Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2012
02/22/2012CN1791311B 制造电路基板的方法和制造电子部件封装结构的方法 The method of manufacturing a circuit board and a method of manufacturing an electronic component package structure
02/22/2012CN1747630B 基板制造方法和电路板 And a circuit board substrate manufacturing method
02/22/2012CN102362560A Printed circuit board via drilling stage assembly
02/22/2012CN102361757A Screen printing system and method for cleaning masks of screen printing system
02/22/2012CN102361720A Soldering apparatus
02/22/2012CN102361544A Circuit board surface mount technology (SMT)
02/22/2012CN102361543A Circuit board resistance welding processing method
02/22/2012CN102361542A Manufacturing process of printed circuit board with steps
02/22/2012CN102361541A Manufacturing process for printed circuit board (PCB) with half-holes
02/22/2012CN102361540A 电路板加工方法 Circuit board processing method
02/22/2012CN102361539A Method for manufacturing groove-type printed wiring board
02/22/2012CN102361538A Method for processing printed circuit two-level blind hole
02/22/2012CN102361537A Reinforced mounting jig and mounting method thereof
02/22/2012CN102361536A Rapid detection and restoration method for short-circuit fault of circuit board
02/22/2012CN102361535A Flexible circuit board with impending splicing fingers and manufacturing method for flexible circuit board
02/22/2012CN102361534A Multilayer printed wiring board
02/22/2012CN102361533A Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof
02/22/2012CN102361532A Multilayer printed circuit board and manufacturing process thereof
02/22/2012CN102360852A Heavy-current planar transformer
02/22/2012CN101925255B 埋设有电子元件的电路板及其制造方法 Embedded electronic component manufacturing method of a circuit board and
02/22/2012CN101841977B 软式印刷电路板电镀金引线断线刻蚀设计方法 Soft gold plated printed circuit board design method of etching the lead break
02/22/2012CN101835346B 一种印制电路板的电镀镍金工艺 One of a printed circuit board nickel plating process
02/22/2012CN101808468B 贴膜方法 Foil Method
02/22/2012CN101754579B 城堡式模块及终端设备 Castle-in module and terminal equipment
02/22/2012CN101697663B 线路板以及表面接合元件与线路板的组装方法 Components and method of assembling the circuit board and the circuit board engagement surface
02/22/2012CN101652021B 积层印刷电路板 Multilayer printed circuit boards
02/22/2012CN101606445B 印制线路板的制造方法 The method of manufacturing printed circuit boards
02/22/2012CN101585955B 一种树脂组合物及其制作的涂覆树脂铜箔以及使用该涂覆树脂铜箔制作的覆铜板 A resin composition and a resin-coated copper foil and a copper clad laminate manufactured using the resin-coated copper foil produced by
02/22/2012CN101341804B 电路基板的连接结构、电路基板的连接部及电子设备 A circuit board connection structure, the circuit board connecting portion and the electronic device
02/22/2012CN101296567B 连接器装置及其制造方法以及采用连接器装置的电池包 Connector device and its manufacturing method, and use of the battery pack connector device
02/22/2012CN101273494B 电连接构造 Electrical connection structure
02/22/2012CN101219741B 薄膜剥离器 Film stripper
02/22/2012CN101022699B 布线电路基板及其制造方法 Wired circuit board and manufacturing method thereof
02/21/2012US8121697 Biocompatible bonding method and electronics package suitable for implantation
02/21/2012US8120925 Circuit device
02/21/2012US8120189 Wiring terminal-connecting adhesive
02/21/2012US8120040 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
02/21/2012US8119920 Multilayer printed wiring board
02/21/2012US8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
02/21/2012US8119327 Hard, cold flowable, photosensitive photoresist coatings; consistant flexibility; strippability; shelf life; prepolymers comprised of such as methyl methacrylate, benzyl methacrylate and glycidyl methacrylate; photocuring with diacrylate monomer or oligimer
02/21/2012US8119304 Fuel cell with fuel passage layer having a wiring pattern
02/21/2012US8119206 Negative coefficient of thermal expansion particles
02/21/2012US8117745 Method of using a foldable card as a USB contact
02/21/2012US8117743 Methods for fabricating current-carrying structures using voltage switchable dielectric materials
02/21/2012US8117742 Fabrication method of semiconductor integrated circuit device
02/21/2012US8117741 Method for manufacturing a radiation imaging panel comprising imaging tiles
02/21/2012CA2656639C Ball grid array (bga) connection system and related method and ball socket
02/21/2012CA2563385C Soldering process
02/21/2012CA2516977C Method for high-frequency tuning an electrical device, and a printed circuit board therefor
