Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2012
02/29/2012EP1541654B1 Conductive adhesive and circuit comprising it
02/29/2012CN202153810U 压合机构及具有该压合机构的压合装置 Lamination agencies and institutions have the nip nip device
02/29/2012CN102365910A Localized jet soldering device and partial jet soldering method
02/29/2012CN102365909A Apparatus and method for manufacturing an integrated circuit
02/29/2012CN102365724A Method for disposing a component
02/29/2012CN102365723A Method for disposing a component
02/29/2012CN102365396A Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/29/2012CN102365395A Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/29/2012CN102365310A Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
02/29/2012CN102365006A Processing method of multi-layer circuit board
02/29/2012CN102365005A Printed circuit board (PCB) processing method
02/29/2012CN102365004A Manufacture method for high-precision bonding integrated circuit (IC) board
02/29/2012CN102365003A DES processing technology
02/29/2012CN102365002A Transplanting grafting technology of FPC defective product
02/29/2012CN102365001A Manufacture method for multiple surface treatments on one board
02/29/2012CN102365000A Manufacturing method of single-side aluminum circuit board
02/29/2012CN102364999A Manufacturing method of mechanical conduction hole circuit board without holes on surface
02/29/2012CN102364998A Production method of high-precision circuit board
02/29/2012CN102364997A Production method of Rogers board
02/29/2012CN102364996A Transplantation structure for connected printed circuit boards
02/29/2012CN101977486B Method for manufacturing via stubs of circuit board
02/29/2012CN101977481B Method for removing semi-metalized hole flash by back drilling
02/29/2012CN101932207B Multilayer PCB (Printed Circuit Board) and design method thereof
02/29/2012CN101909419B Transmission line electromagnetic noise suppressor and preparation method thereof
02/29/2012CN101795541B Pressing device
02/29/2012CN101794077B Operating platform and method of automatically installing shims
02/29/2012CN101790279B Composite reinforcing film and manufacturing method thereof
02/29/2012CN101777547B Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent
02/29/2012CN101758338B Low-temperature solubilizer of organic solderability preservative and application method thereof
02/29/2012CN101730395B Circuit board manufacturing method through coverage
02/29/2012CN101690988B Small wave crest clearing device of wave crest soldering machine
02/29/2012CN101605434B Method for molding via hole of printed circuit board
02/29/2012CN101516161B Manufacturing method of projection PCB circuit board
02/29/2012CN101346046B Plastering apparatus and method for printed circuit board
02/29/2012CN101340773B Wired circuit board and producing method thererof
02/29/2012CN101300908B A device for the high-speed drilling of boards for printed circuits and the like
02/29/2012CN101276156B Exposure device
02/29/2012CN101143500B Laminate and use thereof
02/28/2012US8126587 Apparatus for recognizing and processing information of electronic parts
02/28/2012US8125790 OC2 oriented connections 2
02/28/2012US8125788 Circuit module and radio communications equipment, and method for manufacturing circuit module
02/28/2012US8125632 Fabrication method of semiconductor integrated circuit device
02/28/2012US8124882 Multilayer printed wiring board
02/28/2012US8124325 Methods and apparatus for the manufacture of microstructures
02/28/2012US8122599 Method of manufacturing a printed circuit board (PCB)
02/28/2012US8122598 Multilayer printed wiring board and component mounting method thereof
02/28/2012US8122597 Method for fabricating light emitting diode signboard
02/28/2012US8122596 System of fabricating a flexible electrode array
02/28/2012US8122595 Electronic parts mounting device
02/28/2012US8122594 Method of manufacturing a deflectable electrophysiological catheter
02/23/2012WO2012023902A1 A flexible circuit and a method of producing the same
02/23/2012WO2012023440A1 Solder ball for semiconductor mounting and electronic member
