Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2012
02/01/2012EP2411194A1 A method of generating a hole or recess or well in a substrate, a device for carrying out the method, and a high frequency high voltage source for use in such a device
02/01/2012EP1457101B1 Method for making a multilayer module with high-density printed circuits
02/01/2012CN202135410U 清除柔性线路板上异物的装置 Clear flexible circuit board means foreign matter
02/01/2012CN202135409U 一种贴胶机头及应用其的贴胶纸装置 One kind of gum paste and apply its head affixed adhesive tape device
02/01/2012CN202135408U 一种pcb生产过程中摘除湿模板胶粒的装置 Wet template particles an apparatus pcb removed in the production process
02/01/2012CN202135400U 线路板电金用蓝胶 Gold circuit board with blue plastic
02/01/2012CN202131387U 一种pcb沉铜生产线上沉铜专用架 One kind pcb Shen Shen copper copper production line dedicated shelf
02/01/2012CN1960602B 自动检测、修补及自动标记印刷电路板的装置及方法 Apparatus and method for automatic detection, and automatic repair marks printed circuit board
02/01/2012CN102342189A Chip component mounting structure, chip component mounting method and liquid crystal display device
02/01/2012CN102342188A Multilayer film for electronic circuitry applications and methods relating thereto
02/01/2012CN102342187A Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
02/01/2012CN102341997A 线圈装置 Coil device
02/01/2012CN102341867A Method and apparatus for manufacturing mosaic tape for use in communication cable
02/01/2012CN102341753A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
02/01/2012CN102341236A Film with attached metal layer for electronic components, production method thereof, and applications thereof
02/01/2012CN102340982A Error proofing detection device and method
02/01/2012CN102340938A Circuit board manufacturing method
02/01/2012CN102340937A Manufacturing method of flexible multi-layer circuit board
02/01/2012CN102340936A Mobile phone plate welding fixture
02/01/2012CN102340935A Circuit board and method and system for manufacturing circuit board bumps
02/01/2012CN102340934A PCB electronic assembly technology free of metal solder
02/01/2012CN102340933A Manufacturing method of circuit board
02/01/2012CN102340932A Method of using reproduced glue film and parallel arranged flat wire to make single-sided circuit board
02/01/2012CN102340931A Method for making single-sided circuit board with flat wires arranged side by side
02/01/2012CN102340930A Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film
02/01/2012CN102340929A Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires
02/01/2012CN102340928A Single-sided circuit board made by arranging flat wires side by side and making method thereof
02/01/2012CN102340927A Printed circuit board
02/01/2012CN102340559A Combined circuit board of mobile terminal and assembly method
02/01/2012CN102335790A Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table
02/01/2012CN101969745B 柔性线路板后工序的制作方法 After the flexible circuit board production method step
02/01/2012CN101938883B 一种单面双接触柔性线路板的制作方法 A single-sided double-contact method of making flexible circuit board
02/01/2012CN101868118B 高频线路基板及其制作方法 High frequency circuit substrate and manufacturing method thereof
02/01/2012CN101801667B 丝网印刷设备 Screen Printing Equipment
02/01/2012CN101728672B 电路板模组及其连接接口 Circuit board module and its connection interface
02/01/2012CN101690432B 连接材料的强制导引 Connecting material forced guide
02/01/2012CN101637070B 带基材绝缘片、多层印刷布线板、半导体装置和多层印刷布线板的制造方法 The method of manufacturing a substrate with an insulating film, the multilayer printed wiring board, a semiconductor device and the multilayer printed wiring board
02/01/2012CN101359188B 带状工件的曝光装置及带状工件的曝光装置的聚焦调整方法 The focus adjustment method for the belt-like work of the exposure apparatus and exposure apparatus
02/01/2012CN101347056B 印刷线路板的制造方法 The method of manufacturing a printed wiring board
02/01/2012CN101303981B 具有内置部件的布线板及其用于制造该布线板的方法 A wiring board having a built-in component and a method for manufacturing the wiring board
02/01/2012CN101213890B 多层布线基板及其制造方法 A multilayer wiring board and its manufacturing method
02/01/2012CN101203384B 丝网印刷机以及太阳能电池 Screen printing machine and a solar cell
02/01/2012CN101188930B 电子部件安装装置中的粘性导电材料的供给及回收装置 The supply and recovery of electronic component mounting apparatus of the viscous electrically conductive material
02/01/2012CN101066005B 多层布线基板及其制造方法 The multilayer wiring board and its manufacturing method
01/2012
01/31/2012US8108163 Power supply noise analysis method, apparatus and program for electronic circuit board
01/31/2012US8107254 Integrating capacitors into vias of printed circuit boards
