H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2011
12/01/2011	WO2011149195A2 Method for attaching member plates to fpc product, and member plate tapes
12/01/2011	WO2011149097A1 Multi-chip wiring board and process for producing same, and wiring board and process for producing same
12/01/2011	WO2011149065A1 Circuit board and electronic device using the same
12/01/2011	WO2011149019A1 Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor device
12/01/2011	WO2011148915A1 Module substrate and method for manufacturing same
12/01/2011	WO2011148718A1 Screen-printing stencil having amorphous carbon films and manufacturing method therefor
12/01/2011	WO2011148678A1 Lc co-sintered substrate and method for producing same
12/01/2011	WO2011148615A1 Substrate with built-in component
12/01/2011	WO2011148491A1 Process for production of semiconductor device
12/01/2011	WO2011147448A1 Composition and method for micro etching of copper and copper alloys
12/01/2011	WO2011147284A1 Ceramic printed circuit board structure
12/01/2011	WO2011096695A3 Process for creating an inspection program
12/01/2011	US20110293960 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
12/01/2011	US20110292622 Method for electric circuit deposition
12/01/2011	US20110292619 Electronic component and method for producing such an electronic component
12/01/2011	US20110292612 Electronic device having electrically grounded heat sink and method of manufacturing the same
12/01/2011	US20110292126 Molded nozzle plate with alignment features for simplified assembly
12/01/2011	US20110291572 Display Drivers
12/01/2011	US20110290548 Method for manufacturing insulated conductive pattern and laminate
12/01/2011	US20110290547 Electrode structure of multiple dielectric island layer and manufacturing method thereof
12/01/2011	US20110290546 Printed circuit board having electronic component and method for manufacturing thereof
12/01/2011	US20110290545 Through wiring board and method of manufacturing the same
12/01/2011	US20110290544 Printed wiring board and manufacturing method of printed wiring board
12/01/2011	US20110290543 Method for producing wiring board and wiring board
12/01/2011	US20110290540 Embedded printed circuit board and method of manufacturing the same
12/01/2011	US20110290535 Wiring substrate and method for manufacturing wiring substrate
12/01/2011	US20110290408 Method of manufacturing printed wiring board
12/01/2011	US20110289774 Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies
12/01/2011	US20110289773 Method of manufacturing printed wiring board with built-in electronic component
12/01/2011	US20110289771 Method for producing conductive sheet and method for producing touch panel
12/01/2011	US20110289770 Apparatus for and method of manufacturing temporary substrate
12/01/2011	DE102010029494A1 Connection system for connecting e.g. printed circuit board with electronic component e.g. resistor, to form electrical circuit, has contact structure with springs for pressing contact wire during insertion into wire-receiving sections
12/01/2011	DE102010028990A1 Printed circuit board composite, has coupling circuit boards passing through corresponding inserted openings and corresponding female connector, where printed circuit boards form planes parallel to each other
11/2011
11/30/2011	EP2390914A1 Assembly of two connection partners with low temperature pressure interconnection and method for producing same
11/30/2011	EP2390277A1 (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material
11/30/2011	EP2390276A1 Carboxyl group-containing polyurethane
11/30/2011	EP1641096B1 Electric junction box and its assembling process
11/30/2011	EP1612891B1 Anisotropic electrically conductive film and method of producing the same
11/30/2011	CN202059693U 薄膜电容式触摸传感器与pcb板的连接结构 Film capacitive touch sensor and pcb board connection structure
11/30/2011	CN202059692U 一种高效生产led点阵pcb板擦板治具 An efficient production led dot matrix eraser board pcb fixtures
11/30/2011	CN202059691U 一种智能控制pcb腐蚀箱 An intelligent control box pcb corrosion
11/30/2011	CN202059690U 线路板上下板自动装卸装置 Circuit board under the board automatic handling equipment
11/30/2011	CN202059689U 电路板喷锡加工后处理装置 HASL PCB processing post-processing device
11/30/2011	CN202059687U 具有副板的电路板 A circuit board having a sub-plate
11/30/2011	CN202059683U 十字贴面成型焊接结构 Cross veneer forming welded structures
11/30/2011	CN1988257B 烫印-模切制作射频天线的工艺方法 Stamping - die-making process for the RF antenna
11/30/2011	CN1984524B 柔性电路膜和具有该柔性电路膜的显示面板组件 The flexible circuit film and the display panel assembly having the flexible circuit film
11/30/2011	CN1767727B 导电球接合方法和导电球接合装置 Conductive ball bonding method and conductive ball bonding device
11/30/2011	CN102265718A 多层布线基板、及多层布线基板的制造方法 A multilayer wiring board, and manufacturing a multilayer wiring board
11/30/2011	CN102265717A 刚挠性电路板及其制造方法 Rigid wiring board and manufacturing method thereof
11/30/2011	CN102265716A 具有功率管理集成电路的芯片封装和相关技术 With power management integrated circuit chip packaging and related technologies
11/30/2011	CN102265715A 柔性基板和电子器件 A flexible substrate and electronic device
