Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1993
08/10/1993US5233895 Magnetic plate punch actuator
08/10/1993US5233754 Method for forming perforations on a printed circuit board
08/10/1993US5233753 Screen printing with paste containing metallization activator, drying, depositing copper layer, then molding thermoplastic resin to back of flexible carrier film
08/06/1993CA2088826A1 Coating agent for plastic films
08/05/1993WO1993015594A1 Method of forming a printed circuit device and apparatus resulting therefrom
08/05/1993WO1993015593A1 Carrier strip head interconnect assembly
08/05/1993WO1993015520A1 Flexible multilayer circuit wiring board
08/05/1993WO1993015474A1 Method of inspecting articles
08/05/1993WO1993015441A1 Process for preparing photohardenable elastomeric element having increased exposure latitude
08/05/1993WO1993015125A1 An energy-polymerizable adhesive, coating, film and process for making the same
08/05/1993DE4208765A1 Elektrischer betriebskasten und herstellungsverfahren Electrical box for operation and manufacturing processes
08/05/1993DE4202481A1 Monitoring temp. for thermal compression during LCD mfr. - measuring thermoelectric voltage between LCD track and printed circuit and using for control
08/05/1993DE4202453A1 Device for forming releasable electric connection - uses press-pin to press solder tracks of component against conductive tracks of base plate via leaf spring
08/05/1993CA2126751A1 An energy-polymerizable adhesive, coating, film and process for making the same
08/04/1993EP0554077A1 Packaging system
08/04/1993EP0554048A1 Solder wave parameters analyzer
08/04/1993EP0554040A2 Photosensitive resin compositions, their preparation and use
08/04/1993EP0553986A1 Electroless coating of resins
08/04/1993EP0553985A1 Electroless coating of resins
08/04/1993EP0553971A2 Curable resins, solutions thereof, processes for making them, and electronic part protective coatings
08/04/1993EP0553718A1 Supporting structure for a vibrator
08/04/1993EP0553676A1 Process for placing components on circuit boards and apparatus to supply soldering flux during placing components on circuit boards
08/04/1993EP0553671A1 Process for making through hole connections in double layered circuit boards and multilayers
08/04/1993EP0553612A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
08/04/1993EP0553477A2 Printed circuit board to be equipped with components
08/04/1993EP0553350A1 Equipment for working printed circuit board
08/04/1993EP0553208A1 Method and composition for cleaning articles.
08/04/1993EP0528027A4 Method and apparatus for forming contacts
08/04/1993EP0522026A4 Solder delivery system
08/04/1993EP0351413B1 Method and apparatus for production of three-dimensional objects by photosolidification
08/04/1993EP0252139B1 A process and apparatus for electroplating copper foil
08/04/1993CN2139765Y Punching and hole filling device for cylinder printed circuit board
08/04/1993CN1075050A Attaching integrated circuits to circuit boards
08/03/1993US5233536 Method and apparatus for perforating a printed circuit board
08/03/1993US5233504 Noncollapsing multisolder interconnection
08/03/1993US5233452 Liquid crystal display device having a molding agent including glass fibers therein
08/03/1993US5233221 Electronic substrate multiple location conductor attachment technology
08/03/1993US5233157 Laser pattern ablation of fine line circuitry masters
08/03/1993US5233152 Robotic laser soldering apparatus for automated surface assembly of microscopic components
08/03/1993US5233133 Coaxial conductor interconnection wiring board
08/03/1993US5233067 Silane coupling agent for improved adhesion
08/03/1993US5232815 Corrosion resistance
08/03/1993US5232765 Distributed constant circuit board using ceramic substrate material
08/03/1993US5232758 Mixture of alkylbenzenesulfonate, carrier and solvent
08/03/1993US5232736 Automatic process control having a stencil and a blade for measuring, evaluating the applied solders paste
08/03/1993US5232651 Method of sealing electric parts mounted on electric wiring board with resin composition
08/03/1993US5232562 Electrochemical reduction treatment for soldering
08/03/1993US5232548 Patterning, encapsulating foil; metallizing, capping, joining; integrated circuits
08/03/1993US5232501 Apparatus for processing printed circuit board substrates
08/03/1993US5232379 Connector with mounting means for SMT
08/03/1993US5232145 Method of soldering in a controlled-convection surface-mount reflow furnace
08/03/1993US5231885 Method for checking multilayer printed wiring board
08/03/1993US5231757 Method for forming the multi-layer structure of a connection board of at least one very large scale integrated circuit
