| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/29/1993 | US5223687 Contacting the metal electrode with the surface of a substrate and moving the area where the electrode contacts the film; film of indium oxide or indium tin oxide |
| 06/29/1993 | US5223676 Composite circuit board having means to suppress heat diffusion and manufacturing method of the same |
| 06/29/1993 | US5223375 Butadiene-vinyl pyridine or isoprene-vinyl pyridene block polymer |
| 06/29/1993 | US5223321 Tape with interconnection terminals of gold having Vickers hardness of 55 or less for even bonding to pad |
| 06/29/1993 | US5223116 Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces |
| 06/29/1993 | US5223110 Apparatus for electroplating electrical contacts |
| 06/29/1993 | US5223087 Chemical solubilizing agent for tin or tin alloy |
| 06/29/1993 | US5223037 Plant for the manufacture of printed-circuit boards or multi-layers |
| 06/29/1993 | US5222650 Solder leveller |
| 06/29/1993 | US5222307 Drying method and apparatus therefor |
| 06/29/1993 | US5222305 Method for specifying and verifying positive graphics pattern positions relative to non-plated tooling holes patterns on the same substrate |
| 06/29/1993 | CA1319776C Process for the production of images |
| 06/29/1993 | CA1319643C Clamp holder |
| 06/29/1993 | CA1319642C Method for the guidance of board-shaped objects and the respective device for this purpose |
| 06/24/1993 | WO1993012560A1 Method of joining connection plates |
| 06/24/1993 | WO1993012539A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/24/1993 | WO1993012538A1 Process for fabricating layered superlattice materials |
| 06/24/1993 | WO1993012527A1 Method of manufacturing highly conducting composites containing only small proportions of electron conductors |
| 06/24/1993 | WO1993012271A1 Simplified method for direct electroplating of dielectric substrates |
| 06/24/1993 | WO1993012267A1 Polymeric resin, in particular for depositing metal on a substrate, and use thereof |
| 06/24/1993 | WO1993012190A1 Conductive adhesive compositions based on thermally depolymerisable polymers |
| 06/24/1993 | WO1993011906A1 Paste, ink or cream formulations for use in the electronics industry |
| 06/24/1993 | WO1993011905A1 Solder paste formulations for use in the electronics industry |
| 06/24/1993 | WO1993011903A1 Method and apparatus for applying a liquid in the shape of a wave |
| 06/24/1993 | WO1993011881A1 Method of coating surfaces with finely particulate materials |
| 06/24/1993 | DE4243345A1 Circuit board integrated circuit module mounting construction - uses thin film surface coating element to bond IC terminals to corresponding circuit board conductor paths |
| 06/24/1993 | DE4206746C1 Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| 06/24/1993 | DE4142658A1 Deposition of solder pattern on circuit boards - applying charge drum collecting pattern of soldered powder particles for transfer to board. |
| 06/24/1993 | DE4141775A1 Electronic circuits mfr. - using temporary substrate for assembly and fixing with cast epoxy] resin |
| 06/24/1993 | CA2126189A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/24/1993 | CA2125487A1 Paste, ink or cream formulations for use in the electronics industry |
| 06/23/1993 | EP0547860A1 Soldering method and apparatus |
| 06/23/1993 | EP0547852A2 Multilayer wiring board, interlevel connector, and method for making same |
| 06/23/1993 | EP0547692A1 Electrical wire deletion |
| 06/23/1993 | EP0547416A2 Fluid treatment apparatus and method |
| 06/23/1993 | EP0547328A1 Film sticking apparatus |
| 06/23/1993 | EP0547327A1 Film applying method and film applying apparatus |
| 06/23/1993 | EP0285051B1 Method for bonding integrated circuit chips |
| 06/23/1993 | CN2137071Y V type conveying appliance for use of printed circuit plate production |
| 06/23/1993 | CN1073547A Resistiue metal layers and method for making same |
| 06/23/1993 | CN1073385A Method for making thick film/solder joints |
| 06/22/1993 | US5221859 Higher solderability and corrosion resistance |
| 06/22/1993 | US5221783 Low dielectric constant polyurethane filleting composition |
| 06/22/1993 | US5221662 Superconducting screen printing ink and process for producing a thick superconducting film using this ink |
| 06/22/1993 | US5221639 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/22/1993 | US5221595 Printing plates, photoresist; high photosensitivity, acid resistance |
| 06/22/1993 | US5221426 Laser etch-back process for forming a metal feature on a non-metal substrate |
| 06/22/1993 | US5221420 Etching method for increased circuitized line width and uniformity |
| 06/22/1993 | US5221418 Contacting exposed insulation with liquid which softens or swells resin and eliminates metal species from surface |
| 06/22/1993 | US5221417 Conductive adhesive film techniques |
| 06/22/1993 | US5221399 Joining of printed wiring board to aluminum stiffener using adhesive film, electrically insulative mesh structure that cures at room temperature |
