| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/11/2012 | EP1723836B1 A radio frequency circuit board topology |
| 04/11/2012 | EP1714730B1 Method of manufacturing by laser workpieces |
| 04/11/2012 | EP1704758B1 Method for the production of printed circuit boards and printed circuit board |
| 04/11/2012 | CN202190466U Clamping plate device of printed circuit board |
| 04/11/2012 | CN202190465U Re-washing device of printing ink of circuit board |
| 04/11/2012 | CN202190464U 退膜生产线 Back film production line |
| 04/11/2012 | CN202190463U 一种气振机构和气振系统 Zhen Zhen agency the gas - gas system |
| 04/11/2012 | CN202190462U 电路板零配件整理装置 Circuit board parts finishing equipment |
| 04/11/2012 | CN202190461U 一种柔性线路板覆压膜夹具 A flexible circuit board coating film fixture |
| 04/11/2012 | CN202190459U 贴片元件焊盘布局结构 SMD components pad layout structure |
| 04/11/2012 | CN202189228U 电路板曝光机的冷却系统 Cooling system circuit board exposure machine |
| 04/11/2012 | CN202185661U Clamp plate device of printed circuit board |
| 04/11/2012 | CN102415228A 增层型多层印刷布线板及其制造方法 By the multi-layer printed wiring board and its manufacturing method |
| 04/11/2012 | CN102415227A 陶瓷多层基板的制造方法 The method of manufacturing a ceramic multilayer substrate |
| 04/11/2012 | CN102415226A 多层印刷电路板的制造方法 The method of manufacturing a multilayer printed circuit board |
| 04/11/2012 | CN102415225A 电路基板的制造方法 The method of manufacturing a circuit board |
| 04/11/2012 | CN102415224A 用于改善互连结构的功率增益和损耗的方法和设备 Method for improving the power gain and the loss of the interconnect structure and device |
| 04/11/2012 | CN102415223A 印刷电路板安排 A printed circuit board arrangement |
| 04/11/2012 | CN102415222A Substrate for printed wiring board, printed wiring board, and methods for producing same |
| 04/11/2012 | CN102414618A 光固化性热固化性树脂组合物 The photocurable and thermosetting resin composition of the |
| 04/11/2012 | CN102414617A 光固化性热固化性树脂组合物 The photocurable and thermosetting resin composition of the |
| 04/11/2012 | CN102413646A Manufacturing method of circuit board |
| 04/11/2012 | CN102413645A 一种pcb半塞孔的制造方法 A method for producing half-plug hole pcb |
| 04/11/2012 | CN102413644A 电路板模组的制作方法 Production methods circuit board module |
| 04/11/2012 | CN102413643A Solder ball loading method and solder ball loading unit background of the invention |
| 04/11/2012 | CN102413642A Connection structure and connection method of wiring board |
| 04/11/2012 | CN102413641A Multilayer wiring board and manufacturing method thereof |
| 04/11/2012 | CN102413640A 一种电路板铜面处理方法 A circuit board copper surface treatment method |
| 04/11/2012 | CN102413639A 一种电路板的制造方法 A method of manufacturing a circuit board |
| 04/11/2012 | CN102413638A 一种镂空板的线路制作方法 Line method of making a hollow plate |
| 04/11/2012 | CN102413637A 印刷电路板分解装配装置 A printed circuit board exploded assembly device |
| 04/11/2012 | CN102413636A Pin positioning method for press fit of metal substrate |
| 04/11/2012 | CN102413635A 多连片基板及其制造方法 Multi-contiguous substrate and manufacturing method |
| 04/11/2012 | CN102413630A 布线电路基板及其制造方法 The method of manufacturing a wiring circuit board and |
| 04/11/2012 | CN102413629A 一种印制电路板及其制造方法 A method of manufacturing a printed circuit board and |
| 04/11/2012 | CN102409378A 薄板电镀铜生产工艺的工装 Thin copper plating production process tooling |
| 04/11/2012 | CN102408840A Adhesive film, and connection structure and connecting method for circuit member |
| 04/11/2012 | CN101937173B 曝光机的曝光方法 The exposure method of exposing machine |
| 04/11/2012 | CN101868121B 电路板及其连接部的成形方法 Method for forming a circuit board and a connecting portion |
| 04/11/2012 | CN101790903B 多层印刷线路板以及多层印刷线路板的制造方法 The method of manufacturing a multilayer printed wiring board and a multilayer printed wiring board |
| 04/11/2012 | CN101720174B 软硬结合电路板组合工艺 Flex circuit board assembly process |
| 04/11/2012 | CN101692441B Packaging structure of printed circuit board |
| 04/11/2012 | CN101658079B 多层印刷线路板及其制造方法 Multilayer printed wiring board and its manufacturing method |
| 04/11/2012 | CN101627667B 电路板的制造方法 The method of manufacturing a circuit board |
| 04/11/2012 | CN101562952B 线路基板、线路基板的制作方法及电路板的制作方法 Circuit substrate manufacturing method, a circuit substrate and method of manufacturing the circuit board |
| 04/11/2012 | CN101504491B 电路装置与基板接合用光学对位装置及具有该装置的系统 Circuit means for bonding the substrate and having an optical system of the positioning device of the apparatus |
| 04/11/2012 | CN101479405B Electroless Ni-P plating method and substrate for electronic component |
| 04/11/2012 | CN101370628B 用于表现分离力的方法 A method for the performance of the separating force |
| 04/11/2012 | CN101330804B 印刷基板的制造方法以及印刷基板 The method of manufacturing a printed circuit board and the printed circuit board |
