| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/28/2011 | CN102301842A 印刷电路组件 Printed circuit assembly |
| 12/28/2011 | CN102301841A 喷流焊料槽 Wave soldering tank |
| 12/28/2011 | CN102301840A 自动锡焊装置及输送装置 Automatic soldering equipment and transport equipment |
| 12/28/2011 | CN102301839A 喷流焊料槽 Wave soldering tank |
| 12/28/2011 | CN102301838A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit |
| 12/28/2011 | CN102301837A 一种多层电路板及其制造方法 A multilayer wiring board and its manufacturing method |
| 12/28/2011 | CN102301836A 产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 Printing or coating a functional element produced by the method of the substrate, the substrate, functional devices and use thereof |
| 12/28/2011 | CN102301249A 电子电路、电子装置 An electronic circuit, the electronic device |
| 12/28/2011 | CN102301225A 通孔检查装置 Vias inspection device |
| 12/28/2011 | CN102300720A 网板印刷用网状部件 Screen printing with a mesh member |
| 12/28/2011 | CN102300712A 丝网印刷设备和丝网印刷方法 Screen printing equipment and screen printing method |
| 12/28/2011 | CN102300706A 包括高长宽比分子结构的结构和制造方法 Including the structure and manufacturing method of the molecular structure of high aspect ratio |
| 12/28/2011 | CN102300449A 印刷电路板固定装置 Printed circuit board fixing means |
| 12/28/2011 | CN102300420A 一种制作含导电孔的pcb方法 A method of containing a conductive hole pcb production |
| 12/28/2011 | CN102300419A Welding method of coaxial diode and circuit board |
| 12/28/2011 | CN102300418A 嵌入元件式pcb的制作方法 Embed pcb production methods element of style |
| 12/28/2011 | CN102300417A 电子元件埋入式电路板及其制造方法 Electronic components embedded circuit board and manufacturing method thereof |
| 12/28/2011 | CN102300416A 去污防折皱擦拭金手指治具 Anti-wrinkle decontamination wipe Goldfinger fixture |
| 12/28/2011 | CN102300415A 一种导电性均匀的印制电子用银导线的制备方法 Method for preparing homogeneous conductive electronic printed with silver wire |
| 12/28/2011 | CN102300414A 一种印制电路的加成制备方法 Addition method for preparing a printed circuit |
| 12/28/2011 | CN102300413A 具有识别码的电路板的制作方法 The method of making a circuit board having an identification code of the |
| 12/28/2011 | CN102300412A Pcb背钻加工方法 Pcb back-drilling and processing methods |
| 12/28/2011 | CN102300411A 感应磁环板钻孔制作工艺 Induced magnetic board drilling production process |
| 12/28/2011 | CN102300410A 通信设备及其电路板的制造方法 The method of manufacturing a circuit board of the communication device and |
| 12/28/2011 | CN102300409A 挠性电路板基材与补强材料间粘合的方法及制出的产品 Method between the substrate and the flexible circuit board reinforcement material bonded and manufacturing the products |
| 12/28/2011 | CN102300408A 承载pcb拼板用的托盘 Carrying a tray with pcb puzzle |
| 12/28/2011 | CN102300407A 背胶无气泡贴合治具 No bubble gum bonding fixture |
| 12/28/2011 | CN102300406A 埋入式电路板及其制作方法 Embedded board and its production method |
| 12/28/2011 | CN102300405A 埋入式电路板及其制作方法 Embedded board and its production method |
| 12/28/2011 | CN102300403A 一种pcb连接结构和连接方法 One kind pcb connection structure and connection method |
| 12/28/2011 | CN102300401A 实现多信号传输的通孔结构及其制造方法 Via structure and manufacturing method of the multi-signal transmission |
| 12/28/2011 | CN102300399A 一种多功能叠层电子膜及其制作方法 A multifunctional electronic laminated film and its production method |
| 12/28/2011 | CN102300398A 两层印制电路板及其印刷方法、移动通信终端 Two-layer printed circuit boards and printing method, a mobile communication terminal |
| 12/28/2011 | CN102300397A Metal matrix circuit board and manufacturing method thereof |
| 12/28/2011 | CN102300396A 配线基板 Wiring board |
| 12/28/2011 | CN102299081A 一种封装基板制造方法及封装基板 A package board manufacturing method and package substrate |
| 12/28/2011 | CN102298262A 一种热固化感光树脂组合物 A heat-curing the photosensitive resin composition |
| 12/28/2011 | CN102298223A 一种柔性印刷线路板压贴不良的回收方法 A flexible printed circuit board pressed against the poor recovery methods |
| 12/28/2011 | CN102296488A 一种低翘曲纸基层压线路板原纸生产方法及纸基层压线路板原纸 A low voltage circuit board warpage paper-paper production methods and paper-based laminated paper board |
| 12/28/2011 | CN102295894A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN102295893A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN102295892A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN102294333A Pcb板表面除尘及静电消除设备 Pcb board surface dust and static elimination equipment |
| 12/28/2011 | CN102012607B 对柔性线路板成像的装置 The flexible circuit board imaging device |
| 12/28/2011 | CN101965105B 一种印刷电路板压合制程工艺 A printed circuit board lamination process technology |
| 12/28/2011 | CN101951732B 一种pcb电镀装置 One kind pcb plating apparatus |
| 12/28/2011 | CN101868123B 印刷电路板及设计方法 Printed circuit boards and design methods |
| 12/28/2011 | CN101785103B 低阻抗晶圆穿孔 Low impedance wafer perforation |
| 12/28/2011 | CN101742823B 电路板承载装置及其应用方法 Device and application methods board bearing |
| 12/28/2011 | CN101730394B 一种在线路板上插装插接件的工艺方法 A process for the circuit board plug connectors are |
| 12/28/2011 | CN101695224B 多层印刷电路板的加工方法 A multilayer printed circuit board processing method |
| 12/28/2011 | CN101683007B 层压配线基板及其制造方法 A laminated wiring board and manufacturing method thereof |
| 12/28/2011 | CN101677493B 线路板与线路结构的制作方法 Circuit board manufacturing method and circuit structure |
