| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/20/1993 | US5229549 Aluminum nitride insulation |
| 07/20/1993 | US5229548 Circuit board having a stamped substrate |
| 07/20/1993 | US5229328 Method for bonding dielectric mounted conductors to semiconductor chip contact pads |
| 07/20/1993 | US5229257 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions |
| 07/20/1993 | US5229252 Photoimageable compositions |
| 07/20/1993 | US5229213 Laminated structure, printed circuits |
| 07/20/1993 | US5229192 Of an addition-condensation copolymer containing an acrylic acid ester, styrene and an amino or phenolic resin, red phosphorous and ammonium polyphosphate |
| 07/20/1993 | US5229169 Metallization of plastic |
| 07/20/1993 | US5229167 Method of forming a film pattern on a substrate |
| 07/20/1993 | US5229070 Low temperature-wetting tin-base solder paste |
| 07/20/1993 | US5229016 Method and apparatus for dispensing spherical-shaped quantities of liquid solder |
| 07/20/1993 | US5228965 Method and apparatus for applying surface treatment to metal foil |
| 07/20/1993 | US5228949 Panels for printed circuits |
| 07/20/1993 | US5228553 Drive mechanism for a conveyor of a printer circuit board processor |
| 07/20/1993 | US5228192 Method of manufacturing a multi-layered ic packaging assembly |
| 07/20/1993 | CA2031865C High-density memory array packaging |
| 07/20/1993 | CA1320550C2 High lamination speed automatic laminator |
| 07/20/1993 | CA1320507C Thermal writing on glass or glass-ceramic substrates and copper-exuding glasses |
| 07/14/1993 | EP0551112A1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same |
| 07/14/1993 | EP0551100A1 Partially crystallizable low melting glass |
| 07/14/1993 | EP0550999A1 A heat-transferring circuit substrate with limited thermal expansion and method for making same |
| 07/14/1993 | EP0550831A1 Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
| 07/14/1993 | EP0550811A1 Wet liminating apparatus |
| 07/14/1993 | EP0550432A1 Improved interconnection structure and test method. |
| 07/14/1993 | CN1074157A Gas shrouded wave soldering |
| 07/14/1993 | CN1074156A Soldering |
| 07/14/1993 | CN1021599C Method of and apparatus for increasing processing speed in scanning inspection of circuit boards and other objects |
| 07/14/1993 | CA2087068A1 Method for applying welding compositions on the pins of electronic components |
| 07/13/1993 | US5227959 Electrical circuit interconnection |
| 07/13/1993 | US5227826 Layer transfer process for image production and apparatus to preform the process |
| 07/13/1993 | US5227812 Liquid jet recording head with bump connector wiring |
| 07/13/1993 | US5227739 Dielectrics of ceramic oxides of barium, silicon, aluminum, strontium and zirconium; electrode films of silver and copper; compact |
| 07/13/1993 | US5227664 Semiconductor device having particular mounting arrangement |
| 07/13/1993 | US5227663 Integral dam and heat sink for semiconductor device assembly |
| 07/13/1993 | US5227604 Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
| 07/13/1993 | US5227589 Plated-through interconnect solder thief |
| 07/13/1993 | US5227588 Interconnection of opposite sides of a circuit board |
| 07/13/1993 | US5227332 Depositing a layer of a material containing a plating catalysts on a substrate; covering material with a dielectric, forming an aperture in dielectri and plating to fill the aperture |
| 07/13/1993 | US5227244 Polyimide film with metal salt coating resulting in improved adhesion |
| 07/13/1993 | US5227223 Electroless deposition of metal in catalytic pattern onto web |
| 07/13/1993 | US5227087 Cleaning printed circuit boards |
| 07/13/1993 | US5227046 Low temperature tin-bismuth electroplating system |
| 07/13/1993 | US5227013 Forming via holes in a multilevel substrate in a single step |
| 07/13/1993 | US5227012 Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors |
| 07/13/1993 | US5227009 Masking sheet and method of producing processed metal product |
| 07/13/1993 | US5227008 Method for making flexible circuits |
| 07/13/1993 | US5226969 No solvent, printed circuit boards |
| 07/13/1993 | US5226964 Vertical solder coating apparatus |
| 07/13/1993 | US5226962 Flux applicator system |
| 07/13/1993 | US5226220 Method of making a strain relief for magnetic device lead wires |
| 07/11/1993 | CA2085653A1 Polyetherimide/dimethylsiloxane copolymer adhesive system for bonding copper foil to polyetherimide flexible films |
