Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1993
08/25/1993EP0556550A2 Ceramic chip carrier with lead frame or edge clip
08/25/1993EP0556351A1 SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS.
08/25/1993EP0556185A1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester.
08/25/1993EP0556184A1 Circuit board with electrical components, in particular surface-mounted devices.
08/25/1993EP0420850B1 Sensitizing activator for chemical plating
08/25/1993EP0380620B1 Flexible coaxial cable and method for manufacturing the same
08/25/1993EP0258444B1 Semiconductor device
08/25/1993CN1075589A Method for forming a printed circuit device and apparatus resluting therefrom
08/25/1993CN1021949C Method for direct metallization of conductive boards
08/24/1993US5239448 For providing function in a computer system
08/24/1993US5239447 Stepped electronic device package
08/24/1993US5239199 For a high density array of semiconductor devices
08/24/1993US5239198 Overmolded semiconductor device having solder ball and edge lead connective structure
08/24/1993US5239135 Circuit board fastener
08/24/1993US5239127 Electrical interconnect apparatus
08/24/1993US5238913 Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials
08/24/1993US5238781 Photosensitive compositions based on polyphenols and acetals
08/24/1993US5238709 Electrostatic spray coating method
08/24/1993US5238702 Electrically conductive patterns
08/24/1993US5238554 Protecting bare metal by electrodepositing heat curable polymeric film, heating to make it solvent resistant, removing resist and etching metal
08/24/1993US5238550 Forming tin-noble metal halide colloid on non-conductor surface, reacting with sulfur salt
08/24/1993US5238524 Hole masking apparatus
08/24/1993US5238504 Use of terpene hydrocarbons and ketone blends for electrical contact cleaning
08/24/1993US5238176 Method and apparatus for forming bump
08/24/1993US5238175 Method and apparatus for selective soldering
08/24/1993US5237743 Method of forming a conductive end portion on a flexible circuit member
08/24/1993CA2007180C Method of forming electrically conducting layer
08/24/1993CA1321659C Uses of uniaxially electrically conductive articles
08/22/1993CA2090072A1 Solder powder coated with parylene
08/19/1993WO1993016576A1 Added wiring on printed circuit boards
08/19/1993WO1993016575A1 High density self-aligning conductive networks and contact clusters and method and apparatus for making same
08/19/1993WO1993016574A1 High density conductive networks and method and apparatus for making same
08/19/1993WO1993016488A1 Double layered tab tape and its manufacture
08/19/1993DE4204882A1 Soldering device for surface mounting components with close contacts - positions frame holding components over PCB, then presses component contacts against PCB contacts and solders
08/19/1993DE4204286A1 Electronic surface mounted device mfr. - using only lead frame stamping out and housing moulding stations dependent on size of device being mfd.
08/19/1993DE3943669C2 Vibration device on electrolytic treatment appts.
08/19/1993CA2128210A1 High density conductive networks and method and apparatus for making same
08/19/1993CA2084451A1 Polyimide surfaces having enhanced adhesion
08/18/1993EP0555749A1 Radiation sensitive compositions and processes
08/18/1993EP0555669A1 Screen printing apparatus
08/18/1993EP0555668A1 Printed circuit board for electronical power circuit containing power semiconductors
08/18/1993EP0555667A1 Method and apparatus for screen printing
08/18/1993EP0555576A1 Machining apparatus with rotatable tool carousel having interchangeable magazines and method of using same
08/18/1993EP0555575A1 Method and apparatus for machining printed circuit boards
08/18/1993EP0555407A1 Stacked configuration for integrated circuit devices.
