Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1993
09/14/1993US5244840 Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
09/14/1993US5244833 Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer
09/14/1993US5244539 Nitric acid, source of ferric ions, halide ions, ammonium ions
09/14/1993US5244538 Method of patterning metal on a substrate using direct-write deposition of a mask
09/14/1993US5244507 Chlorobenzotrifluorides, printed circuits
09/14/1993US5244413 Retaining arrangement for a connector housing
09/14/1993US5244395 Circuit interconnect system
09/14/1993US5244378 Apparatus for dynamic gating of polymers for producing molded articles with isotropic properties
09/14/1993US5244143 Apparatus and method for injection molding solder and applications thereof
09/14/1993US5244000 Method and system for removing contaminants
09/14/1993US5243753 Printed circuit assembly machine
09/14/1993CA1322083C Multiaxially oriented thermotropic polymer substrate for printed wire board
09/13/1993CA2073783A1 Elastomeric metallized fabric and process to make the same
09/09/1993DE4208594A1 Prefabricated electrical component fixing to PCB - serially mfg. unitary circuits for selective imposition on regions of circuit board requiring rectification or extension
09/08/1993EP0559385A1 Work table orientation apparatus and method
09/08/1993EP0559384A2 Devices with tape automated bonding
09/08/1993EP0559379A1 Composition and method for stripping tin or tin-lead alloy from copper surfaces
09/08/1993EP0558781A1 Method and apparatus for exposure of substrates
09/08/1993EP0558539A1 A method of coating printed circuit boards
09/08/1993EP0558537A1 Ovens for treating lamellae
09/08/1993EP0290598B1 Ceramic/organic multilayer interconnection board
09/08/1993CN1075988A 多元溶剂清洗系统 Multiple solvent cleaning system
09/07/1993US5243547 Limiting parasitic signal coupling between conductors
09/07/1993US5243320 Resistive metal layers and method for making same
09/07/1993US5243144 Wiring board and process for producing the same
09/07/1993US5243143 Solder snap bar
09/07/1993US5243142 Printed wiring board and process for producing the same
09/07/1993US5243133 Ceramic chip carrier with lead frame or edge clip
09/07/1993US5243130 Housing provided with conductive wires therein
09/07/1993US5242715 Cationically hardening solvent-free epoxy resins by heat or uv rad
09/07/1993US5242713 Metallizing polyimide film
09/07/1993US5242642 Method of manufacturing a switch substrate
09/07/1993US5242641 Method for forming filled holes in multi-layer integrated circuit packages
09/07/1993US5242623 Screen-printable thick film paste composition
09/07/1993US5242562 Method and apparatus for forming printed circuits
09/07/1993US5242540 Process for producing thin copper foil-clad circuit board substrate
09/07/1993US5242535 Copper and copper oxides on ceramics formed by reduction of copper oxide and masking
09/07/1993US5242511 Copper alloy compositions
09/07/1993US5242311 Electrical connector header with slip-off positioning cover and method of using same
09/07/1993US5242100 Plated-through interconnect solder thief
09/07/1993US5242097 Integrated preforms
09/07/1993US5242096 Automatic reflow soldering apparatus
09/07/1993CA2026195C Isothermal termination block having a multi-layer thermal conductor
09/07/1993CA1321875C Use of a thermal transfer printer for producing a photomask
09/02/1993WO1993017457A1 Substrate for mounting semiconductor and method of producing the same
09/02/1993WO1993017368A1 Pliable, aqueous processable, photoimageable permanent coatings for printed circuits
09/02/1993WO1993017153A1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process
09/02/1993WO1993016841A1 Tool changer
09/02/1993WO1993016812A1 Ultrasonic spray coating system and method
09/02/1993DE4206673A1 Illuminating system providing collimated light for exposure of photosensitive layer - has mirrors and lens system to direct parallel light beams to selected areas of, e.g. photolacquer coating of PCB
09/01/1993EP0558439A1 Solder pump bushing seal
09/01/1993EP0558325A1 Raised feature on substrate for flip chip interconnection
09/01/1993EP0558114A2 Method and apparatus for applying and curing a coating on a circuit board
09/01/1993EP0557952A1 Plating method and cylindrical coil obtained thereby
09/01/1993EP0557883A1 Laminated electronic module assembly
09/01/1993EP0557812A2 Printed circuit substrate with projected electrode and connection method
09/01/1993EP0557756A1 Method for soldering printed circuit boards
09/01/1993EP0557363A1 Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same
09/01/1993EP0557278A1 A method of making a multilayer thin film structure.