| 12/28/2011 | CN101674705B 柔性布线基板及制法、配芯片的柔性布线基板及电子设备 Flexible wiring board and manufacturing method, the flexible wiring board with chips and electronic equipment |
| 12/28/2011 | CN101657069B 印刷电路板的表面处理方法及印刷电路板 A printed circuit board surface treatment method and printed circuit board |
| 12/28/2011 | CN101543149B 电路基板及其制造方法 Circuit board and manufacturing method thereof |
| 12/28/2011 | CN101438635B 向焊料槽供给无铅棒状焊料的方法及焊料槽 Lead-free solder bath is supplied to the rod-like solder and the solder bath method |
| 12/28/2011 | CN101419918B 制造印刷电路板的方法以及通过该方法制造的印刷电路板 The method of manufacturing a printed circuit board and by the method of manufacturing the printed circuit board |
| 12/28/2011 | CN101399246B 覆晶封装基板结构及其制法 Flip chip package substrate structure Jiqizhifa |
| 12/28/2011 | CN101232778B 印刷布线板 A printed circuit board |
| 12/27/2011 | US8086338 Component mounting apparatus, service providing device and servicing method |
| 12/27/2011 | US8085551 Electronic component and manufacturing the same |
| 12/27/2011 | US8084852 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 12/27/2011 | US8084083 Method for manufacturing an anisotropic conductive adhesive sheet |
| 12/22/2011 | WO2011159727A1 Method, system and apparatus for making short run radio frequency identification tags and labels |
| 12/22/2011 | WO2011159722A2 Method of manufacturing conductive structures |
| 12/22/2011 | WO2011159720A1 Foil laminate intermediate and method of manufacturing |
| 12/22/2011 | WO2011159716A1 Method of manufacturing a radio frequency identification device |
| 12/22/2011 | WO2011158731A1 Substrate for mounting semiconductor element and method for manufacturing the substrate |
| 12/22/2011 | WO2011158666A1 Process for production of connected structure |
| 12/22/2011 | WO2011158659A1 Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, led module, and method for forming circuit for printed wiring board |
| 12/22/2011 | WO2011158524A1 Surface mounting method for electronic components and printed circuit boards manufactured using said method |
| 12/22/2011 | WO2011158510A1 Drill hole entry sheet |
| 12/22/2011 | WO2011158476A1 Tape adhesion device and tape adhesion method |
| 12/22/2011 | WO2011157616A1 Apparatus having a connecting part for electrical connection between two electrical components |
| 12/22/2011 | WO2011157585A1 Method for producing an electrical connection and electrical connection |
| 12/22/2011 | WO2011157376A1 Method for bonding a strip-like conductor to a solar cell |
| 12/22/2011 | US20110313269 Micro-electrode array package using liquid crystal polymer and manufacturing method thereof |
| 12/22/2011 | US20110310605 Solid state lighting device and method employing heat exchanger thermally coupled circuit board |
| 12/22/2011 | US20110310579 Inductive Structure and Method of Forming the Inductive Structure with an Attached Core Structure |
| 12/22/2011 | US20110310566 Flux-free detachable thermal interface between an intergrated circuit device and a heat sink |
| 12/22/2011 | US20110309872 Voltage Spike Protection for Power DMOS Devices |
| 12/22/2011 | US20110308956 Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards |
| 12/22/2011 | US20110308848 Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device |
| 12/22/2011 | US20110308845 Printed circuit board and method of manufacturing the same |
| 12/22/2011 | US20110308842 Wiring substrate and method for manufacturing the wiring substrate |
| 12/22/2011 | US20110308082 Method for manufacturing multilayer printed circuit board with plated through holes |
| 12/22/2011 | US20110308080 Method for testing a contact structure |
| 12/22/2011 | US20110308079 Flex-rigid wiring board and method of manufacturing the same |
| 12/22/2011 | DE102010038493A1 Lötstruktur in Form der Ausschnittspositionierung und Verfahren zum Verhindern einer Verschiebung der Röhrenfüße Solder pattern in the form of the cut positioning, and method for preventing a displacement of the tube feet |
| 12/22/2011 | DE102010038492A1 Lötstruktur in Form der Ausschnittskantenpositionierung und Verfahren zum Verhindern einer Verschiebung des Röhrenfußes Solder pattern in the form of cut-edge positioning and methods for preventing a displacement of the tube foot |
| 12/22/2011 | DE102010024523A1 Mehrschichtiges Folienelement The multilayer film element |
| 12/22/2011 | DE102010024520A1 Method for increasing thermal mechanical resistance of ceramic substrate for mounting electrical components, involves covering edges of metallization layer by applying electrical isolation fill material between edges and substrate |
| 12/22/2011 | DE102004034396B4 Verbindungsteil und Verbindungsstecker für einen Kabelbaum Connecting part and connector for a wire harness |
| 12/21/2011 | EP2398305A1 Solder bump formation on a circuit board using a transfer sheet |
| 12/21/2011 | EP2398304A2 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/21/2011 | EP2398303A1 Switch board and assembled board having switch board |
| 12/21/2011 | EP2398302A1 Semiconductor module and semiconductor device |
| 12/21/2011 | EP2397452A1 Sintered body of low temperature cofired ceramic and multilayer ceramic substrate |
| 12/21/2011 | EP2113038B1 Multilayer printed wiring boards with copper filled through-holes |