02/21/2012CA2504307C Manufacture of electrochemical sensors by moveable flat screen printing
02/16/2012WO2012021120A1 Removing and segregating components from printed circuit boards
02/16/2012WO2012020818A1 Metal-clad laminated plate
02/16/2012WO2012020713A2 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
02/16/2012WO2012020677A1 Flexible circuit board for repeated bending use, and electronic device and cellular phone using same
02/16/2012WO2012019822A2 Electrical device
02/16/2012US20120040088 Systems and methods for applying a liquid coating material to a substrate
02/16/2012US20120039572 Electronic module having multiple flex circuit connectors
02/16/2012US20120039056 Component arrangement and method for production thereof
02/16/2012US20120039055 Device mounting structure and device mounting method
02/16/2012US20120039053 System and method for coupling a battery within an embedded system
02/16/2012US20120038969 Electronic paper display device and method for manufacturing the same
02/16/2012US20120037413 Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package
02/16/2012US20120037411 Packaging substrate having embedded passive component and fabrication method thereof
02/16/2012US20120037409 Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby
02/16/2012US20120037405 Flexible circuit board and method for manufacturing same
02/16/2012US20120036712 Method and apparatus for providing an alternative power source for a graphics card
02/16/2012US20120036711 Apparatus and method of mounting component
02/16/2012US20120036710 Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components
02/16/2012DE102010039204A1 Electrical contact used for assembling e.g. gear wheel in gear box for vehicle, has flexible foil and insertion pin that are press-fitted into insertion interface which is made of conductive plastic material
02/16/2012DE102010039146A1 Verfahren zum elektrisch leitenden Verbinden von Leiterbahnen in Leitungsträgern und System umfassend solche Leitungsträger Method for electrically conductive connection of interconnects in line carriers and system comprising such a line carrier
02/16/2012DE102010034143A1 Carrier for fastening electrical and electronic components i.e. power LEDs, has second metal film contacted at bottom of recess, where lateral dimension of recess is large than thickness of insulation layer
02/15/2012EP2418925A1 Flex film contacting
02/15/2012EP2418738A2 Terminal for connecting wires to printed circuit boards
02/15/2012EP2418735A1 Antenna
02/15/2012EP2417842A1 Conductor grid for electronic housings and manufacturing method
02/15/2012EP2417841A1 A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
02/15/2012EP2417285A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012EP2417284A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012EP2417283A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012EP2416840A1 Stitched components of an active implantable medical device
02/15/2012EP2305013B1 Electronic assembly and method for the production thereof
02/15/2012EP2104408B1 Multilayer circuit board and motor drive circuit board
02/15/2012EP2062467B1 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
02/15/2012EP1981046B1 Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same
02/15/2012CN202145707U 电路板热板烤箱 PCB hot plate oven
02/15/2012CN202145260U 菲林定位结构 Film positioning structure
02/15/2012CN202143986U 一种带有特氟龙密封片和碗型垫片的吹风马达装置 A Teflon seal plate and bowl gasket blower motor unit with
02/15/2012CN202143984U 一种四通道导轨支撑机构 A four-channel rail support mechanism
02/15/2012CN102356703A Circuit board and mother laminated body
02/15/2012CN102356702A Screen printing machine and screen printing method
02/15/2012CN102356701A Connecting structure, circuit device and electronic apparatus
02/15/2012CN102356510A High-frequency switch module
02/15/2012CN102356462A Method for manufacturing substrate for semiconductor element, and semiconductor device
02/15/2012CN102356181A Method for providing a conductive material structure on a carrier
02/15/2012CN102355997A Screen printing device and screen printing method
02/15/2012CN102355996A Screen printing device and screen printing method
02/15/2012CN102355802A Screen printer
02/15/2012CN102355801A Screen printer
02/15/2012CN102355800A Pin insulation method of electronic element and component
02/15/2012CN102355799A Width regulating device and surface mounting peripheral device