Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2012
03/21/2012CN102388686A Electronic component mounting system and electronic component mounting method
03/21/2012CN102388683A Method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
03/21/2012CN102388421A Low temperature fireable paste composition for forming an electrode or wiring
03/21/2012CN102387903A Plastic articles, optionally with partial metal coating
03/21/2012CN102387673A Processing method of multilayer circuit board
03/21/2012CN102387672A Method for manufacturing multilayer circuit board
03/21/2012CN102387671A Manufacturing method for single face windowing hole plugging of tin spayed plate
03/21/2012CN102387670A Solder pallet fixture
03/21/2012CN102387669A Three-dimensional circuit component and manufacture method thereof
03/21/2012CN102387668A Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges
03/21/2012CN102387667A Processing technology of blind drilled counterbore on high-density interlinked printed circuit board
03/21/2012CN102387666A Wired circuit board and producing method thereof
03/21/2012CN102387665A Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet
03/21/2012CN102387664A Circuit board printing method
03/21/2012CN102387663A Electronic component and method of manufacturing the same
03/21/2012CN102387662A Rigid-flexibility circuit board and manufacturing method thereof
03/21/2012CN102387661A Circuit board substrate and manufacture method thereof
03/21/2012CN102387660A Metal base PCB (Printed Circuit Board) and production method thereof
03/21/2012CN102387659A Printed circuit board and production method thereof
03/21/2012CN102386490A Electrical connection device
03/21/2012CN102385253A Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
03/21/2012CN102385244A Black curable resin composition
03/21/2012CN102382613A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
03/21/2012CN102382594A Application of adhesive compond
03/21/2012CN102382581A An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
03/21/2012CN102382580A An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
03/21/2012CN102380684A Method and device for indicating presence of board in reflow oven
03/21/2012CN101883473B Double-faced electricity conductive composite board and manufacture method thereof
03/21/2012CN101808479B Technique for reducing the number of layers in multilayer circuit board
03/21/2012CN101789383B Method for making packaging substrate with recess structure
03/21/2012CN101778542B Manufacturing method of PCB plate with copper pillar
03/21/2012CN101772255B Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same
03/21/2012CN101754583B Method and device for eliminating pool effect
03/21/2012CN101711099B Method for preparing multilayer printed circuit board
03/21/2012CN101652034B Printed circuit board (PCB) and manufacturing method thereof and device for solving reflux of radio-frequency power amplifier
03/21/2012CN101643145B Substrate conveying system
03/21/2012CN101626663B Method for preparing second-order laser blind hole by UV, acid etching and CO2
03/21/2012CN101611066B Improved epoxy compositions
03/21/2012CN101610645B Method for manufacturing flexible-rigid plate
03/21/2012CN101600295B Anisotropic conducting film and circuit board using same
03/21/2012CN101572999B Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way
03/21/2012CN101543147B Wiring board and display unit
03/21/2012CN101460011B Circuit board manufacturing method
03/21/2012CN101431868B Production method of winding integrated multi-layer PCB
03/21/2012CN101427427B Method of providing consistent quality of target material removal by lasers having different output performance characteristics
03/21/2012CN101385402B Circuit board and process for producing the same
03/21/2012CN101286456B Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
03/21/2012CN101207977B Method for making flexible circuit board with break difference structure
03/21/2012CN101170231B Board-mounted type connector to which a shield plate is attached
03/21/2012CN101084470B Material for pattern formation, apparatus for pattern formation, and method for pattern formation
03/20/2012US8138268 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
03/20/2012US8136238 Methods for manufacturing semiconductor devices
03/20/2012US8136237 Method of interconnecting electronic wafers
03/20/2012US8136232 Assembly fixture
03/20/2012US8136223 Apparatus for forming a wireless communication device
03/15/2012WO2012033152A1 Method for producing multilayer wiring substrate
03/15/2012WO2012032925A1 Led wiring board and light irradiation apparatus
03/15/2012WO2012032905A1 Composition for use in forming layer to be plated, method for manufacturing metal pattern material, and novel polymer
03/15/2012WO2012032903A1 Film exposure device
03/15/2012WO2012032840A1 Method for surface mounting electronic component, and substrate having electronic component mounted thereon
03/15/2012WO2012032654A1 Substrate with built-in components
03/15/2012WO2012032062A1 Printed circuit board for population with luminous bodies
03/15/2012WO2012031704A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module
03/15/2012WO2012031703A1 Coating method for an optoelectronic chip-on-board module
03/15/2012WO2012031522A1 Method for manufacturing thick copper foil pcb
03/15/2012WO2012031517A1 Design method of multilayer printed circuit board and multilayer printed circuit board
03/15/2012WO2011161514A3 Pick and bond method for attachment of adhesive element to substrate
03/15/2012WO2011154184A3 Method and device for contacting a semiconductor substrate by means of a jet printing method
03/15/2012WO2011101172A3 Light source having led arrays for direct operation in an alternating current network and production method therefor
03/15/2012US20120064567 Active micro sieve and methods for biological applications
03/15/2012US20120064231 Method for manufacturing printed circuit board including flame retardant insulation layer
03/15/2012US20120063787 Connector and optical transmission apparatus
03/15/2012US20120063785 Connector, optical transmission device, and connector connection method
03/15/2012US20120063715 Manufacturing method for electrooptic element and optical deflector including electrooptic element
03/15/2012US20120063109 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
03/15/2012US20120063107 Semiconductor component and method of manufacture
03/15/2012US20120063094 Thermal interface material application for integrated circuit cooling
03/15/2012US20120062708 Imaging, Fabrication and Measurement Systems and Methods
03/15/2012US20120062507 Capacitive touch screen and manufacturing method thereof
03/15/2012US20120062480 Capacitive touch sensor and method for manufacturing the same
03/15/2012US20120062346 Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
03/15/2012US20120062330 Radio frequency integrated circuit for enhanced transmit/receive performance in low power applications and method of making the same
03/15/2012US20120062213 Microprobe, recording apparatus, and method of manufacturing microprobe
03/15/2012US20120061716 Manufacturing method for power led head-dissipating substrate and power led product and the products thereof
03/15/2012US20120061626 Paste composition used for forming an electrode or wiring which is curable at a low temperature
03/15/2012US20120061347 Printed wiring board and method for manufacturing printed wiring board
03/15/2012US20120061140 Connection structure and a connection method for connecting a differential signal transmission cable to a circuit board
03/15/2012US20120061130 Conductive substrate
03/15/2012US20120061127 Electrical component assembly for thermal transfer
03/15/2012US20120060368 Method of fabricating circuit board structure
03/15/2012US20120060367 Flex-rigid wiring board and method for manufacturing the same
03/15/2012US20120060366 Method for determining wiring pathway of wiring board and method for determining wiring pathway of semiconductor device
03/15/2012US20120060365 Method of manufacturing a printed circuit board having metal bumps
03/15/2012DE102010045035A1 Verkapselung und Herstellen einer verkapselten bestückten Leiterplatte Encapsulation and producing an encapsulated printed board assembly
03/15/2012DE10161230B4 Einbaueinheit für eine Getriebesteuerung eines Kraftfahrzeuges Mounting unit for a transmission controller of a motor vehicle
03/14/2012EP2429270A1 Multilayer circuit board and production method thereof and communication device
03/14/2012EP2429269A1 Circuit connection material, circuit member connecting structure and method of connecting circuit member
03/14/2012EP2428971A1 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
03/14/2012EP2428557A1 Cleaning solution
03/14/2012EP2428105A1 Method and apparatus for improving power and loss for interconect configurations