| 07/08/1993 | WO1993013638A1 Lamination of a photopolymerizable solder mask layer to a substrate containing holes using an intermediate photopolymerizable liquid layer |
| 07/08/1993 | WO1993013637A1 Multi-layer circuit construction methods and structures with customization features and components for use therein |
| 07/08/1993 | WO1993013248A1 Method of improving the coating of electrolytically treated workpieces, and equipment for carrying out the method |
| 07/08/1993 | WO1993013246A1 Method and composition for cleaning articles |
| 07/08/1993 | DE4200149A1 Circuit board varnishing - using poured curtain of degassed varnish on cooled circuit boards for controlled temp. varnish flow without bubbles |
| 07/08/1993 | CA2126969A1 Method and composition for cleaning articles |
| 07/07/1993 | EP0550176A1 Manufacturing method, including etch-rate monitoring |
| 07/07/1993 | EP0549946A2 Radiation polymerisable mixture and process for the preparation of a solder stop mask |
| 07/07/1993 | EP0549791A1 Multilayer printed circuit board and method of manufacture |
| 07/07/1993 | EP0549619A1 Process for manufacturing circuits. |
| 07/07/1993 | EP0290578B1 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 07/06/1993 | US5226137 Electronic key with multiple password protected sub-keys using address and translation to implement a block data move between public and protected sub-keys |
| 07/06/1993 | US5225966 Conductive adhesive film techniques |
| 07/06/1993 | US5225711 In a reducing atmosphere; inhibits copper oxide formation before fusion and reduces oxides to promote wetting |
| 07/06/1993 | US5225634 Hybrid circuit formed of two circuits whose tracks are connected by electric connection balls |
| 07/06/1993 | US5225358 In single step after transistor fabrication by chemical vapor deposition of oxide or borophosphosilicate glass over wafer |
| 07/06/1993 | US5225315 Printed circuit |
| 07/06/1993 | US5225272 Polymeric film |
| 07/06/1993 | US5225268 Epoxy resin film and method of producing epoxy resin film |
| 07/06/1993 | US5225251 Method for forming layers by UV radiation of aluminum nitride |
| 07/06/1993 | US5225157 Metal liquids and metal powders for wetting and bonding |
| 07/06/1993 | US5224865 Sliding wedge electrical connector |
| 07/06/1993 | US5224265 Fabrication of discrete thin film wiring structures |
| 07/06/1993 | US5224250 Apparatus for manufacturing ceramic capacitors |
| 07/06/1993 | US5224235 Electronic component cleaning apparatus |
| 07/01/1993 | DE4243654A1 Thin integrated circuit card with integral battery - contains circuit board with battery aperture in resin with aperture, connector holding battery in aperture |
| 07/01/1993 | DE4241684A1 Encapsulated housing for semiconductor - has connecting leads bonded to housing with connecting wires embedded within protective material |
| 07/01/1993 | DE4142855A1 Preferentially etching metal coatings on plastic or paper foil - using pulsed laser beam operating in ultraviolet range |
| 06/30/1993 | EP0549527A1 Press-fit terminal |
| 06/30/1993 | EP0549262A1 Method of soldering |
| 06/30/1993 | EP0549160A1 Connector |
| 06/30/1993 | EP0549159A2 Method and adhesive for making electrical and mechanical connections |
| 06/30/1993 | EP0549116A2 Dual curing composition and use thereof |
| 06/30/1993 | EP0548954A2 Bonding apparatus |
| 06/30/1993 | EP0548882A1 Hybrid optical/electrical circuit module |
| 06/30/1993 | EP0548652A1 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/30/1993 | EP0548584A2 Contact device for an electrical component and method for manufacture |
| 06/30/1993 | EP0548496A1 A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint |
| 06/30/1993 | EP0548445A1 Universal surface mount package |
| 06/30/1993 | EP0540640A4 Combined rigid and flexible printed circuits |
| 06/30/1993 | EP0489802A4 Apparatus for cleaning mechanical devices using terpene compounds |
| 06/30/1993 | CN1073822A Processing method of printed-circuit board |
| 06/30/1993 | CN1021448C Photopolymerizable composition having superior adhesion |
| 06/29/1993 | US5224023 Foldable electronic assembly module |
| 06/29/1993 | US5224021 Surface-mount network device |
| 06/29/1993 | US5223965 Electrode connecting device of liquid crystal display element having a protecting film for absorbing stress applied to the electrode at a thermal press-fixing time |
| 06/29/1993 | US5223693 Optical machining apparatus |
| 06/29/1993 | US5223691 Plasma based soldering method requiring no additional heat sources or flux |
| 06/29/1993 | US5223690 Process and apparatus for spot-welding a flexible welding board to a battery cell |