H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2011
12/14/2011	EP2395824A1 Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit
12/14/2011	EP2395823A1 Mounted structure and motor
12/14/2011	EP2395822A1 Mounting structure, electronic component, circuit board, board assembly, electronic device, and stress relaxation member
12/14/2011	EP2395598A1 Coaxial waveguide microstructures and methods of formation
12/14/2011	EP2395542A2 Method for manufacturing insulated conductive pattern and laminate
12/14/2011	EP2395541A2 Conductive pattern and manufacturing method thereof
12/14/2011	EP2394975A1 Method for producing metal-ceramic substrates metallised on both sides
12/14/2011	EP2092813B1 Electrical printed circuit board comprising a terminal connection
12/14/2011	EP2034810B1 Flex rigid wiring board
12/14/2011	EP1954111B1 Process for producing multilayer ceramic substrate
12/14/2011	EP1719208B1 Circuit board mounting bracket
12/14/2011	EP1372364B1 Method of manufacturing printed circuit boards
12/14/2011	CN202077276U 一种高频电阻焊接用钢板印刷治具 A high-frequency resistance welded steel plate printing fixture
12/14/2011	CN202077275U 用于印刷电路板清洗机的喷淋装置 Spray means for the printed circuit board cleaning machine
12/14/2011	CN202077274U 通过式毛刷清洗机 By type brush cleaning machine
12/14/2011	CN202077273U 喷盘的悬挂装置 Suspension spray disc
12/14/2011	CN202077272U 一种板边包胶装置 A plate is encapsulated device side
12/14/2011	CN202077271U 一种药水添加装置 Potion Add device
12/14/2011	CN202077270U 供料盘固定防呆治具 Feed tray fixed foolproof fixture
12/14/2011	CN202077269U 一种印刷线路板的压板模具 A printed wiring board platen mold
12/14/2011	CN202077268U 一种印刷线路板的目视检验辅助台 A printed wiring board auxiliary visual inspection station
12/14/2011	CN202077267U 塞孔网格垫板 Jack grid plate
12/14/2011	CN202077263U 一种无沉铜线路板 A non-PTH PCB
12/14/2011	CN202072783U 印刷线路板载具 Printed circuit board carrier
12/14/2011	CN1849260B 金属纳米粒子及其制造方法、金属纳米粒子分散液及其制造方法、以及金属细线和金属薄膜及其制造方法 A method of manufacturing the metal nanoparticles, metal nanoparticles dispersion liquid and manufacturing method thereof, and a metal thin film and its manufacturing method and metal
12/14/2011	CN1744801B 多层柔性印刷基板的无电解铜电镀方法 Electroless copper plating method of the multilayer flexible printed circuit board
12/14/2011	CN102282918A 布线基板、布线基板的制造方法、以及通路膏糊 A printed circuit board, method of manufacturing a wiring board, and via pastes
12/14/2011	CN102282294A 增加金属或金属合金表面的钎焊性和耐腐蚀性的溶液和方法 Brazing and corrosion resistance of the solutions and methods to increase the surface of a metal or metal alloy
12/14/2011	CN102281980A 树脂结晶成长型焊剂回收装置及焊剂回收方法 Resin crystal growth type flux recovery and flux recovery methods
12/14/2011	CN102281751A 安装结构体 Mounting structure
12/14/2011	CN102281750A 一种贴片机 A patch machine
12/14/2011	CN102281749A 一种贴片方法、贴片系统及贴片机 A patch method, patch systems and Mounter
12/14/2011	CN102281726A 一种高密度互连与高可靠性结合的多层电路板方法 A method of multilayer circuit board with high reliability, high density interconnect binding
12/14/2011	CN102281725A 电路板的制作方法 Circuit board manufacturing method
12/14/2011	CN102281724A 双面开窗塞孔的加工方法 Sided window plug hole machining methods
12/14/2011	CN102281723A 用于软式印刷电路板印刷的子母式载具 Combo vehicle for soft printed circuit board printing
12/14/2011	CN102281722A 重工焊接治具 Heavy welding fixture
12/14/2011	CN102281721A 一种表面加压覆盖膜的印刷线路板生产方法 A surface coating film pressure producing a printed wiring board
12/14/2011	CN102281720A 基板及其制造方法、电路装置及其制造方法 Substrate and manufacturing method of the circuit device and its manufacturing method
12/14/2011	CN102281719A 电子线路板防焊制程后利用显影机进行表面处理的方法 The method of electronic circuit boards with a solder resist developing machine manufactured 程后利 surface-treated
12/14/2011	CN102281718A 结合油墨印刷与磁性溅镀制造led灯板用导线的方法 Combined with magnetic ink sputtering manufacturing led light board with a wire method
12/14/2011	CN102281717A 一种高频电路模块基板的制作方法 A method of manufacturing a high-frequency circuit module board
12/14/2011	CN102281716A 一种高频超厚电路板的制作方法 A method of manufacturing a circuit board of a high frequency thick
12/14/2011	CN102281712A 叠层电路基板、粘结片及它们的制造方法 Laminated circuit substrate, the adhesive sheet and manufacturing method thereof
12/14/2011	CN102281711A 叠层电路基板以及基板制造方法 And a laminated circuit board substrate manufacturing method
12/14/2011	CN102281703A 层叠电路基板以及基板制造方法 And a multilayer circuit board substrate manufacturing method
12/14/2011	CN102281702A 基板布局与其形成方法 Its method of forming the substrate layout
12/14/2011	CN102281701A 一种led灯上的立体拉伸螺旋状线路板及其制作方法 A stereoscopic drawing board spiral light on its production methods led
12/14/2011	CN102281700A 多层印刷电路板电性结构及其制造方法 Electrical structure multilayer printed wiring board and its manufacturing method
12/14/2011	CN102280415A 封装结构、印制电路板组件和固定方法 Package, printed circuit board assembly and method of fixing