08/03/1993US5231751 Process for thin film interconnect
08/03/1993CA1320898C Compositions useful in copper oxidation, and a method to prepare copper oxidation solutions
08/03/1993CA1320828C Aligning
08/01/1993CA2088016A1 Solder wave parameters analyzer
07/1993
07/29/1993DE4301728A1 Printed circuit board used in electronic switches - comprises solder contact metal layer contg. two metals
07/29/1993DE4301692A1 Electrically connecting together 2-printed type circuit boards - by e.g. applying circuit of conducting thermoplastics to two insulating sheets, ultrasonically bonding them together under pressure and cooling
07/29/1993DE4301577A1 Dispenser for dispensing viscous liquid - has piston with elastically deformable rear end to provide close fit in cylinder
07/29/1993DE4241839A1 Cryogenic opt. partial metallisation process - involves UV irradiation of chemical cpd. layer on cold substrate
07/29/1993DE4201759A1 Insulation process for electrical or optical fibre cables, e.g. for vehicles - has control system to add material or alter wire speed according to measured dia. and insulation resistance
07/29/1993DE4201612A1 Inserting galvanic metals or alloys into glass or glass ceramic bodies - by applying metal substrate and filling holes in bodies with metal or alloys
07/29/1993DE4138779A1 Contacting integrated circuit on flexible circuit board, glass or ceramic substrate - fixing IC using organic resin which contains highly conductive particles with irregular structure
07/28/1993EP0552984A2 Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials
07/28/1993EP0552935A2 A method of determining routes for a plurality of wiring connections and a circuit board produced by such a method
07/28/1993EP0552830A1 Process for improving the adhesion between different layers in the fabrication of laminated printed circuits, and compositions for carrying out this process
07/28/1993EP0552286A1 Ternary azeotropic compositions of 43-10mee (cf 3?chfchfcf 2?cf 3?) and trans 1,2-dichloroethylene with methanol or ethanol.
07/28/1993EP0552252A1 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions.
07/28/1993EP0552251A1 Improved ablation-transfer imaging/recording
07/28/1993EP0552225A1 Binary azeotropic compositions of (cf 3?chfchfcf 2?cf 3?) with methanol or ethanol or isopropanol.
07/27/1993US5231560 Auto-insertable component
07/27/1993US5231259 Radiation manufacturing apparatus
07/27/1993US5230984 Positive type photosensitive anionic electrodeposition coating resin composition
07/27/1993US5230970 Radiation of an organometallic material on a substrate for reaction to form oxide
07/27/1993US5230965 High density interconnect with electroplated conductors
07/27/1993US5230932 Chromium-zinc anti-tarnish coating for copper foil
07/27/1993US5230928 Electroless plating method
07/27/1993US5230927 Method for metal-plating resin molded articles and metal-plated resin molded articles
07/27/1993US5230924 Metallized coatings on ceramics for high-temperature uses
07/27/1993US5230788 Insulated metal substrates and process for the production thereof
07/27/1993US5230685 Machine tool for machining printed circuit boards
07/27/1993US5230638 Surface mounted electrical connector for printed circuit boards
07/22/1993WO1993014516A1 Flexible circuit wiring board, and its manufacture
07/22/1993WO1993014444A1 Method and device for coating circuit boards
07/22/1993WO1993013903A1 Method of brazing
07/22/1993WO1992015404A1 Powder coating method for producing circuit board laminae and the like
07/22/1993DE4243252A1 Device for holding printed circuit boards - allowing vertical boards to be loaded in horizontal direction into a carrier frame, esp. for dipping into galvanic bath
07/22/1993DE4201475A1 Stack holder for plates of different format for ventilating and drying - loads plates onto and off each level via loading and unloading belts according to process sequence
07/22/1993CA2104666A1 Soldering method
07/22/1993CA2104234A1 Powder coating method for producing circuit board laminae and the like
07/22/1993CA2085679A1 Adhesion of electroless coatings to resinous articles
07/22/1993CA2085678A1 Adhesion of electroless coatings to resinous articles by treatment with permanganate
07/21/1993EP0552096A1 Method for applying a solder composition to the leads of electronic components
07/21/1993EP0551747A1 Polyetherimide flexible films
07/21/1993EP0551529A1 Method for replacing chips
07/21/1993EP0551328A1 Piezoelectric component-mounting foil and foil-making method
07/20/1993US5229641 Semiconductor card and manufacturing method therefor
07/20/1993US5229640 Surface mountable clock oscillator module
07/20/1993US5229550 Encapsulated circuitized power core alignment and lamination