02/23/2012WO2011126706A3 Printable materials and methods of manufacture thereof
02/23/2012US20120047374 Tamper resistance extension via tamper sensing material housing integration
02/23/2012US20120046887 Two-pin coupling slider
02/23/2012US20120045570 Plating solution for forming tin alloy and method of forming tin alloy film using the same
02/23/2012US20120044659 Compliant printed circuit peripheral lead semiconductor package
02/23/2012US20120044657 Floating circuit board alignment
02/23/2012US20120044656 Electronic package structure and method for making the same
02/23/2012US20120044637 Formed pcb
02/23/2012US20120044625 Card module and method for manufacturing card module
02/23/2012US20120044025 Electronic device, electronic apparatus, and electronic device manufacturing method
02/23/2012US20120043509 Indium Oxide Sintered Compact, Indium Oxide Transparent Conductive Film, and Manufacturing Method of Indium Oxide Transparent Conductive Film
02/23/2012US20120043130 Resilient conductive electrical interconnect
02/23/2012US20120043129 Circuit board and method for manufacturing the same
02/23/2012US20120043128 Printed circuit board and method of manufacturing the same
02/23/2012US20120043127 Printed circuit board and method for fabricating the same
02/23/2012US20120043126 Printed circuit board and method of manufacturing the same
02/23/2012US20120043125 Circuit boards, methods of forming the same and semiconductor packages including the same
02/23/2012US20120043124 Electrical device
02/23/2012US20120043123 Printed wiring board and a method of manufacturing a printed wiring board
02/23/2012US20120043122 Board with fine pitch bump and method of manufacturing the same
02/23/2012US20120043114 Device-embedded flexible printed circuit board and manufacturing method thereof
02/23/2012US20120042731 MEMS Pressure Sensor Device and Method of Fabricating Same
02/23/2012US20120042515 Method of producing circuit board
02/23/2012US20120042514 Method for Embedding Electrical Components
02/23/2012US20120042513 Manufacturing method of printed circuit board embedded chip
02/23/2012US20120042512 LED Chip-Based Lighting Products And Methods Of Building
02/23/2012US20120042511 Method of producing circuit board
02/23/2012US20120042510 Method of fabricating a metallic microstructure and microstructure obtained in accordance with this method
02/23/2012US20120042509 Method for manufacturing probe card
02/23/2012DE10392162B4 Schaltkreiskartenverbindungsstruktur und Herstellungsverfahren hierfür Circuit board connection structure and manufacturing method thereof
02/23/2012DE102010039550A1 Steuermodul Control module
02/23/2012DE102010034718A1 Contact point for use between metallic electrical conductor and electrical conductor in elongation-sensitive resistor transmitter, has gap provided between polymer-based electrical conductor and another point
02/23/2012DE102009012139B4 Modulsubstrat und Verfahren zur Herstellung Module substrate and methods for preparing
02/22/2012EP2421343A1 Assembly and method for machining circuit boards
02/22/2012EP2421342A2 Electronic component and method of manufacturing the same
02/22/2012EP2421341A2 Electronic component and method of manufacturing the same
02/22/2012EP2421340A1 Circuit substrate and manufacturing method thereof
02/22/2012EP2421338A1 Circuit board
02/22/2012EP2420593A1 Metalized Plastic Articles and Methods Thereof
02/22/2012EP2420115A1 Back drill verification feature
02/22/2012EP2420114A1 Method for conductively connecting a component on a transparent substrate
02/22/2012EP2304079B1 Acid-resistance promoting composition
02/22/2012EP2025210B1 Circuit carrier
02/22/2012EP1866357B1 (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof
02/22/2012EP1827849B1 Distortion compensation for printing
02/22/2012EP1616909B1 Release film for printed wiring board production
02/22/2012CN202151009U 柔性电路板fpc压着机用预压压头 Crimping Machine fpc flexible circuit board with preload pressure head
02/22/2012CN202151008U 用于柔性电路板压合作业的工装夹具 Fixture for flexible circuit board industry press cooperation
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