| 04/10/2012 | US8154701 Liquid crystal display device with link lines connecting to tape carrier package |
| 04/10/2012 | US8153905 Method for manufacturing printed wiring board and printed wiring board |
| 04/10/2012 | US8153516 Method of ball grid array package construction with raised solder ball pads |
| 04/10/2012 | US8153186 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
| 04/10/2012 | US8152950 Multi-layer circuit board and method of making the same |
| 04/10/2012 | US8151456 Method of producing substrate |
| 04/10/2012 | US8151455 Printed circuit board and method of manufacturing the same |
| 04/05/2012 | WO2012044563A1 Resistor shield to minimize crosstalk and power supply interference |
| 04/05/2012 | WO2012043912A1 Method for manufacturing thin film transistor and electronic circuit using spray method |
| 04/05/2012 | WO2012043799A1 Method for manufacturing multilayer circuit board |
| 04/05/2012 | WO2012043795A1 Circuit board, power supply structure, method for manufacturing circuit board, and method for manufacturing power supply structure |
| 04/05/2012 | WO2012043775A1 Tape carrier package manufacturing method, and method of manufacturing flexible circuit board for tape carrier package |
| 04/05/2012 | WO2012043742A1 Method for manufacturing package substrate for semiconductor element mounting |
| 04/05/2012 | WO2012043658A1 Mullite sintered object and circuit board using the same, and probe card |
| 04/05/2012 | WO2012043473A1 Curable composition for inkjet applications, and process for manufacturing electronic component |
| 04/05/2012 | WO2012043201A1 Method for forming solder resist pattern |
| 04/05/2012 | WO2012043182A1 Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board |
| 04/05/2012 | WO2012043010A1 Metal film material and method for manufacturing same |
| 04/05/2012 | WO2012043001A1 Novel photosensitive resin composition production kit, and use thereof |
| 04/05/2012 | WO2012042847A1 Heat-curable resin filler |
| 04/05/2012 | WO2012042846A1 Method for forming solder resist |
| 04/05/2012 | WO2012042809A1 Electronic component mounting method |
| 04/05/2012 | WO2012042740A1 Structural body and wiring substrate |
| 04/05/2012 | WO2012042717A1 Structural body and wiring substrate |
| 04/05/2012 | WO2012042711A1 Wiring substrate and electronic device |
| 04/05/2012 | WO2012042668A1 Substrate with built-in component and method for manufacturing substrate with built-in component |
| 04/05/2012 | WO2012042667A1 Method for manufacturing substrate with built-in component, and substrate with built-in component manufactured using the method |
| 04/05/2012 | WO2012041529A1 Subsea control system |
| 04/05/2012 | WO2012019822A3 Electrical device |
| 04/05/2012 | WO2012006063A3 Microelectronic package and method of manufacturing same |
| 04/05/2012 | WO2011142558A3 Conductive metal ink composition, and method for forming a conductive pattern |
| 04/05/2012 | WO2011032741A3 Method for manufacturing a thin-film photovoltaic cell module encompassing an array of cells and photovoltaic cell module |
| 04/05/2012 | US20120083169 Circuit board socket with support structure |
| 04/05/2012 | US20120082779 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 04/05/2012 | US20120081873 Implementing high-speed signaling via dedicated printed circuit-board media |
| 04/05/2012 | US20120081868 Electronic Assemblies and Methods of Forming Electronic Assemblies |
| 04/05/2012 | US20120081867 Embedded isolation filter |
| 04/05/2012 | US20120081348 Method for eliminating row or column routing on array periphery |
| 04/05/2012 | US20120080401 Method of fabricating multilayer printed circuit board |
| 04/05/2012 | US20120080400 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 04/05/2012 | US20120080322 Method, treatment station and assembly for treating a planar material to be treated |
| 04/05/2012 | US20120080224 Circuit board for signal transmission and method of manufacturing the same |
| 04/05/2012 | US20120080221 Printed wiring board with built-in component and its manufacturing method |
| 04/05/2012 | US20120080219 Method of manufacturing electronic device and electronic device |
| 04/05/2012 | US20120080137 Manufacturing method of circuit board |
| 04/05/2012 | US20120079717 Assembly Method for Converting the Precursors to Capacitors |
| 04/05/2012 | US20120079716 Method of manufacturing printed circuit board |
| 04/05/2012 | DE202011107022U1 Vorrichtung zum Löten An apparatus for soldering |
| 04/05/2012 | CA2811963A1 Resistor shield to minimize crosstalk and power supply interference |
| 04/04/2012 | EP2437582A1 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same |
| 04/04/2012 | EP2436723A1 Method for manufacturing prepreg for printed wiring board and device for manufacturing prepreg for printed wiring board |