08/18/1993CN1021878C Multi-layer circuit board fabrication process
08/18/1993CN1021877C Soldering apparatus
08/18/1993CN1021876C Method for making multilayer circuit using embedded catalyst receptor
08/18/1993CN1021875C Conductive pattern producing method
08/18/1993CN1021874C Method of patterning resist for printed wiring boards
08/17/1993US5237488 Portable computer with display unit connected to system unit through conducting hinge
08/17/1993US5237269 Connections between circuit chips and a temporary carrier for use in burn-in tests
08/17/1993US5237132 Metallic printed circuit board with countersunk mounting hole
08/17/1993US5237130 Flip chip technology using electrically conductive polymers and dielectrics
08/17/1993US5236810 Forming positive photosensitive photoresist film, irradiation with actinic radiation, development, etching
08/17/1993US5236809 Photopolymerizable resin composition employing (meth)acrylonitrile in the linear copolymer to impart additional flexibility of the composition
08/17/1993US5236772 Circuit board and process for producing same
08/17/1993US5236746 Applying free-falling photopolymerizable substance to metal substrate;photoresists on printed circuit
08/17/1993US5236736 Method for manufacturing an electromagnetic wave shield printed wiring board
08/17/1993US5236636 In-mold plasma treatment
08/17/1993US5236631 Rubber composition for anisotropically electroconductive membrane
08/17/1993US5236602 Exposure to ultraviolet radiation
08/17/1993US5236552 Exposing to mixture of fluoro-containing organic acid, corrosion inhibitor, amide solvent
08/17/1993US5236551 Termination of metallization
08/17/1993US5236372 No-insertion force connector assembly
08/17/1993US5236117 Impact solder method and apparatus
08/17/1993US5235741 Electrical connection and method for making the same
08/17/1993US5235740 Press with pin detection for interference connectors
08/17/1993US5235736 Printed circuit board
08/17/1993CA2033699C Electronic part with heat radiating member
08/17/1993CA2010306C Connecting apparatus
08/17/1993CA2004231C Conducting material and a method of fabricating thereof
08/17/1993CA1321335C Dibasic esters for cleaning electronic circuits
08/12/1993DE4303395A1 Magnetoresistive position detector with optional output characteristic - has single circuit board incorporating reversing module for optional selection of output characteristic
08/11/1993EP0554798A2 Coating for plastic foils
08/11/1993EP0487640A4 Capacitor laminate for printed circuit board
08/11/1993EP0453559B1 Method for manufacturing a soldered article
08/11/1993EP0441809B1 Method for effecting solder interconnects
08/11/1993EP0385979B1 High-density electronic modules, process and product
08/11/1993EP0307407B1 Solder leveller
08/10/1993US5235496 Device for packaging integrated circuits
08/10/1993US5235154 Laser removal of metal interconnects
08/10/1993US5235140 Electrode bump for flip chip die attachment
08/10/1993US5235139 Conductive surface comprising copper, a first coating of nickel, cobalt, boron, or alloys, and a nickel-phosphorus or cobalt-phosphorus coating, and a second coating of protective metal
08/10/1993US5234970 Dual curing composition based on isocyanate trimer and use thereof
08/10/1993US5234868 Method for determining planarization endpoint during chemical-mechanical polishing
08/10/1993US5234745 Method of forming an insulating layer on a printed circuit board
08/10/1993US5234655 Method of forming a mold
08/10/1993US5234636 Methods of coating stereolithographic parts
08/10/1993US5234573 Method of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boards
08/10/1993US5234558 Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste
08/10/1993US5234542 Aqueous solution of sulfuric acid and one member selected from inorganic nitrate and nitric acid or mixtures thereof
08/10/1993US5234539 Using intermediate layer material having low adhesive interface with metal layer, applying stress to detach metal, chemically removing intermediate layer
08/10/1993US5234536 Process for the manufacture of an interconnect circuit
08/10/1993US5234522 Method of producing flexible printed-circuit board covered with coverlay
08/10/1993US5234506 Aqueous electronic circuit assembly cleaner and method
08/10/1993US5234505 Removing soldering flux from printed circuits with aqueous solution of alkaline salt, alkali metal silicate, anionic polymer which prevents precipitation
08/10/1993US5234151 Sensing of solder melting and solidification
08/10/1993US5234149 Debondable metallic bonding method
08/10/1993US5234105 Packages for circuit boards for preventing oxidation thereof