Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2011
12/08/2011US20110299024 Liquid crystal display device and method for manufacturing the same
12/08/2011US20110298750 Touch-sensitive device and fabrication method thereof and touch-sensitive display device
12/08/2011US20110298352 Led lamp and methods of manufacturing the same
12/08/2011US20110297832 Proximity Sensor
12/08/2011US20110297644 Method for manufacturing printed circuit board with cavity
12/08/2011US20110297643 Method of hydrophobizing and patterning frontside surface of integrated circuit
12/08/2011US20110297641 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
12/08/2011US20110297430 Wiring substrate and manufacturing method thereof
12/08/2011US20110297427 Printed circuit board and a method of manufacturing the same
12/08/2011US20110297426 Wiring substrate and manufacturing method thereof
12/08/2011US20110297425 Wiring substrate and manufacturing method thereof
12/08/2011US20110297424 Wiring board, electronic device package, and methods of production of the same
12/08/2011US20110297423 Printed circuit board and method of manufacturing the same
12/08/2011US20110296917 Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure
12/08/2011US20110296682 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
12/08/2011US20110296680 Vent blocking on vented ball grid arrays to provide a cleaner solution barrier
12/08/2011US20110296679 Wiring board and method of manufacturing wiring board
12/08/2011US20110296678 Method and structure for directly connecting coaxial or micro coaxial cables to the interior side of pads of a printed circuit board to improve signal integrity of an electrical circuit
12/08/2011US20110296671 Display Modules and Methods of Fixing Flexible Circuit Boards Therein
12/08/2011DE10220684B4 Verwendung eines Verfahrens zur Herstellung leitender Polymere mit hoher Metallisierungsfähigkeit zur Durchmetallisierung von kaschierten Basismaterialien zur Leiterplattenherstellung Use of a method for the preparation of conductive polymers with high Metallisierungsfähigkeit of plated through to laminated base materials for printed circuit board manufacture
12/08/2011DE102011075680A1 Verbindungsstruktur Connection structure
12/08/2011DE102010062706A1 Stepper motor for adjusting picture screen in slant position in vehicle, has electric motor and circuit board arranged in common housing, where board is electrically and positively coupled with electric motor via mechanical connector
12/08/2011DE102010022562A1 Elektrisches Leistungsmodul und Verfahren zum Verbinden eines elektrischen Leistungsmoduls mit einer Leiterplatte und einer Wärmesenke Electric power module and method for connecting an electrical power module having a circuit board and a heat sink
12/08/2011DE102006016090B4 Verfahren zum Herstellen mehrerer Lotdepots auf einem Substrat A method for fabricating a plurality of solder deposits on a substrate
12/07/2011EP2392694A1 Method for etching of copper and copper alloys
12/07/2011EP2392200A1 Printed circuit assembly
12/07/2011EP2392199A1 Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
12/07/2011EP2391506A1 Structures comprising high aspect ratio molecular structures and methods of fabrication
12/07/2011EP2283454B1 Printing process for integrating an rfid transponder into packages
12/07/2011EP1432526B1 Method and apparatus for detecting a liquid spray pattern
12/07/2011CN202068681U 数码相机电路基板表面贴装工具 Digital camera circuit board surface mount tool
12/07/2011CN202068680U 一种贴合治具 A bonded fixture
12/07/2011CN202068659U 用于翻盖/滑盖手机的分层fpc Fpc layered for flip / slider phone
12/07/2011CN202067777U 直立式基板湿制程浸泡装置 Vertical substrate soaked wet process equipment
12/07/2011CN202064023U 用于集成电路制造的电镀槽结构 Plating tank structure for integrated circuit manufacturing
12/07/2011CN1768559B 多层印刷电路板 Multilayer printed circuit board
12/07/2011CN1703136B 配线电路基板及配线电路基板的连接构造 Printed circuit board connection structure and the printed circuit board
12/07/2011CN1510788B 电连接器 The electrical connector
12/07/2011CN102273330A 网版印刷设备及方法 Screen printing equipment and methods
12/07/2011CN102273016A 连接器 Connector
12/07/2011CN102272677A 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板 The photocurable resin composition and the use of dry film and cured product thereof a printed circuit board
12/07/2011CN102272676A 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法 The photosensitive resin composition, and the use of the composition of the photosensitive element, resist pattern forming method and printed wiring board manufacturing method
12/07/2011CN102272200A 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 Aromatic polyester amide copolymer, a polymer film, a prepreg, a prepreg laminate, a metal foil laminated plate and a printed wiring board
12/07/2011CN102272195A 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 Aromatic polyester amide copolymer, a polymer film, a prepreg, a prepreg laminate, a metal foil laminated plate and a printed wiring board
12/07/2011CN102272186A (聚)碳酸酯多元醇和以该(聚)碳酸酯多元醇为原料而成的含羧基的聚氨酯 (Poly) carbonate to the polyol and the (poly) carbonate polyol as a raw material made of polyurethane containing a carboxyl group