01/31/2012US8107253 Printed circuit board
01/31/2012US8106516 Wafer-level chip scale package
01/31/2012US8106310 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
01/31/2012US8105759 Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition
01/31/2012US8104863 Method for the printing of homogeneous electronic material with a multi-ejector print head
01/31/2012US8104170 Charge plate fabrication technique
01/26/2012WO2012012610A2 Reduction of stray light during sintering
01/26/2012WO2012011916A1 Double-folded flexible printed circuit board for slider devices
01/26/2012WO2012011491A1 Conductive film
01/26/2012WO2012011230A1 Method for filling through hole of substrate with metal and substrate
01/26/2012WO2012011165A1 Multilayer printed circuit board and manufacturing method therefor
01/26/2012WO2012010874A1 Antenna
01/26/2012WO2012010469A1 Electronic assembly having a component enclosed by a potting compound, and method for producing same
01/26/2012WO2012009842A1 Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring
01/26/2012WO2012009841A1 Single-sided circuit board made by bonding juxtaposition flat wiring with thermosetting glue film
01/26/2012WO2012009840A1 Single-side circuit board with flat wires arranged in parallel and method for making the same
01/26/2012WO2012009839A1 Single-sided circuit board and manufacturing method thereof
01/26/2012WO2012009838A1 Method for fabricating single-sided circuit board using apposition wires
01/26/2012WO2012009831A1 Wiring board and manufacturing method thereof
01/26/2012US20120021621 Method for manufacturing multilayered flexible circuit board
01/26/2012US20120020151 Storage apparatus and method of manufacturing the same
01/26/2012US20120020093 Light unit for led lamp and method for the same
01/26/2012US20120020087 Light emitting diode lamp and method for manufacturing the same
01/26/2012US20120020042 Noise suppressor for semiconductor packages
01/26/2012US20120020039 Surface-mounted shielded multicomponent assembly
01/26/2012US20120020038 Electronic apparatus and method related thereto
01/26/2012US20120020027 Tiered Integrated Circuit Assembly and a Method for Manufacturing the Same
01/26/2012US20120020022 Printed circuit board cooling assembly
01/26/2012US20120019751 Pixel Structure of Transflective Liquid Crystal Display Array Substrate and Method for Fabricating the Same
01/26/2012US20120018521 Object carrier having a data memory
01/26/2012US20120018411 Apparatus for spatial and temporal control of temperature on a substrate
01/26/2012US20120018207 Circuit substrate and fabricating process of circuit substrate
01/26/2012US20120018201 Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
01/26/2012US20120018200 Transparent conductive film for touch panel and method for manufacturing the same
01/26/2012US20120018198 Electronic component and printed wiring board
01/26/2012US20120018194 Multilayer wiring board and manufacturing method thereof
01/26/2012US20120017437 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
01/26/2012US20120017436 Selective encapsulation of electronic components
01/26/2012US20120017435 Method of manufacturing PCB having electronic components embedded therein
01/26/2012US20120017434 Method and apparatus for manufacturing electronic paper
01/26/2012DE112010001165T5 Siebdruckmaschine und Siebdruckverfahren Screen printing machine, screen printing method
01/26/2012DE112009001736T5 Verfahren zum Herstellen eines komponenteneingebetteten Moduls A method for manufacturing a component-embedded module
01/26/2012DE10357789B4 Leistungs-Halbleitervorrichtung Power semiconductor device
01/26/2012DE102010032301A1 Calibration standard unit for testing system for testing insertion processes of contact pin in recess of printed circuit board, has testing recess whose form corresponds to form of undeformed contact pin in sections
01/26/2012DE102005004845B4 Wafer-Unterteilungsverfahren Wafer dividing method
01/25/2012EP2410827A1 Circuit board and mother laminated body
01/25/2012EP2410826A1 Flexible printed circuit board with waterproof structure
01/25/2012EP2410824A2 Porous film and layered product including porous film
01/25/2012EP2408836A2 Liquid coverlays for flexible printed circuit boards
01/25/2012EP2255602B1 Imaging system and method for alignment
01/25/2012EP2082630B1 Slurry discharge device
01/25/2012EP1933995B1 Forming tool
01/25/2012EP1520454B1 Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
01/25/2012CN202127553U Air pressure actuating module with micro-control function