| 06/22/1993 | US5221366 Oxidizing metal to metal oxide thin film, complexing and sublimation of metal-ligand complex from the surface |
| 06/22/1993 | US5221362 Non-halogenated aqueous cleaning systems |
| 06/22/1993 | US5221347 Apparatus for coating both sides of plate-like substrates |
| 06/22/1993 | US5221038 Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature |
| 06/22/1993 | US5220934 Automatic continuous processing apparatus |
| 06/22/1993 | US5220726 Method for manufacturing an electrically connectable module |
| 06/22/1993 | US5220725 Micro-emitter-based low-contact-force interconnection device |
| 06/22/1993 | US5220724 Warming an adhesive containing conductive particles from solid phase to liquid phase, applying it to substrate, cooling back, warming both adhesive and substrate, takyfying, mounting the substrate, cooling back again; stamping or sceen printing |
| 06/22/1993 | US5220723 Process for preparing multi-layer printed wiring board |
| 06/22/1993 | CA1319340C Method and apparatus for production of three-dimensional objects by photosolidification |
| 06/21/1993 | CA2085820A1 Method of soldering using a special atmospheric gas |
| 06/20/1993 | CA2069045A1 System for performing related operations on workpieces |
| 06/17/1993 | DE4242408A1 Connecting liquid crystal displays to IC substrate - using patterned conducting photoresist and UV hardened resin to prevent electrodes from being short-circuited |
| 06/17/1993 | DE4141416A1 Verfahren zur beschichtung von oberflaechen mit feinteiligen feststoff-partikeln Process for coating surfaces with fine solids-particles |
| 06/17/1993 | DE4141321A1 Printed circuit board with solder contacts for edge mounting of auxiliary PCB - provides for metallised contacts to be left when auxiliary PCB is sepd. from basic board |
| 06/17/1993 | DE4140640A1 Copper@ recovery from discarded circuit boards - uses mixt. of organic acid and halogenated hydrocarbon(s) for sepn. and recovery |
| 06/17/1993 | DE4140284A1 Provision of connection tracks for liq. crystal display - performing anisotropic hot sealing of connector for flat cable to selectively metallised edge of glass body |
| 06/17/1993 | CA2085081A1 Soldering method that employs inert gas generator |
| 06/16/1993 | EP0546997A1 Radiation-sensitive polymer |
| 06/16/1993 | EP0546824A1 Metallized paths on diamond surfaces |
| 06/16/1993 | EP0546814A1 A polyimide photosensitive cover coating agent |
| 06/16/1993 | EP0546768A1 Water-borne photoimageable compositions |
| 06/16/1993 | EP0546703A1 Lithographic material and processes involved in their use |
| 06/16/1993 | EP0546696A1 Process for lithography on piezoelectric films |
| 06/16/1993 | EP0546443A1 Soldering by conduction of heat from a plasma |
| 06/16/1993 | EP0546285A1 Electronic package assembly with protective encapsulant material |
| 06/16/1993 | EP0546172A1 Circuit card assembly conduction converter and method. |
| 06/16/1993 | CN1073316A Two-layer or multilayer printer circuit board method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method |
| 06/15/1993 | US5220491 High packing density module board and electronic device having such module board |
| 06/15/1993 | US5220488 Injection molded printed circuits |
| 06/15/1993 | US5220353 Thermal print head |
| 06/15/1993 | US5220200 Provision of substrate pillars to maintain chip standoff |
| 06/15/1993 | US5220197 Single inline packaged solid state relay with high current density capability |
| 06/15/1993 | US5220135 Printed wiring board having shielding layer |
| 06/15/1993 | US5220105 Mixing with oxidizer, separating oxidizer |
| 06/15/1993 | US5220044 Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films |
| 06/15/1993 | US5219815 Aqueous solution of palladium salt, another precious metal salt, ammonium halide, acid |
| 06/15/1993 | US5219795 Moisture resistance integrated circuit; resilient |
| 06/15/1993 | US5219787 Trenching techniques for forming channels, vias and components in substrates |
| 06/15/1993 | US5219669 Layer thin film wiring process featuring self-alignment of vias |
| 06/15/1993 | US5219655 Relief pattern on flexible sheet; metal layer adhered to recessed portion; printed circuits |
| 06/15/1993 | US5219640 Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof |
| 06/15/1993 | US5219639 Multilayer structure and its fabrication method |
| 06/15/1993 | US5219607 Method of manufacturing printed circuit board |
| 06/15/1993 | US5219484 Acidic solution of ferric nitrate, alkali metal nitrate, nitric acid, chelating agent |
| 06/15/1993 | US5219293 Connection structure of circuit boards having electronic parts thereon and flexible cable for coupling the circuit boards and connection method using the same |
| 06/15/1993 | US5219292 Printed circuit board interconnection |
| 06/15/1993 | US5219117 Method of transferring solder balls onto a semiconductor device |
| 06/15/1993 | US5218979 Method of cleaning printed circuit boards with dimethylcyclooctadienes |