12/07/2011CN102272185A 含羧基的聚氨酯 Carboxyl group-containing polyurethane
12/07/2011CN102272174A 电活性聚合物及含有电活性聚合物的制品 Electroactive polymers and electroactive polymer article comprising
12/07/2011CN102272094A 用于印刷电子部件的功能材料 Functional materials for printed electronics components
12/07/2011CN102271919A 焊料供应装置、印刷装置以及印刷方法 Solder supply apparatus, the printing apparatus and printing method
12/07/2011CN102271862A 印制电路板钻孔动力头 Printed circuit board drilling power head
12/07/2011CN102271858A 在聚合物层表面上开槽的方法和设备 In slotted upper surface of the polymer layer method and apparatus
12/07/2011CN102271488A 一种用于贴片机的轻型带式送料器 Lightweight belt for a placement machine feeder
12/07/2011CN102271471A 混合型高低密度多层电路板及其工艺 Hybrid and high-density multi-layer circuit board technology
12/07/2011CN102271470A 电子器件的制造方法及电子器件 Method of manufacturing electronic devices and electronic devices
12/07/2011CN102271469A 一种软硬结合板的加工方法 One kind of rigid-flex PCB processing methods
12/07/2011CN102271468A 贴片机的贴装结构 Mounting structure placement machine
12/07/2011CN102271467A 电能模块以及将其连接至印刷电路板和散热器的方法 Power modules and a method of connecting it to the printed circuit board and heat sink
12/07/2011CN102271466A 一种柔性印刷线路板的表面保护方法 A flexible printed circuit board surface protection method of
12/07/2011CN102271465A 一种带电插拔金手指pcb板的制作方法 A charged Goldfinger plug pcb board production method
12/07/2011CN102271464A 电路板品质的追踪方法 Board quality tracking method
12/07/2011CN102271463A 电路板制作方法 Circuit board production methods
12/07/2011CN102271462A 可辨识印刷电路板的制造方法 Identification can be a printed circuit board manufacturing method
12/07/2011CN102271461A 电路基板 Circuit board
12/07/2011CN102271459A 布线基板及其制造方法 Wiring board and manufacturing method thereof
12/07/2011CN102271458A 印制电路板、实现的方法及其去除电子元件的方法 Printed circuit boards, implemented method and the method to remove the electronic components
12/07/2011CN102271456A 一种导热陶瓷基印刷电路板及其制备方法 One kind of thermally conductive ceramic substrate printed circuit board and its preparation method
12/07/2011CN102270624A 配线基板及其制造方法 Wiring board and manufacturing method thereof
12/07/2011CN102269885A 柔性印刷电路到玻璃装配系统和方法 Flexible printed circuit to the glazing system and method
12/07/2011CN102266997A 新型发泡管 The new foam tube
12/07/2011CN102266996A 智能控制式锡炉 Intelligent controlled furnace
12/07/2011CN101917825B 光电组件与主印制电路板连接方法及连接器件 Optoelectronic components and the main printed circuit board connection method and connection devices
12/07/2011CN101843180B 多连片基板及其制造方法 Multi-contiguous substrate and manufacturing method
12/07/2011CN101785374B 陶瓷多层基板 Ceramic multilayer substrate
12/07/2011CN101677489B 电路板结构及其制造方法 Board structure and manufacturing method
12/07/2011CN101662881B 电路板及其制作方法 Board and its production method
12/07/2011CN101647326B 多层印刷线路板 Multilayer printed circuit boards
12/07/2011CN101646307B 一种fpc制作方法及fpc One kind of production methods and fpc fpc
12/07/2011CN101588676B 利用感光性干膜实现选择性塞孔的印刷电路板制法 Using a photosensitive dry film to achieve selective plug hole printed circuit board prepared by
12/07/2011CN101572996B 绝缘导热金属基板上真空溅镀形成导电线路的方法 Thermally conductive metal on the insulating substrate, vacuum sputtering method for forming a conductive circuit
12/07/2011CN101563181B 选择性焊接的装置和方法 Selective soldering apparatus and method
12/07/2011CN101562953B 多层基板及其制造方法 Multi-layer substrate and manufacturing method thereof
12/07/2011CN101516624B 用于夹紧衬底的方法和装置 Method and apparatus for clamping a substrate
12/07/2011CN101472404B 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
12/07/2011CN101461293B 电路载体及其制造方法 Circuit carrier and its manufacturing method
12/07/2011CN101374391B 多层布线基板 A multilayer wiring board
12/07/2011CN101193499B 图案形成方法、液滴喷出装置及电路基板 Pattern forming method, droplet ejection apparatus and the circuit board
12/07/2011CN101141023B 微机电层叠式毫米波天线 MEMS stacked millimeter wave antenna
12/07/2011CN101049057B 多层印刷电路板及多层印刷电路板的制造方法 Manufacturing a multilayer printed circuit boards and multi-layer printed circuit board
12/06/2011US8073295 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly
12/06/2011US8072765 Electro-optical apparatus, flexible printed circuit board, manufacturing method for electro-optical apparatus, and electronic equipment
12/06/2011US8071271 Conductive film and method for producing the same
12/06/2011US8071168 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
12/06/2011US8071160 Surface coating process
12/06/2011US8070932 Insulating layer within circuit board has non-circuit area free of circuit layout; openings are formed therein; patterned circuit layer is formed on insulating layer; metal identifiable information is disposed in openings; product status of board can be traced, identified via metal patterned information
12/06/2011US8069783 Printing screens, frames therefor and printing screen units
12/06/2011US8069560 Method of manufacturing multilayer wiring board
12/06/2011US8069559 Method of assembling an insulated metal substrate
12/06/2011US8069558 Method for manufacturing substrate having built-in components
12/06/2011US8069557 Method of manufacturing circuit forming board
12/06/2011CA2594884C Imaging apparatus for fully automatic screen printer