H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2011
12/21/2011	EP1761823B1 Method of forming plated product using negative photoresist composition
12/21/2011	EP1314169B1 Circuit board protection system and method
12/21/2011	EP1098368B1 Module component and method of manufacturing the same
12/21/2011	CN202085408U 一种pcb板防焊印刷用导气底板 One kind pcb board solder printing air guide plate
12/21/2011	CN202085407U 一种钎料扰流波峰发生器 A flux material spoiler crest generator
12/21/2011	CN202085406U 一种pcb板防焊显影过滤系统 One kind pcb board solder developing filtration systems
12/21/2011	CN202085405U 一种柔性线路板自动补强贴合机 A flexible circuit board reinforcement automatic laminating machine
12/21/2011	CN202081054U 一种胶条以及面板 One kind of strips and panels
12/21/2011	CN1738512B 立体电路模块和用其的叠层立体电路模块及其制造方法 With its three-dimensional circuit module and the laminate and method of manufacturing three-dimensional circuit module
12/21/2011	CN102293072A 线路板及其制造方法 Circuit board and its manufacturing method
12/21/2011	CN102293071A 线路板及其制造方法 Circuit board and its manufacturing method
12/21/2011	CN102293070A 生产多层印制电路板的方法、防粘材料以及多层印制电路板和该方法的用途 Use method for producing a multilayer printed circuit board, and a release material and a multilayer printed circuit board of the method
12/21/2011	CN102293069A 线路板及其制造方法 Circuit board and manufacturing method thereof
12/21/2011	CN102291974A 切边定位型焊接结构及防止引脚偏移的方法 Trimming positioning type of welded structures and methods to prevent the pin offset
12/21/2011	CN102291952A 多层pcb板的制备方法 Preparation of multilayer pcb board
12/21/2011	CN102291951A 柔性印刷电路板的阻抗控制方法及其结构 Impedance of the flexible printed circuit board and its structure control method
12/21/2011	CN102291950A 用于对准器件的多个层的系统和方法 System and method for aligning a plurality of layers of the device for
12/21/2011	CN102291949A 多层电路板制作方法 Multi-layer circuit board production methods
12/21/2011	CN102291948A 一种柔性线路板孔壁金属化的方法 A flexible circuit board hole wall metallization methods
12/21/2011	CN102291947A Pcb板上阶梯结构处通孔焊盘的制作方法以及pcb板 Pcb board stepped structure at the via pad production methods and pcb board
12/21/2011	CN102291946A 一种厚铜电路板的制作方法 A method of manufacturing a thick copper circuit board
12/21/2011	CN102291945A 一种通孔回流焊接的方法 A through hole reflow soldering methods
12/21/2011	CN102291944A Smt组贴电子元器件的方法 Smt group paste method of electronic components
12/21/2011	CN102291943A 印制电路板制作方法 Printed circuit board production methods
12/21/2011	CN102291942A 一种带孔导通的铝基电路板的制作方法 A method of manufacturing a circuit board conductive perforated aluminum
12/21/2011	CN102291941A Method for processing lines of thick copper plate
12/21/2011	CN102291940A 具阶梯槽的pcb板的制作方法 A ladder slot pcb board production method
12/21/2011	CN102291939A 柔性线路板与纤维板的连接方法 Connections flexible circuit board and fiberboard
12/21/2011	CN102291938A 带有金属微散热器的印刷电路板的制备方法 The method for preparing the metal microstructure with the printed circuit board heat sink
12/21/2011	CN102291937A 印刷电路板制程用物理性消泡装置 Printed circuit board manufacturing process with a physical anti-foaming device
12/21/2011	CN102291934A 电镀通孔、印刷电路板以及制造电镀通孔的方法 Plated through holes, and a method of manufacturing a printed circuit board plated through hole
12/21/2011	CN102291933A 布线基板及其制造方法 Wiring board and manufacturing method thereof
12/21/2011	CN102291932A 缺口定位型焊接结构及防止引脚偏移的方法 Notch positioning type of welded structures and methods to prevent the pin offset
12/21/2011	CN102291930A 一种电路板粘合结构及其制造方法 A circuit-board-bonded structure and manufacturing method
12/21/2011	CN102291928A 一种导热氮化铝绝缘金属基板及其制备方法 One kind of thermal conductivity aluminum nitride insulated metal substrate and its preparation method
12/21/2011	CN102291927A 一种led灯陶瓷基板和led灯 Ceramic substrates and one kind of led lights led lights
12/21/2011	CN102290750A 印刷电路板湿制程所用设备的电线防护管 PCB wet process equipment used in wire protection tube
12/21/2011	CN102286739A 一种印制线路板多层板内层的黑化剂及其制备方法和应用 Blackening its preparation method and application of multilayer printed circuit boards lining
12/21/2011	CN102284733A 一种pcb的锣板方法 Pcb board method of gong
12/21/2011	CN101945543B 一种厚铜导线断路修补方法及其修补结构 Of thick copper wire breakage and repair structural repair methods
12/21/2011	CN101922627B 金属基led单元组装灯板工艺及灯板装置 Metal base plate lamp led unit assembly process and the light board device
12/21/2011	CN101883471B 飞板式粘尘收板机 Sticky fly Plate Unloader
12/21/2011	CN101845659B Pcb电镀辅助夹具及与pcb板的组合 Pcb plated fixtures and auxiliary combination with pcb board
12/21/2011	CN101808465B 收板系统 Unloader system
12/21/2011	CN101795543B 金手指制作方法 Goldfinger production methods
12/21/2011	CN101743786B 穿过高密度互连hdi衬底材料上的电介质涂层形成固体盲孔的方法 Methods through the dielectric coating of high density interconnect hdi substrate material is formed on a solid blind hole
12/21/2011	CN101742826B 嵌入式线路板的线路的修补方法 Repair method of circuit board embedded
12/21/2011	CN101657072B 电路板制作方法 Circuit board production methods
12/21/2011	CN101621894B 电路板组装方法及电路板预制品 Method and circuit board assembly board preform
12/21/2011	CN101616546B 承料台 A reception desk
12/21/2011	CN101591488B 油墨及利用该油墨制作导电线路的方法 Ink and ink produced by the method of conductive lines