11/30/2011	CN102265714A 电子部件及其制造方法 An electronic component and its manufacturing method
11/30/2011	CN102265713A 使用电子照相术制造电路板的方法 Using electrophotography method of producing a circuit board
11/30/2011	CN102265712A 电子电路的形成方法 The method of forming an electronic circuit
11/30/2011	CN102265711A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit
11/30/2011	CN102265710A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil and the use of electronic circuits forming an electronic circuit are a method
11/30/2011	CN102265709A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof
11/30/2011	CN102265708A 高数据率连接器系统 High data rate connector system
11/30/2011	CN102264946A 具有导电结构的安全证件和/或价值证件及其制备方法 Security document having a conductive structure and / or value document and its preparation method
11/30/2011	CN102264838A 固化性组合物 The curable composition
11/30/2011	CN102264793A 树脂组合物、半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置 The resin composition, a prepreg, a resin sheet, a metal-clad laminated plate, a printed wiring board, a multilayer printed wiring board and a semiconductor device
11/30/2011	CN102264537A 表面金属膜材料、表面金属膜材料的制作方法、金属图案材料的制作方法及金属图案材料 Surface of the metal film material, a metal film production method of the surface material, manufacturing method and a metal pattern material metal pattern material
11/30/2011	CN102264195A 具有半孔的电路板的成型方法 The method of half-hole forming a circuit board having
11/30/2011	CN102264194A 分段式金手指的加工工艺 Segmented Goldfinger processing technology
11/30/2011	CN102264193A 软硬结合板的制作方法 Flex PCB's production methods
11/30/2011	CN102264192A 加工印刷电路板的水平设备和加工印刷电路板的方法 Processing the printed circuit board level equipment and processing method the printed circuit board
11/30/2011	CN102264191A 一种高密度互连的铝基电路板的制备方法 Method for preparing a high-density interconnect circuit boards aluminum
11/30/2011	CN102263043A Fpd组件的组装装置 Fpd component assembly apparatus
11/30/2011	CN102262358A 一种内层板双面对位装置和方法 One kind of inner panel double face positioning device and method
11/30/2011	CN102259503A 自动喷码系统及其使用方法 Automatic Coding System and method of use
11/30/2011	CN101877940B 磁铁焊接装置及焊接方法 Magnet welding equipment and welding method
11/30/2011	CN101808470B 一种具有光学功能的印刷线路板的制造方法 A method for producing a printed wiring board having an optical function
11/30/2011	CN101803481B 布线基板及其制造方法 Wiring board and manufacturing method thereof
11/30/2011	CN101772274B 线路基板的表面电镀方法 The method of surface plating wiring substrate
11/30/2011	CN101699933B 一种铜面光亮高导热陶瓷电路板的生产方法 A copper surface bright high thermal conductivity ceramic circuit board production method
11/30/2011	CN101614988B 导电图案形成装置 Conductive pattern forming apparatus
11/30/2011	CN101604668B 无Pb焊料连接结构和电子装置 Pb-free solder connection structure and electronic devices
11/30/2011	CN101583456B 激光焊接装置 Laser welding equipment
11/30/2011	CN101578928B 电路基板及其制造方法 Circuit board and manufacturing method thereof
11/30/2011	CN101500744B 膏状钎焊料和电子部件的软钎焊方法 A method of soldering of the solder cream and the electronic component
11/30/2011	CN101474876B 薄板状被加工构件用热压加工装置及热压加工方法 Sheet-like member to be processed by hot pressing and hot pressing method means
11/30/2011	CN101356475B 光固化性·热固化性阻焊剂组合物及使用其的印刷电路板 · The photo-curable thermosetting solder resist composition and a printed circuit board using thereof
11/30/2011	CN101313439B 用于高速信号设计的印刷电路板中的同轴通孔 Designed for high-speed signal in the printed circuit board through hole coaxial
11/30/2011	CN101263733B 透声膜、带透声膜的电子部件及安装有该电子部件的电路板的制造方法 Method for producing a sound-permeable membrane, an electronic component with a sound-permeable membrane and the electronic component mounted circuit board
11/30/2011	CN101188906B 粘合薄膜切断装置和方法以及粘合薄膜附着设备和方法 Adhesive film cutting apparatus and method, and apparatus and method for attaching an adhesive film
11/30/2011	CN101185027B 接枝图案形成方法和导电图形成方法 Graft pattern forming method and the conductive pattern forming method
11/30/2011	CN101166401B 用于在高速系统中放置多个负载的方法和系统 The method used to place multiple loads in high-speed systems and systems
11/30/2011	CN101161391B 焊剂成膜装置及焊剂面的平滑化方法 Smoothing film forming apparatus and method of solder flux surfaces
11/30/2011	CN101155481B 挠性基板的制造方法 The method of manufacturing a flexible substrate
11/30/2011	CN101134389B 丝网印刷装置及其印刷方法 Screen printing apparatus and printing method
11/30/2011	CN101013686B 互连衬底、半导体器件及其制造方法 Interconnect substrate, a semiconductor device and manufacturing method thereof
11/29/2011	US8067699 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
11/29/2011	US8066891 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
11/29/2011	US8065797 Fabricating method for printed circuit board
11/29/2011	US8065794 Printed wiring board and its manufacturing method
11/29/2011	US8065793 Method of encapsulating an electronic component
11/29/2011	US8065792 Method for packaging circuits
11/29/2011	CA2504351C Enzyme print humidification in a continuous process for manufacture of electrochemical sensors
11/29/2011	CA2462252C Electronic circuit comprising conductive bridges and method for making such bridges

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