Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2012
03/07/2012EP2427035A1 Flexible printed circuit board and touch screen panel apparatus having the same
03/07/2012EP2426787A1 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
03/07/2012EP2426714A1 Device mounting structure and device mounting method
03/07/2012EP2426626A1 Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet
03/07/2012EP2425692A1 Wiring substrate and method for manufacturing wiring substrate
03/07/2012EP2425689A1 Connecting unit
03/07/2012EP2162566B1 Method of manufacturing multilayer printed wiring boards with holes requiring copper wrap plate
03/07/2012EP1981319B1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package
03/07/2012EP1654915B1 Circuit board design
03/07/2012EP1620863B1 Circuit protection device
03/07/2012EP1445994B1 Manufacturing method for a wiring board sheet and manufacturing method for a multilayer board
03/07/2012CN202160346U 一种全自动高速led插件贴片机 A fully automated high-speed placement machine led plugin
03/07/2012CN202160345U 柔性电路板搬送载台 The flexible circuit board conveying stage
03/07/2012CN202160344U 一种印制线路板盲槽位湿膜涂布装置 One kind of printed circuit boards blind slot wet film coating device
03/07/2012CN202160343U 电子补线机 Repaired Machine
03/07/2012CN202160336U 一种电路板粘合结构 A circuit-board-bonded structure
03/07/2012CN202155924U Fpc拼板模具 Fpc puzzle mold
03/07/2012CN202155678U 一种线路板焊接夹具 A circuit board welding fixture
03/07/2012CN202155626U 热风循环加热装置 Hot air circulation heating device
03/07/2012CN1934173B Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
03/07/2012CN102369791A Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
03/07/2012CN102369600A Circuit board
03/07/2012CN102369315A Composition for metal plating comprising suppressing agent for void free submicron feature filling
03/07/2012CN102369309A Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
03/07/2012CN102369258A Agent for removing conductive film and method for removing conductive film
03/07/2012CN102369110A Screen print system and method for cleaning a mask of the same
03/07/2012CN102368898A Element centering device of component inserter
03/07/2012CN102368897A Long plate workbench for plug-in inserter
03/07/2012CN102368890A Manufacturing method of PCB with embedded assembly
03/07/2012CN101979248B Planar position adjustable platform and full-automatic vision printer
03/07/2012CN101922001B Method for manufacturing printed circuit board by power triggering electroless plating addition process
03/07/2012CN101861049B Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
03/07/2012CN101808476B Method for manufacturing circuit board
03/07/2012CN101695215B Copper foil with low profile bond enhancement
03/07/2012CN101606446B Multilayer circuit board and motor drive circuit board
03/07/2012CN101352763B FPC secondary drilling method
03/07/2012CN101330805B Method for preparing firm flexible printed board
03/07/2012CN101286593B Supersonic soldering aluminum coil and its production method
03/07/2012CN101276157B Exposure plotting device
03/06/2012US8130493 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method
03/06/2012US8129625 Multilayer printed wiring board
03/06/2012US8128986 Method for producing catalyst-layer-supporting substrate, method for producing membrane-electrode assembly and method for producing fuel cell
03/06/2012US8127997 Method for mounting an electronic component on a substrate
03/06/2012US8127441 Method of manufacturing ceramic/metal composite structure
03/06/2012US8127440 Method of making bondable flexible printed circuit
03/06/2012US8127439 Method of manufacturing electronic component device
03/06/2012US8127438 Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
03/06/2012CA2504223C Ink composition for use in a continuous web process for the manufacture of electrochemical sensors
03/01/2012WO2012026791A2 Conductive metal ink composition, and method for preparing a conductive pattern
03/01/2012WO2012026628A1 Film for conductive surface mount terminal and method for manufacturing same
03/01/2012WO2012026470A1 Circuit connecting material and method for connecting circuit members using same
03/01/2012WO2012026159A1 Gold displacement plating solution, and method for formation of joint part
03/01/2012WO2012025693A1 Printed circuit comprising at least one ceramic component
03/01/2012WO2012025446A1 Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon
03/01/2012WO2012025331A1 Method for the production of a ceramic green sheet
