Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2012
02/08/2012CN102349360A Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element
02/08/2012CN102348833A 蚀刻装置与蚀刻方法 Etching apparatus and method of etching
02/08/2012CN102348556A Screen printing device and screen printing method
02/08/2012CN102348527A Laser machining method and laser machining device
02/08/2012CN102348340A Method for manufacturing multilayered flexible circuit board
02/08/2012CN102348339A Circuit board manufacturing method
02/08/2012CN102348338A Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board
02/08/2012CN102348337A Method for producing circuit board containing stepped blind hole
02/08/2012CN102348336A Method for plugging conductive holes of circuit boards by resin
02/08/2012CN102348335A Plugging device and circuit substrate plugging method
02/08/2012CN102348334A Board printing system
02/08/2012CN102348333A Baseplate conveying mechanism
02/08/2012CN102348332A Circuit device and method of manufacturing the same
02/08/2012CN102348331A Circuit board manufacturing tool and circuit board manufacturing method
02/08/2012CN102348330A Circuit board manufacturing method
02/08/2012CN102348329A Die device and method for separating substrate via the same
02/08/2012CN102348325A Printed circuit board and method of manufacturing the same
02/08/2012CN102347308A 电路装置 Circuit means
02/08/2012CN102347307A Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
02/08/2012CN102347287A Multilayer wiring substrate
02/08/2012CN102347245A Method of manufacturing circuit device
02/08/2012CN102346319A AFC pasting device of FPD assembly
02/08/2012CN101884257B 具有腔部的多层布线基板 The multilayer wiring board having a cavity portion
02/08/2012CN101543146B 图像形成装置、图像形成方法、图案形成系统以及图案形成方法 The image forming apparatus, image forming method, a pattern forming method and pattern forming system
02/08/2012CN101521997B 分级金手指加工方法 Classification Goldfinger processing methods
02/08/2012CN101502191B 布线基板及其制造方法 A wiring board and its manufacturing method
02/08/2012CN101491171B 电路板设备、设有该电路板设备的电子设备及gnd连接方法 Circuit board equipment, an electronic device and the circuit board equipment gnd connection method
02/08/2012CN101415502B 在铜表面上制造图案的方法 The method of producing a pattern on the copper surface
02/08/2012CN101370359B 焊料修复设备及修复焊料的方法 Solder solder repair equipment and repair methods
02/08/2012CN101370352B 一种印刷电路板及其制作方法和球栅阵列焊盘图案 A printed circuit board and its production method and ball grid array landpattern
02/08/2012CN101321435B 印刷板上连接器的偏置脚垫的改进 Offset printed board connector pads improvements
02/08/2012CN101308799B 布线基板的连接方法及布线基板 Connecting a wiring board and a wiring board
02/07/2012US8111524 Electronic passive device
02/07/2012US8110918 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate
02/07/2012US8110917 Package substrate with a conductive connecting pin
02/07/2012US8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package
02/07/2012US8110750 Multilayer printed wiring board
02/07/2012US8110344 Metal photoetching product and production method thereof
02/07/2012US8110254 Flexible circuit chemistry
02/07/2012US8110245 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument
02/07/2012US8108993 Method of manufacturing wiring substrate, and method of manufacturing semiconductor device
02/07/2012US8108992 Method of making a microwave field director structure having V-shaped vane doublets
02/07/2012US8108991 Method and device for connecting a wiring board
02/07/2012US8108990 Method for manufacturing printed circuit board
02/07/2012US8108960 Particle removing member of substrate processing equipment
02/07/2012DE202011051940U1 Halteeinrichtung, insbesondere eine als Lötrahmen ausgebildete Halteeinrichtung Holding device, especially designed as a soldering frame holder
02/07/2012CA2537023C Processes for fabricating conductive patterns using nanolithography as a patterning tool
02/07/2012CA2460577C Material separation to form segmented product
02/02/2012WO2012015982A2 Electronics substrate with enhanced direct bonded metal
02/02/2012WO2012015703A1 A method for fabricating touch sensor panels
02/02/2012WO2012015085A1 Printed circuit board and method of manufacturing the same
02/02/2012WO2012015084A1 Printed circuit board and method of manufacturing the same
02/02/2012WO2012015015A1 Glass ceramic composition, substrate for light-emitting element, and light-emitting device
02/02/2012WO2012014875A1 Insulating sheet, process for producing same, and process for producing structure using the insulating sheet
