| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/15/1993 | US5218761 Process for manufacturing printed wiring boards |
| 06/15/1993 | CA2007095C Film bonding method and apparatus for performing same |
| 06/15/1993 | CA1319205C2 Modular integrated circuit device |
| 06/15/1993 | CA1319204C2 Universal integrated circuit module |
| 06/15/1993 | CA1319203C2 Method of building a variety of complex integrated circuits from standardizable components |
| 06/15/1993 | CA1319202C2 Method of testing integrated circuit device |
| 06/15/1993 | CA1319009C Soldering apparatus for printed circuit boards |
| 06/13/1993 | CA2079828A1 Plasma based soldering by indirect heating |
| 06/12/1993 | CA2084369A1 Water-borne photoimageable compositions |
| 06/12/1993 | CA2084147A1 Metallized paths on diamond surfaces |
| 06/11/1993 | CA2084856A1 Radiation-sensitive polymers |
| 06/10/1993 | WO1993011654A1 Electronic module assembly |
| 06/10/1993 | WO1993011653A1 A process and an apparatus for wave soldering |
| 06/10/1993 | WO1993011652A1 Printed circuit combination and process |
| 06/10/1993 | WO1993011465A1 Photopolymerizable composition containing interlinked allylic and epoxy polymer networks |
| 06/10/1993 | WO1993011280A1 Multiple solvent cleaning system |
| 06/10/1993 | CA2123207A1 Multiple solvent cleaning system |
| 06/09/1993 | EP0545910A2 Laminated foil for making high-frequency field interfering elements |
| 06/09/1993 | EP0545328A2 Printed circuit board manufacturing process |
| 06/09/1993 | EP0545218A2 Complexing agent for displacement tin plating |
| 06/09/1993 | EP0545216A2 Process for extending the life of a displacement plating bath |
| 06/09/1993 | EP0544915A1 Package structure of semiconductor device and manufacturing method therefor |
| 06/09/1993 | DE4140163A1 LCD display with cover plate and back plate - is releasably connected to PCB by U=shaped holder frame and guide frame via flexible electric connector strips |
| 06/09/1993 | DE4139957A1 PCB preventing reverse polarity mounting of components - has hole pattern having one hole with different form from other for use in manual assembling of components |
| 06/08/1993 | US5218461 Scanning optical apparatus |
| 06/08/1993 | US5218335 Electronic circuit device having thin film resistor and method for producing the same |
| 06/08/1993 | US5218172 Metallized frame which interconnects etched wirings for integrated circuits |
| 06/08/1993 | US5218022 Protective coating for an electrical or electronic circuit |
| 06/08/1993 | US5217849 Plating copper layers onto both surfaces of polyimide film, then forming photoresist layers on both sides, masking, exposure, development, baking, etching |
| 06/08/1993 | US5217847 Liquid solder mask composition |
| 06/08/1993 | US5217829 Method for producing photomasks |
| 06/08/1993 | US5217751 Stabilizing and extending life of aqueous bath by adding free metal different from substrate, ionizable compounds of free metal, complexing agent and acid |
| 06/08/1993 | US5217599 Using bismaleimide |
| 06/08/1993 | US5217598 Using controlled streams of rising air bubbles to stir electrolytic solution gives uniform defect-free plating |
| 06/08/1993 | US5217597 Using a transfer plate to electrodeposit solder and subsequently reflow the deposits onto the substrate |
| 06/08/1993 | US5217589 Method of adherent metal coating for aluminum nitride surfaces |
| 06/08/1993 | US5217571 Pretreatment, applying to surface in solvent |
| 06/08/1993 | US5217566 Depositing a glass passivation layer over a silicon wafer while heating, densification and polishing to smooth without reflowing glass |
| 06/08/1993 | US5217550 Alignment transfer method |
| 06/08/1993 | US5217383 Plug contact arrangement |
| 06/08/1993 | US5217216 HTCC/LTCC substrate blanker/multi-layer collation die |
| 06/03/1993 | DE4239982A1 Ribbon cable for telecommunications, computer and auto equipment - has flake graphite conductors in thermoplastic tape, reinforced by metal or fibre mesh giving lightweight non-corrosive assembly |
| 06/03/1993 | DE4139550A1 Electric connector for electric plate and electric components - has deflectable contact tongues in wedge-shaped apertures which grip component contact terminals |
| 06/03/1993 | DE4139357A1 Solder applying device for restricted areas of PCB's - has pivotable lever squeezing press to provide solder in cooperation with screen printing masks |
| 06/02/1993 | EP0544398A1 An apparatus for laser processing of composite structures |
| 06/02/1993 | EP0544305A2 Method of forming a contact bump using a composite film |
| 06/02/1993 | EP0544294A2 Method of bonding circuit boards |
| 06/02/1993 | EP0544076A2 Reworkable module and method of fabricating the module |
| 06/02/1993 | EP0543974A1 A circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board. |