03/01/2012WO2012025222A1 Electric switch
03/01/2012WO2012025100A1 Multi-level circuit board for high-frequency applications
03/01/2012WO2012005470A3 Dual rail screen printer
03/01/2012WO2011159722A3 Method of manufacturing conductive structures
03/01/2012WO2011119558A3 Printed circuit board having aluminum traces with a solderable layer of material of applied thereto
03/01/2012WO2011061111A3 Method for producing silver-containing structures, products comprising silver-containing structures and use of the same
03/01/2012US20120052211 Solderability enhancement by silver immersion printed circuit board manufacture
03/01/2012US20120051019 Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same
03/01/2012US20120051017 Electronic Component and Method of Manufacturing the Same
03/01/2012US20120050938 Esd protection in a very small form factor consumer electronic product
03/01/2012US20120049971 Wideband Balun Using Re-Entrant Coupled Lines and Ferrite Material
03/01/2012US20120049877 Compliant printed circuit peripheral lead semiconductor test socket
03/01/2012US20120049384 Buffer Layer to Enhance Photo and/or Laser Sintering
03/01/2012US20120048948 Method for Manufacturing a Card Based on a Substrate
03/01/2012US20120048611 Embedded multi-layer circiut board and noise suppression method
03/01/2012US20120048609 Suspension substrate, suspension, and manufacturing method of suspension substrate
03/01/2012US20120048605 Method for controlling warpage within electronic products and an electronic product
03/01/2012US20120048604 Glass Interposer Panels And Methods For Making The Same
03/01/2012US20120048603 Printed circuit board and method for manufacturing same
03/01/2012US20120048465 Method of manufacturing touch screen
03/01/2012US20120047731 Method for Manufacturing Circuit Board and Method for Manufacturing Structure Using the Same
03/01/2012US20120047730 Method for fabricating ceramic substrate
03/01/2012US20120047729 Assembly method of a led lamp
03/01/2012US20120047728 Multi-piece board and fabrication method method thereof
03/01/2012US20120047727 Flex-rigid wiring board and method for manufacturing the same
03/01/2012US20120047726 Wiring placement method of wirings having different length and semiconductor integrated circuit device
03/01/2012DE102010039824A1 Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung Power module with a flexible connector
03/01/2012DE102010039749A1 Verfahren zur Bestückung einer Leiterplatte mit mehreren Bauteilen und elektrische Schaltung mit einer Leiterplatte und darauf montierten mehreren Bauteilen Method for mounting a circuit board having a plurality of components and electrical circuit with a circuit board and mounted thereon a plurality of components
03/01/2012DE102010039740A1 Kontaktelement zur Kontaktierung eines Schaltungsträgers, sowie Schaltungsträger mit einem Kontaktelement Contact element for contacting a circuit substrate, as well as circuit carrier to a contact element
03/01/2012DE102010035488A1 Verfahren zur Herstellung einer keramischen Grünfolie A process for producing a ceramic green sheet
03/01/2012CA2809401A1 Printed circuit comprising at least one ceramic component
02/2012
02/29/2012EP2424339A1 Electronic component and method of manufacturing the same
02/29/2012EP2424338A1 Multilayer printed wiring boards with holes requiring copper wrap plate
02/29/2012EP2424337A1 Substrate for printed wiring board, printed wiring board, and methods for producing same
02/29/2012EP2424005A1 Battery pack comprising a protection circuit module
02/29/2012EP2422918A1 Soldering material and electronic component assembly
02/29/2012EP2422888A2 A method of coating a surface with a water and oil repellant polymer layer
02/29/2012EP2422887A1 A method of coating a surface with a water and oil repellant polymer layer
02/29/2012EP2422593A2 Electronic structure
02/29/2012EP2422592A1 Method for pretreating a frame or carrier element for the production of a circuit board, and frame or carrier element and use therefor
02/29/2012EP2422591A1 Method, retaining means, apparatus and system for transporting a flat material feedstock, and loading or unloading device
02/29/2012EP2422589A2 Lighting electronic structure
02/29/2012EP2422300A2 Miniature rfid tag
02/29/2012EP2178353B1 Circuit module, and electronic device using the module
02/29/2012EP1997115B8 Ceramic component element and method for manufacturing the same