02/02/2012WO2012014743A1 Substrate structure for vehicle-mounting electronic device
02/02/2012WO2012014692A1 Ceramic multilayer substrate and method for producing same
02/02/2012WO2012014673A1 Inspection jig and contact
02/02/2012WO2012014658A1 Method for producing metal pattern
02/02/2012WO2012014657A1 Method for producing metal patterns
02/02/2012WO2012014648A1 Substrate-embedded capacitor, capacitor-integrated substrate provided with same, and method for producing substrate-embedded capacitor
02/02/2012WO2012014647A1 Substrate-embedded capacitor, capacitor-integrated substrate provided with same, and method for producing substrate-embedded capacitor
02/02/2012WO2012014646A1 Method for producing substrate-embedded capacitor, and capacitor-integrated substrate provided with same
02/02/2012WO2012014580A1 Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board
02/02/2012WO2012014339A1 Flexible printed circuit board and method of manufacturing thereof
02/02/2012WO2012014005A1 Rfid tag and method for manufacturing such a rfid tag
02/02/2012WO2012013437A1 Method for stabilizing a concentration of a constituent in a solder bath
02/02/2012WO2012005524A9 The printed circuit board and the method for manufacturing the same
02/02/2012WO2011127328A3 Electronic assemblies and methods of forming electronic assemblies
02/02/2012WO2011126925A3 Debond interconnect structures
02/02/2012WO2011126562A3 Two-component, polyaspartic coating compositions
02/02/2012WO2011099817A3 Embedded printed circuit board and method of manufacturing the same
02/02/2012US20120026692 Electronics substrate with enhanced direct bonded metal
02/02/2012US20120026659 Ceramic chip assembly
02/02/2012US20120026573 Electrochromic window fabrication methods
02/02/2012US20120026448 Display panel, display apparatus having the same, and method thereof
02/02/2012US20120026112 Image display apparatus and method thereof
02/02/2012US20120025924 Printed circuit board and method of manufacturing the same
02/02/2012US20120025787 Apparatus and associated methods
02/02/2012US20120024816 Method for fabricating touch sensor panels
02/02/2012US20120024593 Printed circuit board unit, method for manufacturing printed circuit board unit, and electric apparatus
02/02/2012US20120024583 Multilayer laminate package and method of manufacturing the same
02/02/2012US20120024581 Printed circuit board and method of manufacturing the same
02/02/2012US20120024575 Thermal pad and method of forming the same
02/02/2012US20120024574 Printed circuit board and method of manufacturing the same
02/02/2012US20120024573 Printed circuit board and manufacturing method thereof
02/02/2012US20120023744 Method for manufacturing multilayer printed circuit board
02/02/2012DE19633796B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards
02/02/2012DE102011014902B3 Producing an antenna component with a three-dimensional antenna, comprises forming an electrical conductive layer made of an electrical conductive lacquer onto a thermoplastic carrier foil in an antenna area formed as antenna structure
02/02/2012DE102010038784A1 Layered composite for circuit device i.e. control device, in engine compartment of motor car, has region with intermetallic phase formed between layers according to temperature treatment of layer arrangement
02/02/2012DE102010038452A1 Leiterquerschnitt mit Verzinnung Conductor cross section with tin
02/01/2012EP2413678A1 Printed circuit board unit, method for manufacturing printed circuit board unit, and electronic apparatus
02/01/2012EP2413677A1 Localized jet soldering device and partial jet soldering method
02/01/2012EP2413676A1 Chip component mounting structure, chip component mounting method and liquid crystal display device
02/01/2012EP2413675A1 Connector module and electronic device having the same
02/01/2012EP2413370A2 Solar cell and electrode structure therefor
02/01/2012EP2412743A1 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
02/01/2012EP2412519A1 Film with attached metal layer for electronic components, production method thereof, and applications thereof
02/01/2012EP2412213A1 Improvements in or relating to pcb-mounted integrated circuits
02/01/2012EP2411560A1 Process for sintering nanoparticles at low temperatures
02/01/2012EP2411200A2 Plastic articles and methods of their manufacturing, optionally with partial metal coating
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