| 06/01/1993 | US5216583 Device for mounting a flat package on a circuit board |
| 06/01/1993 | US5216581 Electronic module assembly and method of forming same |
| 06/01/1993 | US5216485 Advanced via inspection tool (avit) |
| 06/01/1993 | US5216254 Circuit pattern forming apparatus using mu-stm |
| 06/01/1993 | US5215863 Resin composition and solder resist composition |
| 06/01/1993 | US5215646 Low profile copper foil and process and apparatus for making bondable metal foils |
| 06/01/1993 | US5215610 Method for fabricating superconductor packages |
| 06/01/1993 | US5215602 Applying a blend of at least two linear random copolymers of ethylene oxide and propylene oxide; low viscosity; circuit boards with high insulation resistance |
| 06/01/1993 | US5215593 Placing substrate in container of boiling vapor; raising through liquid curtain; washing entire surface before exposure to air |
| 06/01/1993 | US5215592 Dense fluid photochemical process for substrate treatment |
| 06/01/1993 | US5214991 Punching apparatus |
| 06/01/1993 | US5214990 Method and system for punching holes in a sheet material |
| 05/27/1993 | WO1993010653A1 Device for formation of a film on the walls of holes in printed circuit boards |
| 05/27/1993 | WO1993010652A1 Process for improved adhesion between a metallic oxide and a polymer surface |
| 05/27/1993 | WO1993010573A1 Die mounting with uniaxial conductive adhesive |
| 05/27/1993 | WO1993010544A1 Electrical appliance, in particular steering column switch for motor vehicles |
| 05/27/1993 | WO1993010277A1 Improved method for bonding copper to a polymeric material |
| 05/27/1993 | WO1993010202A1 Heat-seal coating using dispersions |
| 05/27/1993 | DE4239324A1 Protective coating for electronic device contg. fluorinated acrylate] - and/or fluorinated polyurethane and opt. acrylic] resin, applied as organic soln. |
| 05/27/1993 | DE4236268A1 Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections |
| 05/27/1993 | DE4138771A1 Electroconductive film prodn. on plastics surface - esp. for electromagnetic screen by impregnation with monomer and oxidant to form conductive polymer |
| 05/27/1993 | CA2123877A1 Die mounting with uniaxial conductive adhesive |
| 05/26/1993 | EP0543411A2 A wiring board and a method for producing the same |
| 05/26/1993 | EP0543364A2 Method for manufacturing polyimide multilayer wiring substrate |
| 05/26/1993 | EP0543331A2 Polyimide multilayer interconnection board and method of making the same |
| 05/26/1993 | EP0543121A2 Method of manufacturing a metal/ceramic substrate with an interface region |
| 05/26/1993 | EP0543045A1 Process for manufacturing printed circuit boards |
| 05/26/1993 | EP0542796A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane; ethanol; and nitromethane. |
| 05/26/1993 | EP0511305A4 Method, system and composition for soldering by induction heating |
| 05/26/1993 | EP0294478B1 Improved grinding guide and method |
| 05/26/1993 | CN1072557A Process for mfg. multi-layer printed circuits and multi-layer printed circuits |
| 05/26/1993 | CN1072364A Jig for detecting height of wavy solder surface, method of controlling height of solder suface |
| 05/25/1993 | US5214571 Multilayer printed circuit and associated multilayer material |
| 05/25/1993 | US5214570 Compact memory module |
| 05/25/1993 | US5214563 Thermally reactive lead assembly and method for making same |
| 05/25/1993 | US5214308 Substrate for packaging a semiconductor device |
| 05/25/1993 | US5214250 Method of reworking circuit panels, and circuit panels reworked thereby |
| 05/25/1993 | US5214000 Thermal transfer posts for high density multichip substrates and formation method |
| 05/25/1993 | US5213945 Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
| 05/25/1993 | US5213917 Plasma processing with metal mask integration |
| 05/25/1993 | US5213876 Flexible circuit card with laser-contoured VIAs and machined capacitors |
| 05/25/1993 | US5213875 Acrylate and epoxy blend |
| 05/25/1993 | US5213850 Process for plating a metallic deposit between functional pattern lines on a substrate |
| 05/25/1993 | US5213840 Method for improving adhesion to polymide surfaces |
| 05/25/1993 | US5213715 Globules of resin containing metal particles dispersed in second resin, becomes conductive upon compression |
| 05/25/1993 | US5213676 Integrated circuits |
| 05/25/1993 | US5213647 Arrangement for holding together a package of boards for printed circuits |
| 05/25/1993 | US5213622 Cleaning agents for fabricating integrated circuits and a process for using the same |
| 05/25/1993 | US5213621 Complexing with metal impurities; vapor phase |
| 05/25/1993 | US5213515 Connector with removable solder fixture plate |
| 05/25/1993 | US5213511 Dimple interconnect for flat cables and printed wiring boards |