09/01/1993EP0552225A4 Binary azeotropic compositions of (cf 3?chfchfcf 2?cf 3?) with methanol or ethanol or isopropanol
09/01/1993EP0500525B1 Device for drilling printed circuit boards
09/01/1993EP0455714B1 A method of manufacturing a substrate for placement of electrical and/or electronic components
09/01/1993EP0360811B1 Solder connector device
09/01/1993CN1075825A Method and compositions for diffusion patterning
08/1993
08/31/1993US5241454 Mutlilayered flexible circuit package
08/31/1993US5241216 Ceramic-to-conducting-lead hermetic seal
08/31/1993US5241145 Operation device for electronic apparatus
08/31/1993US5241137 Flexible circuit board with an electrically insulating adhesive layer
08/31/1993US5241134 Terminals of surface mount components
08/31/1993US5241040 Microwave processing
08/31/1993US5240817 Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer
08/31/1993US5240761 Electrically conductive adhesive tape
08/31/1993US5240746 System for performing related operations on workpieces
08/31/1993US5240738 Method of applying solder to a flexible circuit
08/31/1993US5240737 Method of manufacturing printed circuit boards
08/31/1993US5240671 Method of forming recessed patterns in insulating substrates
08/31/1993US5240588 Method for electroplating the lead pins of a semiconductor device pin grid array package
08/31/1993US5240551 Preparing circuit pattern, connected by bridges, on a ceramic bonding circuit pattern to base and removing bridges by etching
08/31/1993US5240497 Alkaline free electroless deposition
08/31/1993US5240422 Connector
08/31/1993US5240421 Connector
08/31/1993US5240170 Method for bonding lead of IC component with electrode
08/31/1993US5240169 Gas shrouded wave soldering with gas knife
08/31/1993US5240018 Apparatus for cleaning mechanical devices using terpene compounds
08/31/1993US5239863 Cantilever stylus for use in an atomic force microscope and method of making same
08/31/1993US5239746 Method of fabricating electronic circuits
08/29/1993CA2089719A1 Automatic vertical dip coater with simultaneous ultraviolet cure
08/28/1993CA2090579A1 Stencil for use in the application of a viscous substance to a printed circuit board or the like
08/26/1993DE4218353A1 Method for mounting component onto PCB - involves holding pins in V=shaped recesses in slider to centre them over PCB before pushing them into apertures
08/26/1993DE4205944A1 Method of adjusting relative positions of mask film and circuit board - involves adjusting positions of film and board with absolute coordination systems so each can be moved in same plane independently
08/26/1993DE4205190A1 Conditioning medium for substrate before metallisation - by using bath contg. specified amt. of an hetero:aromatic cpd., crosslinker, pH regulator and/or water miscible solvent
08/25/1993EP0557227A2 Method and apparatus for inspecting a printed circuit board
08/25/1993EP0557138A2 Direct imaging process for forming resist pattern on a surface, and use thereof in fabricating printed circuit boards
08/25/1993EP0557136A2 System for measuring misregistration
08/25/1993EP0557081A1 Printed circuit board
08/25/1993EP0557073A1 Copper foil for printed circuits and process for producing the same
08/25/1993EP0556888A2 Large ceramic article and method of manufacturing
08/25/1993EP0556864A1 Solder powder coated with parylene
08/25/1993EP0556790A1 Polyimide surfaces having enhanced adhesion
08/25/1993EP0556591A1 Printer using an array of deformable mirror devices (DMD)