12/21/2011	CN101589654B 一种可表面安装的波导装置 A waveguide device can be surface mounted
12/21/2011	CN101543145B 电路板模块及制造方法 Circuit board module and manufacturing method
12/21/2011	CN101528010B 线路结构的制造方法 The method of manufacturing circuit structure
12/21/2011	CN101507057B 电路连接材料、使用其的电路部件的连接结构及其制造方法 Circuit-connecting material, using its connection structure and a manufacturing method of circuit components
12/21/2011	CN101437360B 柔性电路基板、柔性电路基板的制作方法及固定方法 The flexible circuit board, method of manufacturing the flexible circuit board and fixing method
12/21/2011	CN101431864B 带有隆起焊盘的电路布线板的制造方法 The method of manufacturing a wiring circuit board bump with
12/21/2011	CN101128087B 电路基板和半导体器件 The circuit board and the semiconductor device
12/20/2011	US8080181 Coextrusion ink chemistry for improved feature definition
12/20/2011	US8079140 Component mounting condition determining method
12/20/2011	CA2504311C Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors
12/20/2011	CA2461338C Low viscosity precursor compositions and methods for the deposition of conductive electronic features
12/20/2011	CA2460840C Thin electronic label and method for making same
12/16/2011	DE202011105817U1 Mehrlagige elektrische Leiterplatte Multi-layer electrical circuit board
12/15/2011	WO2011155975A2 Method and structure for directly connecting coaxial or micro coaxial cables to the interior side of pads of a printed circuit baord to improve signal integrity of an electrical circuit
12/15/2011	WO2011155615A1 Low-temperature-sinterable bonding material, and bonding method using the bonding material
12/15/2011	WO2011155521A1 Lead-free composite
12/15/2011	WO2011155229A1 Laser processing method, and method for manufacturing multilayer flexible printed wiring board using same
12/15/2011	WO2011155162A1 Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate
12/15/2011	WO2011155115A1 Connecting structure and manufacturing method thereof
12/15/2011	WO2011155055A1 Low-temperature-sintering bonding material and bonding method using the bonding material
12/15/2011	WO2011154478A1 Electronic card programmed with an external programming device
12/15/2011	WO2011154441A1 Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body, and radiation-emitting semiconductor component
12/15/2011	WO2011154062A1 Electric connection between a supporting element and an electric element, method for making an electric connection, supporting element and electric element
12/15/2011	WO2011110795A3 Screen printing head, method of screen printing and printing blade
12/15/2011	US20110307911 Circuit board, motor, disk drive apparatus and circuit board manufacturing method
12/15/2011	US20110304999 Interposer-on-Glass Package Structures
12/15/2011	US20110304810 Touch panel, display apparatus including the same, and method for manufacturing the same
12/15/2011	US20110304669 Method for providing a substrate with a printed pattern
12/15/2011	US20110304582 Touch sensing circuit and method for making the same
12/15/2011	US20110303644 Methods for Plating Plastic Articles
12/15/2011	US20110303636 Method of manufacturing mounting substrate
12/15/2011	US20110303454 Laminated circuit board and board producing method
12/15/2011	US20110303453 Laminated circuit board and board producing method
12/15/2011	US20110303451 Multilayer printed wiring board
12/15/2011	US20110303449 Packaging structure, printed circuit board assembly and fixing method
12/15/2011	US20110303445 Printed Circuit Board With Reduced Dielectric Loss
12/15/2011	US20110303444 Laminated circuit board, bonding sheet, laminated-circuit-board producing method, and bonding -sheet producing method
12/15/2011	US20110303443 Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit
12/15/2011	US20110303442 Substrate strip with wiring and method of manufacturing the same
12/15/2011	US20110303440 Hybrid heat-radiating substrate and method of manufacturing the same
12/15/2011	US20110302778 Compositions and methods for creating electronic circuitry
12/15/2011	US20110302777 Electronic Component Protection Device Panel
12/15/2011	US20110302776 Electronic-circuit assembling process and electronic-circuit assembling system
12/15/2011	US20110302775 Method for manufacturing printed circuit board
12/15/2011	DE10213648B4 Leistungshalbleitermodul The power semiconductor module
12/15/2011	DE102010030063A1 Assembly for electrical connection between e.g. motor and/or transmission control unit of motor car and conductors of three-pin flat cable carrier, has pad head and conductor, which are formed with thermoplastic material
12/15/2011	DE102010029867A1 Electronic component i.e. transmission control, for motor car gear box, has printed circuit board arranged between press-in pin and lead frame and providing freedom of movement with in printed circuit board
12/15/2011	DE102010016288B4 Elektronische Baueinheit und Weltraumfahrzeug damit Electronic assembly and spacecraft so that
12/15/2011	DE10111710B4 Befestigungsverfahren für elektrische Bauteile Attachment methods for electrical components

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