for producing substrate having through hole filled with conductive material
01/18/2012CN101053286B Electrochemical method for filling hole with metal, especially with copper filling hole of printed circuit board
01/17/2012US8097335 Lightweight circuit board with conductive constraining cores
01/17/2012US8096047 Electronic component mounting apparatus
01/12/2012WO2012006063A2 Microelectronic package and method of manufacturing same
01/12/2012WO2012005997A1 Compression box for reflow oven heating and related method
01/12/2012WO2012005723A1 Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
01/12/2012WO2012005524A2 The printed circuit board and the method for manufacturing the same
01/12/2012WO2012005470A2 Dual rail screen printer
01/12/2012WO2012005394A1 Printed circuit board and method of manufacturing the same
01/12/2012WO2012005236A1 Laminated wiring board and manufacturing method for same
01/12/2012WO2012005052A1 Electronic component and method of producing same
01/12/2012WO2012004177A1 Connecting contact
01/12/2012WO2011126646A3 Improved backdrilling of multilayer printed circuit boards
01/12/2012WO2011125037A3 Process for producing electric circuits on a given surface
01/12/2012WO2011115371A3 Etchant for metal wiring and method for manufacturing metal wiring using the same
01/12/2012WO2011099820A3 Pcb with cavity and fabricating method thereof
01/12/2012US20120009973 Module Connection in a Printed Wiring Board
01/12/2012US20120008445 Dual bit line precharge architecture and method for low power dynamic random access memory (dram) integrated circuit devices and devices incorporating embedded dram
01/12/2012US20120008297 Wiring board and method for manufacturing the same
01/12/2012US20120008296 Wiring board and method for manufacturing the same
01/12/2012US20120008295 Wiring board and method for manufacturing the same
01/12/2012US20120008293 Wiring board and method of manufacturing the same
01/12/2012US20120008287 Electronic component module and method of manufacturing the same
01/12/2012US20120008227 Heat transfer for a hard-drive pre-amp
01/12/2012US20120008064 Chip component mounting structure, chip component mounting method and liquid crystal display device
01/12/2012US20120007698 Miniature RF and Microwave Components and Methods for Fabricating Such Components
01/12/2012US20120007627 Probe head of probe card and manufacturing method of composite board of probe head
01/12/2012US20120006592 Wiring board and method for manufacturing the same
01/12/2012US20120006591 Wiring Substrate and Method for Manufacturing Wiring Substrate
01/12/2012US20120006469 Printed circuit board and method of manufacturing printed circuit board
01/12/2012US20120005894 Method of manufacturing multilayered printed circuit board
01/12/2012US20120005892 Method of manufacturing a printed circuit board including a component located in a via
01/12/2012US20120005891 Wireless telemetry electronic circuit board for high temperature environments
01/12/2012US20120005890 Method of manufacturing printed circuit board for optical waveguides
01/12/2012US20120005889 Multilayer printed wiring board
01/12/2012US20120005888 Plating apparatus, plating method and multilayer printed circuit board
01/12/2012US20120005887 Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same
01/12/2012US20120005886 Method of manufacturing printed circuit board having buried solder bump
01/12/2012DE112009002278T5 Reflow-Lotvorrichtung mit einer eine Trennwand aufweisenden Prozesskammer Verfahren zum Feflow-Loten -unter Verwendung einer solchen Reflow- Lotvorrichtung Reflow Lotvorrichtung with a partition having process chamber method for Feflow solders -having use of such a reflow Lotvorrichtung
01/12/2012DE112009001549T5 Bleifreies Plattierelement und Verfahren zur Bildung einer Plattierschicht A lead-free plating element and method for forming a plating layer
01/12/2012DE102011007842A1 Mehrschichtige Leiterplatte Multilayer PCB
01/12/2012DE102010026312A1 Anschlusskontakt Connection contact
01/11/2012EP2405727A1 Manufacturing method for circuit board, and circuit board
01/11/2012EP2405726A2 Method for manufacturing a printed circuit board
01/11/2012EP2405725A1 Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device
01/11/2012EP2405724A1 Printed circuit board module
01/11/2012EP2405723A1 Ceramic package for housing light emitting element
01/11/2012EP2405722A1 Signal transmission circuit and multilayer board
01/11/2012EP2405540A1 Circuit board connector with drilling tamper detection arrangement
01/11/2012EP2405538A1 Shielding connector without electrical welding for electronic assemblies
01/11/2012EP2404487A1 Multilayer film for electronic circuitry applications and methods relating thereto
01/11/2012EP2404300A1 Method and apparatus for manufacturing mosaic tape for use in communication cable
01/11/2012EP1088470B1 Ic stack utilizing flexible circuits with bga contacts
01/11/2012CN202111945U Carrier for machining electronic circuit board
01/11/2012CN202111944U Separation plate for assembling printed circuit board of LED display screen
01/11/2012CN202111943U Device for ink solidification of flexible circuit board
01/11/2012CN202111942U Automatic air-blowing cleaning device
01/11/2012CN202111939U Flexible printing wiring board, connection structure thereof and electronic equipment thereof
01/11/2012CN202110931U Planar transformer
01/11/2012CN202110834U Flow guide structure of motor driver power circuit for electric motorcycle
01/11/2012CN202106422U Novel FPC jointed board mould
01/11/2012CN1972563B Conductor-clad laminate, wiring circuit board, and processes for producing the same
01/11/2012CN1826844B Solder ball loading method and solder ball loading unit
01/11/2012CN1826037B Rigid flexible printed circuit board and method of fabricating same
01/11/2012CN1697259B Board mounted electrical connector
01/11/2012CN102318452A Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device
01/11/2012CN102318451A Method and apparatus for laser machining relatively narrow and relatively wide structures