Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2011
11/17/2011US20110279991 Solderability enhancement by silver immersion printed circuit board manufacture
11/17/2011US20110279989 Preparation of moulded body with electric circuit
11/17/2011US20110279988 Motherboard with connector for extender
11/17/2011US20110279405 Conductive structure and method of manufacturing the same
11/17/2011US20110279401 One-layer capacitive touch screen and method of manufacturing the same
11/17/2011US20110279387 Transperent Conductive Substrate and Method of Manufacturing the same Touch Screen Using the Same
11/17/2011US20110279220 PTC Device
11/17/2011US20110278056 Manufacturing method of printed circuit board unit, manufacturing apparatus thereof, manufacturing method of electronic component, and electronic component
11/17/2011US20110278054 Circuit board with notched conductor pads
11/17/2011US20110278050 Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
11/17/2011US20110278046 Temperature tolerant cover layer construction
11/17/2011US20110277323 Method for Forming a Circuit Board Via Structure for High Speed Signaling
11/17/2011US20110277321 Method of manufacturing printed circuit board
11/17/2011US20110277320 Method of manufacturing a PCB having an embedded bare chip
11/17/2011US20110277319 Liquid ejection head and image forming apparauts including liquid ejection head
11/16/2011EP2386790A2 Light emitting device module
11/16/2011EP2386193A1 Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element
11/16/2011EP2385910A1 Headliner with integral wire harness
11/16/2011EP2385886A1 Method and apparatus for reflow soldering
11/16/2011EP1571894B1 Holding/convey jig and holding/convey method
11/16/2011EP1494271B1 Method for dicing substrate
11/16/2011CN202043385U Modified LED welding structure
11/16/2011CN202043384U Insertion head of full automatic terminal insertion machine
11/16/2011CN202043383U Film sticking device
11/16/2011CN202043382U Soft board reinforcement supporting device
11/16/2011CN202039144U Improved electroplating line for circuit boards
11/16/2011CN202037628U Printed circuit board cutting device
11/16/2011CN202037407U Improved horizontal adjusting device for hot-pressing mechanism
11/16/2011CN1751547B Multilayer board and its manufacturing method
11/16/2011CN1741706B 布线板 Wiring board
11/16/2011CN1739969B Droplet discharge apparatus
11/16/2011CN102246608A Wiring board and method for manufacturing same
11/16/2011CN102246607A Electrode connection structure, conductive adhesive used therefor, and electronic device
11/16/2011CN102246606A Flexible modular assembly
11/16/2011CN102246605A Circuit module and method for managing same
11/16/2011CN102244990A Cushion plate for hole plugging of printed circuit board and application method thereof
11/16/2011CN102244989A Printed circuit board (PCB) with built-in antenna with radio frequency identification tag and manufacturing method thereof
11/16/2011CN102244988A Manufacturing process of PCB (Printed Circuit Board)
11/16/2011CN102244987A Method for resin plugging of holes of back plate with high thickness-to-diameter ratio
11/16/2011CN102244986A Hole plugging device and hole plugging method of circuit board
11/16/2011CN102244985A Processing method of surface-mounted pads on thick copper circuit board
11/16/2011CN102244984A Bubble remover
11/16/2011CN102244983A Bubble remover
11/16/2011CN102244982A Method for controlling warp of local high-frequency mixed-laminated circuit board
11/16/2011CN102244981A Novel printed circuit board (PCB) manufacturing technology
11/16/2011CN102244980A Manufacturing method of metal substrate
11/16/2011CN102244979A Half-hole processing mirror image manufacturing method of printed circuit board
11/16/2011CN102244975A Printed wiring board and device including printed wiring board
11/16/2011CN102244974A Hollowed-out FPCB (flexible printed circuit board) and manufacturing method thereof
11/16/2011CN102244973A Printed circuit board with blind hole structure and manufacturing method thereof
11/16/2011CN102244042A Adhesive composition, circuit connecting material and connecting structure of circuit member
11/16/2011CN101823151B Waterborne through-hole silver paste and preparation method and application thereof
11/16/2011CN101767079B Plate loading machine, circuit board production system and method for manufacturing base plate
11/16/2011CN101715274B Circuit board and process thereof
11/16/2011CN101702870B Interconnection method of flexible board and rigid board and system
11/16/2011CN101686609B Circuit board
11/16/2011CN101668380B Flexible printed circuit board structure
11/16/2011CN101663925B 电子电路装置 Electronic circuit means
11/16/2011CN101646305B Method for manufacturing lead on non-conductor substrate
11/16/2011CN101636036B Flexible circuit board as well as hot-pressed device and method for manufacturing same
11/16/2011CN101610642B Cutting method of copper-clad substrate
11/16/2011CN101578696B Dynamic pad size to reduce solder fatigue
11/16/2011CN101542021B Deposition of conductive polymer and metallization of non-conductive substrates
11/16/2011CN101534609B Circuit structure of circuit board and method for manufacture same
11/16/2011CN101520559B Display panel having noise shielding structure
11/16/2011CN101518165B Conductor carrier and arrangement comprising a conductor carrier
11/16/2011CN101489353B Design method for board dimension
11/16/2011CN101466207B Circuit board and preparation method thereof
11/16/2011CN101442901B Method for composing multilayer printed circuit board
11/16/2011CN101409979B Circuit board and processing method thereof
11/16/2011CN101384133B Contraposition method
11/16/2011CN101278239B Process for producing substrate with metal wiring
11/16/2011CN101217851B Printed circuit board and liquid crystal display having the same
11/16/2011CN101160027B Method of producing circuit board and compound circuit substrates with through-hole plating structure
11/16/2011CN101156236B 倒装片安装方法及凸块形成方法 Flip-chip mounting method and a bump forming method
11/16/2011CN101124860B Reflow device and reflow method
11/16/2011CN101064294B Circuit device and method for manufacturing circuit device
11/15/2011US8059420 Surface mountable device
11/15/2011US8058566 Packaging substrate structure and manufacturing method thereof
11/15/2011US8058565 Wiring board, semiconductor device, and method for manufacturing wiring board
11/15/2011US8058152 Method for manufacturing integrated circuit
11/15/2011US8056223 Method of producing a suspension board with circuit
11/15/2011US8056222 Laser-based technique for the transfer and embedding of electronic components and devices
11/15/2011US8056221 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/15/2011US8056220 Printed circuit board and manufacturing method thereof
11/15/2011CA2712949C A radio frequency circuit board topology
11/10/2011WO2011139882A2 Method of fabricating micro structured surfaces with electrically conductive patterns
11/10/2011WO2011138949A1 Substrate on which element is to be mounted, and process for production thereof
11/10/2011WO2011138940A1 Electronic device, cable connection structure, and process for production of electronic device
11/10/2011WO2011138921A1 Structure for mounting electronic circuit configuration component
11/10/2011WO2011138876A1 Copper foil for printed circuit
11/10/2011WO2011138621A1 Composite electrode and method of manufacture thereof
11/10/2011WO2011138232A1 Method for producing a flexible circuit configuration
11/10/2011WO2011137897A2 Method for introducing electrical insulations in printed circuit boards
11/10/2011WO2011137896A1 Method for partially stripping a defined area of a conductive layer
11/10/2011WO2011108358A3 Dispenser for highly viscous fluid
11/10/2011WO2011087319A3 Light-emitting device
11/10/2011WO2011065788A3 Printed circuit board and method of manufacturing the same
11/10/2011US20110275246 Electrical connector with printed circuit board subassembly
11/10/2011US20110274830 Method for producing a flexible circuit configuration