12/14/2011	CN102280326A 印刷电路板、电子器件以及印刷电路板的制造方法 The method of manufacturing printed circuit boards, electronic components and a printed circuit board
12/14/2011	CN102277124A 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
12/14/2011	CN102277123A 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
12/14/2011	CN102277096A 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 The anisotropic conductive adhesive and electrically connected using the method of the binder
12/14/2011	CN102277091A 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 Adhesive composition, a circuit connecting material, circuit member connection structure and a semiconductor device
12/14/2011	CN102276796A 镀液及镀覆方法 Bath and plating method
12/14/2011	CN102276284A 用于制造双面金属化陶瓷衬底的方法 The method of manufacturing a double-sided metallized ceramic substrate for
12/14/2011	CN101854779B 一种金属化半孔的制作工艺 Half of the production process of a metal hole
12/14/2011	CN101730389B 制作单面镂空柔性电路板的方法 Hollow-sided flexible circuit board production methods
12/14/2011	CN101684181B 一种光敏聚酰亚胺及其柔性线路板 A photosensitive polyimide and flexible circuit boards
12/14/2011	CN101512437B 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 Method for producing a photosensitive resin composition, a photosensitive element, resist pattern forming method and a printed circuit board
12/14/2011	CN101449208B 感光性树脂组合物以及层压体 The photosensitive resin composition and laminate
12/14/2011	CN101438464B 柔性电路至板的连接器 Flexible circuit board connector to
12/14/2011	CN101363128B 用于形成突起的非氰类电解金电镀液 Non-cyanide electrolytic gold plating solution for forming the protrusions
12/13/2011	US8077114 Process for the production of an electrically conductive structure
12/13/2011	US8076782 Substrate for mounting IC chip
12/13/2011	US8076759 Semiconductor package with a controlled impedance bus and method of forming same
12/13/2011	US8076612 Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method
12/13/2011	US8076591 Circuit boards
12/13/2011	US8076586 Heat conduction from an embedded component
12/13/2011	US8075788 Fabrication method of printed circuit board and printed circuit board machining apparatus
12/13/2011	US8075319 Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained
12/13/2011	US8074352 Method of manufacturing printed circuit board
12/13/2011	US8074351 Part mounting device and part mounting method
12/13/2011	US8074350 Method of printing electronic circuits
12/13/2011	US8074349 Magnetic hold-down for foil substrate processing
12/09/2011	CA2741917A1 Increased throughput for large-scale production of low melt organoamine stabilized silver nano-particles
12/08/2011	WO2011152994A1 Flexible printed circuit to glass assembly system and method
12/08/2011	WO2011152544A1 Ceramic substrate and method for manufacturing same
12/08/2011	WO2011152538A1 Printed circuit board, antenna, wireless communication device and manufacturing methods thereof
12/08/2011	WO2011152479A1 Electronic packaging device and method
12/08/2011	WO2011152312A1 Wiring board production method
12/08/2011	WO2011152212A1 Substrate with electro-acoustic conversion element mounted thereon, microphone unit, and manufacturing methods therefor
12/08/2011	WO2011152085A1 Method for producing integrated substrate
12/08/2011	WO2011152054A1 Wiring board and electronic device
12/08/2011	WO2011152033A1 Printed wiring board connecting structure, and camera module
12/08/2011	WO2011151992A1 Method of supporting arrangement of capacitor and capacitor arrangement supporting device
12/08/2011	WO2011151558A1 Method for connecting electrical or electronic components to a support of an electrically conductive circuit
12/08/2011	WO2011151453A2 Edge detection
12/08/2011	WO2011150738A1 Circuit board and manufacturing method thereof
12/08/2011	WO2011124692A3 Flat lighting elements, array of flat lighting elements and method for producing flat lighting elements
12/08/2011	US20110302346 Reducing cabling complexity in large-scale networks
12/08/2011	US20110300760 Electrical card-edge connector
12/08/2011	US20110300401 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
12/08/2011	US20110300291 Method for Film Formation, Apparatus for Film Formation, and Computer-Readable Recording Medium
12/08/2011	US20110299713 Portable electronic device comprising a folded substrate
12/08/2011	US20110299292 Flexirigid support plate
12/08/2011	US20110299256 Packaging for a millimeter wave radio-frequency integrated circuit (rfic)
12/08/2011	US20110299253 Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink
12/08/2011	US20110299250 Wiring substrate and manufacturing method thereof

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